HP A005 - Manuals

2 3.0 Die Attach Procedure Different die attach procedures are used for silicon chips and GaAsdevices. To die attach a silicon chip, the chip and mounting surface areheated sufficiently for the gold of the mounting surface to mix with thegold backside of the chip and melt into the silicon of the chi...

3 3.2.4 Pick up a chip with tweezers ( EREM type 5 SA recommended) and orient it properly prior to placement on the heated surface. 3.2.5 Place the chip on the heated surface and scrub with a back-and-forth motion being careful not to scratch the top surface of the chip.Continue this until wetting o...

4 4.2 Thermocompression Wedge Bonding In circuits where there is good access to the transistor chip bondingpads and to the circuit elements to which the chip bonds run, a varietyof wedge bonders, including many new semi-automatic units, can beused. In situations where horizontal access is very limit...