HP DL365 - Manual

Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei...

Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müs...

Customer self repair 9 Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolve...

Customer self repair 10 periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten i...

Customer self repair 11 Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP ( http://www.hp.com/go/selfrepair ). Serviço de garantia apenas para peças A garantia lim...

Illustrated parts catalog 16 Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5 ) 1 Access panel 431360-001 Mandatory 1 2 Miscellaneous hardware kit 431359-001 Mandatory 1 a) Optical device blank* — — b) Air baffle — — c) HP Smart Array...

Illustrated parts catalog 19 System components Item Description Spare part number Customer self repair (on page 5 ) 7 System fan module 412212-001 Mandatory 1 8 Hot-plug power supply, 700-W 412211-001 Mandatory 1 9 PCIe riser board assembly 412200-001 Mandatory 1 10 Processor — — a) 1.8-GHz, 95-W AM...

Removal and replacement procedures 23 Removal and replacement procedures Required tools You need the following items for some procedures: • T-10 Torx screwdriver • T-15 Torx screwdriver • Diagnostics Utility Safety considerations Before performing service procedures, review all the safety informatio...

Removal and replacement procedures 24 This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason. WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. This symbol on an RJ-45...

Removal and replacement procedures 25 Preparation procedures To access some components and perform certain service procedures, you must perform one or more of the following procedures: • Extend the server from the rack (on page 25 ). If you are performing service procedures in an HP, Compaq branded,...

Removal and replacement procedures 26 IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server. 1. Back up the server data. 2. Shut down the operating system as directed by the operating system documentation. 3. If the server is installed in a rack, press the UID LED ...

Removal and replacement procedures 28 6. Remove the T-10 Torx screws located on the sides of the bezel. 7. Gently push on the two tabs located at the top of the bezel 8. Rotate the bezel away from the server and remove the bezel. To replace the component, reverse the removal procedure. Hard drive be...

Removal and replacement procedures 29 2. Remove the hard drive bezel blank. To replace the component, reverse the removal procedure. Hot-plug power supply WARNING: To reduce the risk of electric shock, do not disassemble the power supply or attempt to repair it. Replace it only with the specified sp...

Removal and replacement procedures 30 3. Remove the power supply. To replace the component, reverse the removal procedure. Power supply blank Remove the component as indicated. To replace the component, reverse the removal procedure. Access panel WARNING: To reduce the risk of personal injury from h...

Removal and replacement procedures 31 CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. To remove the component: 1. Power down the server if ...

Removal and replacement procedures 32 To remove the component: 1. Power down the server (on page 25 ). 2. Extend or remove the server from the rack (" Extend the server from the rack " on page 25 , " Remove the server from the rack " on page 26 ). 3. Remove the access panel (" Ac...

Removal and replacement procedures 33 o HP Smart Array E200i battery tray o HP Smart Array P400i battery tray To replace the component, reverse the removal procedure. Battery pack CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an arra...

Removal and replacement procedures 34 3. Remove the access panel (" Access panel " on page 30 ). 4. Remove the air baffle (" Air baffle " on page 31 ). 5. Remove fan module 2 (" Fan module " on page 31 ). 6. Remove the battery tray (" Battery tray " on page 32 ). 7. R...

Removal and replacement procedures 35 NOTE: Access to the ejector button is intentionally restricted. To eject the optical device, push the ejector button with a small flat object such as a key or pen. 2. Eject the device or blank. CAUTION: To prevent improper cooling and thermal damage, do not oper...

Removal and replacement procedures 36 9. Remove the multibay backplane assembly. 10. Remove the multibay backplane board from the assembly. To replace the component, reverse the removal procedure. SAS backplane To remove the component: 1. Power down the server (on page 25 ). 2. Extend or remove the ...

Removal and replacement procedures 37 10. Disconnect the power and data cables from the SAS backplane. 11. Remove the three T-15 Torx screws from the backplane. 12. Remove the backplane. To replace the component, reverse the removal procedure. Systems Insight Display The Systems Insight Display is a...

Removal and replacement procedures 38 4. Remove the front bezel (" Front bezel " on page 27 ). 5. Remove the air baffle (" Air baffle " on page 31 ). 6. Remove fan module 3 (" Fan module " on page 31 ). 7. Remove the multibay backplane assembly (" Multibay backplane assem...

Removal and replacement procedures 39 CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser board assembly. 1. Power down the server (on page 25 ). 2. Extend or remove the server from the rack (&#...

Removal and replacement procedures 40 6. Remove any expansion board installed in the assembly. To replace the component, reverse the removal procedure. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an ex...

Removal and replacement procedures 42 6. Disconnect the backplane power cable from the system board. 7. Turn the quarter-turn fasteners and lift the integrated array controller away from the system board. To replace the component, reverse the removal procedure. DIMMs To remove the component: 1. Powe...

Removal and replacement procedures 43 6. Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink To remove the component: 1. Power down the server (on page 25 ). 2. Extend the server from the rack (on page 25 ). 3. Remove the access panel (" Access panel " on page ...

Removal and replacement procedures 44 1. Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol to evaporate before continuing. 2. Apply new grease to the top of the processor in one of the following patterns to ensure even distribution. CAUTION: The hea...

