Page 3 - Contents
Contents 3 Contents Customer self repair ...................................................................................................................... 5 Parts only warranty service .................................................................................................................
Page 5 - Customer self repair
Customer self repair 5 Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identif...
Page 6 - Riparazione da parte del cliente
Customer self repair 6 Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. Facultatif - Pièces pour lesquelles la réparation par le client est facult...
Page 7 - Customer Self Repair
Customer self repair 7 In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richie...
Page 8 - ausschließlich für Teile); Reparaciones del propio cliente
Customer self repair 8 defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Customer Self Repair P...
Page 10 - Reparo feito pelo cliente
Customer self repair 10 Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website
Page 16 - Illustrated parts catalog; Mechanical components
Illustrated parts catalog 16 Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5 ) 1 Plastics kit 591209-001 — a) Bezel — Mandatory 1 b) PCI card retainer* — Mandatory 1 c) Bezel assembly, power and Systems Insight Display — Mandatory 1 ...
Page 19 - System components
Illustrated parts catalog 19 System components Item Description Spare part number Customer self repair (on page 5 ) 6 Power supplies — — a) 1200 W, 90% 498152-001 Mandatory 1 b) 1200 W, 94%* 579229-001 Mandatory 1 7 Fan, 92-mm, hot-plug 591208-001 Mandatory 1 8 Processor — — a) Intel Xeon X7560 proc...
Page 25 - Removal and replacement procedures; Required tools; Preventing electrostatic discharge; Preparation procedures
Removal and replacement procedures 25 Removal and replacement procedures Required tools You need the following items for some procedures: • Torx T-15 screwdriver (provided with the server) • Phillips screwdriver • Flathead screwdriver • Diagnostics Utility Safety considerations Before performing ser...
Page 26 - Power down the server
Removal and replacement procedures 26 • Remove the server from the rack (on page 27 ). If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack. • Remove the access panel (on page 28 ). If you are servicing interna...
Page 27 - Remove the server from the rack
Removal and replacement procedures 27 2. Extend the server on the rack rails until the server rail-release latches engage. 3. After performing the installation or maintenance procedure, slide the server into the rack by pressing the server rail-release latches. Remove the server from the rack WARNIN...
Page 28 - Remove the access panel
Removal and replacement procedures 28 2. Remove the following components to reduce the weight of the server: o Processor memory drawer (" Remove the processor memory drawer " on page 29 ) o Hard drives (" SAS/SATA hard drive " on page 30 ) o Power supplies (" Hot-plug power suppl...
Page 30 - Remove the SPI board
Removal and replacement procedures 30 To replace the component, reverse the removal procedure. Remove the SPI board To remove the component: 1. Power off the server. 2. Extend the server from the rack (on page 26 ). 3. Remove the access panel (on page 28 ). 4. Disconnect all cables from the SPI boar...
Page 31 - Heatsink
Removal and replacement procedures 31 3. Remove the hard drive. To replace the component, reverse the removal procedure. Heatsink To remove the component: 1. Power down the server (on page 26 ). 2. Remove the processor memory drawer shipping screws, if installed. Retain the screws for future use (...
Page 33 - Processor
Removal and replacement procedures 33 2. Remove the heatsink protective cover. 3. Install the heatsink. 4. Close and lock the processor retaining bracket. 5. Install the processor memory drawer cover. 6. Install the processor memory drawer. 7. Power up the server. Processor
Page 40 - Memory cartridge
Removal and replacement procedures 40 6. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. 7. Install the heatsink. 8. Close and lock the processor retaining bracket. 9. Install the processor memory drawer cover. 10. Install the processor memory d...
Page 43 - DIMMs
Removal and replacement procedures 43 b. Install the DIMM. 2. Close the memory cartridge cover. 3. Install the memory cartridge. 4. Install the processor memory drawer cover. 5. Install the processor memory drawer. 6. Power up the server. DIMMs To remove the component: 1. Power down the server (on p...
Page 47 - Power supply blank; Hot-plug power supply
Removal and replacement procedures 47 Power supply blank Remove the component as indicated. To replace the component, reverse the removal procedure. Hot-plug power supply The server supports up to four hot-plug power supplies. Install all power supplies to provide full redundancy. HP recommends inst...
Page 48 - Systems Insight Display assembly
Removal and replacement procedures 48 2. Remove the failed power supply. To replace the component, reverse the removal procedure. Systems Insight Display assembly CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped. To remove the co...
