Page 2 - Selection Guide; Unit
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 2 of 19 512Kx18 CLK A (18:0) Gen. K K ControlLogic Address Register D [17:0] Re ad Ad d. D ecod e Read Data Reg. RPS WPS Q [17:0] ControlLogic Address Register Reg. Reg. Reg. 18 19 18 36 Write 18 BWS 0 Vref W rite Ad d. D ecod e Data Reg Wr...
Page 3 - Pin Configuration
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 3 of 19 Pin Configuration 165-ball FBGA (13 x 15 x 1.4 mm) Pinout CY7C1303BV25 (1M x 18) 1 2 3 4 5 6 7 8 9 10 11 A NC Gnd/ 144M NC/ 36M WPS BWS 1 K NC RPS A Gnd/ 72M NC B NC Q9 D9 A NC K BWS 0 A NC NC Q8 C NC NC D10 VSS A A A VSS NC Q7 D8 D...
Page 4 - Pin Definitions
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 4 of 19 Pin Definitions Name I/O Description D [x:0] Input- Synchronous Data input signals, sampled on the rising edge of K and K clocks during valid write opera-tions. CY7C1303BV25 – D [17:0] CY7C1306BV25 – D [35:0] WPS Input- Synchronous ...
Page 5 - Introduction
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 5 of 19 Introduction Functional Overview The CY7C1303BV25/CY7C1306BV25 are synchronouspipelined Burst SRAM equipped with both a Read port and aWrite port. The Read port is dedicated to Read operations andthe Write port is dedicated to Write...
Page 6 - to allow the SRAM to adjust its; cycles to account for drifts in supply voltage and temperature.; Application Example; Standby: Clock Stopped
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 6 of 19 operation is identical to the operation if the device had zeroskew between the K/K and C/C clocks. All timing parametersremain the same in this mode. To use this mode of operation,the user must tie C and C HIGH at power-up.This func...
Page 8 - A Reset is performed by forcing TMS HIGH (V; Instruction Register; ) when the BYPASS instruction is executed.
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 8 of 19 IEEE 1149.1 Serial Boundary Scan (JTAG) These SRAMs incorporate a serial boundary scan test accessport (TAP) in the FBGA package. This part is fully compliantwith IEEE Standard #1149.1-1900. The TAP operates usingJEDEC standard 2.5V...
Page 9 - BYPASS
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 9 of 19 is loaded into the instruction register upon power-up orwhenever the TAP controller is given a test logic reset state. SAMPLE Z The SAMPLE Z instruction causes the boundary scan registerto be connected between the TDI and TDO pins w...
Page 10 - TAP Controller State Diagram
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 10 of 19 TAP Controller State Diagram [9] Note: 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. TEST-LOGICRESET TEST-LOGIC/IDLE SELECTDR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR PAUSE-DR EXIT2-DR UPDATE-DR SELE...
Page 12 - TAP Timing and Test Conditions; Test Clock; Identification Register Definitions
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 12 of 19 Output Times t TDOV TCK Clock LOW to TDO Valid 20 ns t TDOX TCK Clock LOW to TDO Invalid 0 ns TAP Timing and Test Conditions [12] TAP AC Switching Characteristics Over the Operating Range [11, 12] (continued) Parameter Description ...
Page 13 - Scan Register Sizes; Register Name; Instruction Codes; Instruction
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 13 of 19 Scan Register Sizes Register Name Bit Size Instruction 3 Bypass 1 ID 32 Boundary Scan 107 Instruction Codes Instruction Code Description EXTEST 000 Captures the Input/Output ring contents. IDCODE 001 Loads the ID register with the ...
Page 14 - Boundary Scan Order; Bump ID; Internal
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 14 of 19 Boundary Scan Order Bit # Bump ID Bit # Bump ID Bit # Bump ID Bit # Bump ID 0 6R 27 11H 54 7B 81 3G 1 6P 28 10G 55 6B 82 2G 2 6N 29 9G 56 6A 83 1J 3 7P 30 11F 57 5B 84 2J 4 7N 31 11G 58 5A 85 3K 5 7R 32 9F 59 4A 86 3J 6 8R 33 10F 6...
Page 15 - Electrical Characteristics
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 15 of 19 Maximum Ratings (Above which the useful life may be impaired.) Storage Temperature ................................ –65°C to + 150°C Ambient Temperature withPower Applied ............................................ –55°C to + 125°...
Page 17 - Switching Waveforms
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 17 of 19 Switching Waveforms [25, 26, 27] Notes: 24. t CHZ , t CLZ , are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ± 100 mV from steady-state voltage. 25. Q00 refers to output from add...
Page 18 - Ordering Information; Commercial; Package Diagram
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 18 of 19 © Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the useof any circuitry other than circuitry embodied ...
Page 19 - Document History Page; Issue Date
CY7C1306BV25 CY7C1303BV25 Document #: 38-05627 Rev. *A Page 19 of 19 Document History Page Document Title: CY7C1303BV25/CY7C1306BV25 18-Mbit Burst of 2 Pipelined SRAM with QDR™ ArchitectureDocument Number: 38-05627 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 253010 See ECN SYT N...