Removal and replacement procedures 50 15. Install the heatsink. 16. Install the air baffle (" Air baffle " on page 31 ). 17. Install the access panel (" Access panel " on page 30 ). 18. Slide the server into the rack. 19. Power up the server. System battery If the server no longer au...

Removal and replacement procedures 51 5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. For more informati...

Cabling 58 Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website ( ...

Cabling 60 Battery pack cabling • HP Smart Array E200i Controller battery pack cabling

Diagnostic tools 62 Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software main...

Diagnostic tools 63 HP Insight Diagnostics survey functionality HP Insight Diagnostics (on page 64 ) provides survey functionality that gathers critical hardware and software information on ProLiant servers. This functionality supports operating systems that may not be supported by the server. For o...

Diagnostic tools 64 For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack. Automatic Server Recovery ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND, or panic. A system fail-sa...

Diagnostic tools 65 Open Services Event Manager OSEM is a standalone tool that performs real-time reactive and proactive service event filtering, analysis, and notification. The tool gathers event data from SNMP traps or information provided over an HTTP interface and notifies an administrator or HP...

Component identification 66 Component identification Front panel components Item Description 1 Hard drive bay 5 (optional)* 2 Hard drive bay 6 (optional)* 3 Multibay drive bay 4 HP Systems Insight Display 5 USB connector 6 Video connector 7 Hard drive bay 4 8 Hard drive bay 3 9 Hard drive bay 2 10 H...

Component identification 67 Front panel LEDs and buttons Item Description Status 1 Power On/Standby button and system power LED Green = System is on. Amber = System is shut down, but power is still applied. Off = Power cord is not attached, power supply failure has occurred, no power supplies are in...

Component identification 68 Item Description Status 6 NIC 2 link/activity LED Green = Network link exists. Flashing green = Network link and activity exist. Off = No link to network exists. If power is off, the front panel LED is not active. View the LEDs on the RJ-45 connector for status by referri...

Component identification 70 System board components Item Description 1 System battery 2 NMI jumper 3 System maintenance switch (SW1) 4 Internal USB connector 5 Multibay connector 6 Power switch connector 7 DIMM slots (1-4) 8 Fan module 3 connectors 9 Fan module 2 connectors 10 DIMM slots (5-8) 11 Fa...

Component identification 71 System maintenance switch Position Default Function S1 Off Off = iLO 2 security is enabled. On = iLO 2 security is disabled. S2 Off Off = System configuration can be modified. On = System configuration is locked and cannot be modified. S3 Off Reserved S4 Off Reserved S5 O...

Component identification 73 HP Systems Insight Display LED and color Internal health LED color Status PPM failure (amber) Red Integrated PPM has failed. DIMM failure, slot X (amber) Red One or more of the following conditions may exist: • DIMM in slot X has failed. • DIMM in slot X is an unsupported...

Component identification 74 • Six hard drive configuration SAS and SATA hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green)

Component identification 75 SAS and SATA hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating amber and blue The drive has failed, or a predictive failure alert has been received for this drive; it also has been selected b...

Component identification 76 Fan locations Item Description 1 Fan module 1 2 Fan module 2 3 Fan module 3

Specifications 77 Specifications Environmental specifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 70 ° C (-40 ° F to 158 ° F) Maximum wet bulb temperature 28 ° C (82.4 ° F) Relative humidity (noncondensing)** Operating 10% to 90% N...

Specifications 78 Specification Value Rated steady-state power 700 W Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, refer to the HP Enterprise Configurator website ( http://h30099.www3.hp.com/config...

Specifications 79 Specification Value Track-to-track (high/low) 3 ms/6 ms Average (high/low) 169 ms/94 ms Setting time 15 ms Latency average 100 ms Cylinders (high/low) 80/80 Read/write heads 2 CD-ROM drive specifications Specification Value Disk formats CD-ROM (modes 1 and 2); mixed mode (audio and...

Specifications 80 Specification Value Operating conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% DVD-ROM drive specifications Specification Value Disk formats DVD (single and double layer), DVD-5, DVD-9, DVD-10, DVD-R, CD-ROM Mode 1 & 2, CD-DA, CD-XA (Mode 2, Form 1 & 2)...

Specifications 81 Specification Value Operating conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% SAS hard drive specifications Item 36-GB SAS drive 72-GB SAS drive 146-GB SAS drive Capacity 36,420 MB 73,408 MB 146,815 MB Height 25.4 mm (1.0 in) 25.4 mm (1.0 in) 25.4 mm (1.0 in) ...

Acronyms and abbreviations 82 Acronyms and abbreviations ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache DDR double data rate IML Integrated Management Log NIC network interface controller NVRAM non-volatile memory OSEM Open Services Event Manager PCI Express Periphe...

Index 84 A access panel 30 additional information 62 ADU (Array Diagnostic Utility) 62 air baffle 25, 31 array controller, cabling 58, 59 array controller, removing 41 Array Diagnostic Utility (ADU) 62 ASR (Automatic Server Recovery) 64 Automatic Server Recovery (ASR) 64 B backplane, SAS 35 battery ...