Page 53 - Solid state drive
Removal and replacement procedures 53 3. Remove the access panel (on page 28 ). 4. Disconnect the cable from the rear of the DVD-ROM drive. 5. Remove the DVD-ROM drive. To replace the component, reverse the removal procedure. Solid state drive To remove the component: 1. Power down the server (on pa...
Page 54 - Expansion slot cover
Removal and replacement procedures 54 To replace the component, reverse the removal procedure. Expansion slot cover CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all expansion slots have either an expansion slot cover or an expansion board installed. 1. Po...
Page 56 - Battery-backed write cache procedures; Removing the BBWC cache module
Removal and replacement procedures 56 7. Remove the expansion board. To replace the component, reverse the removal procedure. Battery-backed write cache procedures Two types of procedures are provided for the BBWC option: • Removal and replacement of failed components: o Removing the cache module (&...
Page 57 - Removing the BBWC battery pack
Removal and replacement procedures 57 4. If the existing cache is connected to a battery, observe the BBWC Status LED (" Battery pack LEDs " on page 85 ). o If the LED is flashing every 2 seconds, data is still trapped in the cache. Restore system power, and then repeat the previous steps. o...
Page 58 - Recovering data from the battery-backed write cache
Removal and replacement procedures 58 o If the LED is not illuminated, disconnect the battery cable from the cache. 5. Disconnect the cable. 6. Remove the battery pack. The SPI board is removed for clarity. To replace the component, reverse the removal procedure. Recovering data from the battery-bac...
Page 59 - Flash-backed write cache procedures; Removing the FBWC cache module
Removal and replacement procedures 59 o If the server has failed, remove the controller, cache module (" Removing the BBWC cache module " on page 56 ), and battery pack (" Removing the BBWC battery pack " on page 57 ) from the failed server, and install the controller, cache module, ...
Page 60 - Removing the FBWC capacitor pack
Removal and replacement procedures 60 5. Disconnect the cable. 6. Remove the SPI board (on page 30 ). 7. Open the cache slot latches. 8. Remove the cache module. To replace the component, reverse the removal procedure. Removing the FBWC capacitor pack CAUTION: After the server is powered down, wait ...
Page 62 - Battery
Removal and replacement procedures 62 Battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an al...
Page 65 - SAS backplane
Removal and replacement procedures 65 SAS backplane To remove the component: 1. Power down the server (on page 26 ). 2. Extend the server from the rack (on page 26 ). 3. Remove the access panel (on page 28 ). 4. Remove all hard drives (" SAS/SATA hard drive " on page 30 ). 5. Disconnect all ...
Page 66 - HP Trusted Platform Module
Removal and replacement procedures 66 8. Remove the backplane. To replace the component, reverse the removal procedure. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security riv...
Page 67 - Diagnostic tools; Troubleshooting resources; SmartStart software; SmartStart Scripting Toolkit
Diagnostic tools 67 Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software main...
Page 68 - HP Insight Remote Support software; Option ROM Configuration for Arrays
Diagnostic tools 68 support ProLiant BL, ML, DL, and SL servers. The toolkit includes a modular set of utilities and important documentation that describes how to apply these tools to build an automated server deployment process. The Scripting Toolkit provides a flexible way to create standard serve...
Page 69 - HP ROM-Based Setup Utility; ROMPaq utility; Integrated Management Log
Diagnostic tools 69 For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant Servers User Guide on the HP website
Page 70 - Insight Lights-Out 3 technology; Automatic Server Recovery
Diagnostic tools 70 For more information, see the Management CD or DVD in the HP Insight Foundation suite for ProLiant. Insight Lights-Out 3 technology The iLO 3 subsystem is a standard component of selected ProLiant servers that provides server health and remote server manageability. The iLO 3 subs...
Page 71 - HP Insight Diagnostics survey functionality
Diagnostic tools 71 HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft® Windows® and Linux versions, the utility helps to ensure proper system operation. For more in...
Page 72 - Component identification; Front panel components
Component identification 72 Component identification Front panel components Item Description 1 Serial and PID tag 2 Optical drive 3 Systems Insight Display 4 USB connectors (2) 5 Video connector 6 Processor memory drawer
Page 73 - Front panel LEDs and buttons
Component identification 73 Front panel LEDs and buttons Item Description Status 1 UID button and LED Blue—Activated Blue (flashing)—Server being managed remotely Off—Deactivated 2 Health LED Green—Normal (system on) Amber (flashing)—Internal system health degraded Red (flashing)—Internal system hea...
Page 74 - Systems Insight Display
Component identification 74 Systems Insight Display The Systems Insight Display LEDs represent the server and component layout. LED Description AMP status Off—No protection Green—Protection enabled Amber—Memory failure occurred Amber (flashing)—Memory configuration error Health Green—Normal (system ...
Page 75 - Rear panel components
Component identification 75 Rear panel components Item Description Item Description 1 Power supply bay 4 (optional) 15 Expansion slot 2 (optional) 2 Power supply bay 3 (optional) 16 Expansion slot 3 (optional) 3 Power supply bay 2 17 Expansion slot 4 (optional) 4 Power supply bay 1 18 Expansion slot...
Page 76 - Rear panel LEDs and buttons
Component identification 76 Rear panel LEDs and buttons Item Description LED color Status 1 iLO 3 NIC Activity LED Green On or flashing—Network activity Off—No network activity 2 iLO 3 NIC Link LED Green On—Linked to network Off—Not linked to network 3 NIC 2 Activity LED Green On or flashing—Network...
Page 77 - Power supply LED
Component identification 77 Power supply LED Power LED Status Off No AC power to power supply units Green AC is present. Standby output is on, output is disabled. Green AC is present. Standby output is on, power supply DC output is on and OK. Off Power supply failure (includes overvoltage and overte...
Page 78 - System board components
Component identification 78 System board components Item Description 1 Optional I/O expansion board connectors: • PCI-X/PCI Express I/O expansion board • PCI Express I/O expansion board 2 Slot 7 PCIe2 x8 (4, 2, 1) 3 Slot 8 PCIe2 x8 (4, 2, 1) 4 Slot 9 PCIe2 x16 (8, 4, 2, 1) 5 Slot 10 PCIe2 x8 (4, 2, ...
Page 79 - System maintenance switch; NMI jumper
Component identification 79 System maintenance switch The system maintenance switch (SW1) is an eight-position switch that is used for system configuration. The default position for all eight positions is Off. Position Description Function S1 iLO 3 security Off = iLO 3 security is enabled. On = iLO ...
Page 80 - SPI board components
Component identification 80 SPI board components Item Description 1 Mini-SAS connectors (2) 2 SAS cache connector 3 TPM connector 4 Fan data connector 5 RMII connector 6 SD card slot 7 Battery 8 10Gb NIC connector* 9 NIC cache connector* 10 NIC 3 connector 11 NIC 1 connector 12 Video connector 13 Ke...
Page 81 - I/O expansion board components
Component identification 81 I/O expansion board components • PCI-X/PCI Express I/O expansion board Item Description 1 Slot 6 PCIe2 x16 (16, 8, 4, 2, 1) 2 Slot 4 PCIe2 x8 (4, 2, 1)* 3 Slot 3 PCIe2 x16 (16, 8, 4, 2, 1) 4 Slot 2 PCI-X 5 Slot 1 PCI-X *Slot 4 is physically a x8 slot but operates electric...
Page 82 - Processors and memory cartridges
Component identification 82 **Slots 2, 3, 5 and 6 are physically x16 slots but operate electrically as x8 slots. Processors and memory cartridges The processor memory drawer contains 4 processor sockets and 8 memory cartridges. For DIMM numbering and installation guidelines, see the server user guid...
Page 83 - DIMM slot locations
Component identification 83 DIMM slot locations Each memory module contains 8 DIMM slots. The paired banks are identified by the letters A through D. Device numbers
Page 84 - Hard drive LEDs; Hard drive LED combinations
Component identification 84 Hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) Hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating amber and blue The drive has failed, or a predictive failu...
Page 88 - Fan locations
Component identification 88 Fan locations Power supply backplane components
Page 90 - Cabling; DVD-ROM drive cabling
Page 91 - Specifications; Environmental specifications; Server specifications
Specifications 91 Specifications Environmental specifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 70 ° C (-40 ° F to 158 ° F) Maximum wet bulb temperature 28 ° C (82.4 ° F) Relative humidity (noncondensing)** Operating 10% to 90% N...
Page 92 - Acronyms and abbreviations
Acronyms and abbreviations 92 Acronyms and abbreviations ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache FBWC flash-backed write cache iLO 3 Integrated Lights-Out 3 IML Integrated Management Log NVRAM nonvolatile memory ORCA Option ROM Configuration for Arrays PCIe p...
Page 94 - Documentation feedback
Documentation feedback 94 Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback
Page 95 - Index
Index 95 A access panel 28 ASR (Automatic Server Recovery) 70 Automatic Server Recovery (ASR) 70 B backplane, hard drive 65 backplane, power 65 backplane, SAS 65 battery 19, 62, 80 battery pack LEDs 85 battery-backed write cache (BBWC) 19, 56, 57, 58, 80, 85 battery-backed write cache battery pack 1...