Intel 200 - Manual

6 Thermal and Mechanical Design Guidelines Revision History Revision Number Description Revision Date -001 • Initial Release October 2007 §

Introduction Thermal and Mechanical Design Guidelines 7 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within their functional temperature range. Wi...

Introduction 8 Thermal and Mechanical Design Guidelines 1.1.3 Document Scope This design guide supports the following processors: • Intel ® Celeron ® Processor 200 sequence applies to the Intel ® Celeron ® processor 220. In this document the Intel Celeron Processor 200 sequence will be referred to a...

Introduction Thermal and Mechanical Design Guidelines 9 1.2 Reference Documents Material and concepts available in the following documents may be beneficial when reading this document. Document Document No./Location Intel ® Celeron ® Processor 200 Sequence Datasheet http://developer.intel .com/desig...

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 11 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Intel Celeron processor 200 sequence is available in a 479-pin Micro-FCBGA package, as shown in Figure 1 to Figure 3...

Processor Thermal/Mechanical Information 12 Thermal and Mechanical Design Guidelines Table 1. Micro-FCBGA Package Mechanical Specifications Symbol Parameter Min Max Unit Figure B1 Package substrate width 34.95 35.05 mm Figure 2 B2 Package substrate length 34.95 35.05 mm Figure 2 C1 Die width 11.1 mm...

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 13 Figure 1. Micro-FCBGA Processor Package Drawing – Isometric View

Processor Thermal/Mechanical Information 16 Thermal and Mechanical Design Guidelines 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines The micro-FCBGA package may have capacitors placed in the area surrounding the processor die. The die-side capacitors, which are only slightly shorter than the die he...

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 17 depending on clip stiffness, the initial preload at beginning of life of the product may be significantly higher than the minimum preload that must be met throughout the life of the product. Refer to Appendix A for ...

Processor Thermal/Mechanical Information 18 Thermal and Mechanical Design Guidelines Figure 4. Vertical Lock-Down Alignment Feature Figure 5. Various Types of Solder Crack 2.2 Thermal Requirements The processor requires a thermal solution to maintain temperatures within operating limits. Refer to th...

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 19 2.2.1 Processor Junction Temperature Table 2. Thermal Specifications for Intel ® Celeron ® Processor 200 Sequence Symbol Processor Number Core Frequency and Voltage Cache Thermal Design Power (W) Notes TDP 220 1.20 ...

Processor Thermal/Mechanical Information 20 Thermal and Mechanical Design Guidelines air, T A , and the local air velocity over the surface. The higher the air velocity over the surface, and the cooler the air, the more efficient is the resulting cooling. The nature of the airflow can also enhance h...

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 21 2.3.2 Heatsink Mass With the need to push air cooling to better performance, heatsink solutions tend to grow larger (increase in fin surface) resulting in increased mass. The insertion of highly thermally conductive...

Processor Thermal/Mechanical Information 22 Thermal and Mechanical Design Guidelines 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities The reference thermal solution for the Intel Celeron processor 200 sequence on the Intel Desktop Board D201GLY2 is a passive heats...

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 23 By analyzing airflow condition in an μ ATX chassis, a case study in Figure 6 shows that a chassis layout is critical to components cooling in the system. The alignment of system fan (80×80mm 2 ) with power supply fa...

Processor Thermal/Mechanical Information 24 Thermal and Mechanical Design Guidelines Figure 7. Case Study #2: Relocate System Fan to CAG Venting for Airflow Improvement Figure 8. Case Study#3: An μ ATX Chassis Equipped with Two Exhaust Fans

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 25 Figure 9. Case Study #4: A “Top Mount Fan” PSU is located next to Processor in μ ATX Chassis for System Thermal Performance Improvement 2.4.3 Summary In summary, heatsink design considerations for the Intel Celeron ...

Thermal Metrology Thermal and Mechanical Design Guidelines 27 3 Thermal Metrology This section discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solut...

Thermal Metrology 28 Thermal and Mechanical Design Guidelines For reference thermal solution of Intel Celeron processor 200 sequence on Intel Desktop Board D201GLY2, the junction-to-local ambient thermal characterization parameter of the processor, Ψ JA , is comprised of Ψ JS , the thermal interface...

Thermal Metrology Thermal and Mechanical Design Guidelines 29 Figure 10 illustrates the combination of the different thermal characterization parameters. Figure 10. Processor Thermal Characterization Parameter Relationships 3.1.1 Example The cooling performance, Ψ JA, is then defined using the princ...

Thermal Metrology 30 Thermal and Mechanical Design Guidelines To determine the required heatsink performance, a heatsink solution provider would need to determine Ψ JS performance for the selected TIM and mechanical load configuration. If the heatsink solution were designed to work with a TIM materi...

Thermal Metrology Thermal and Mechanical Design Guidelines 31 measurements will reveal a highly non-uniform temperature distribution across the inlet fan section. For passive heatsinks , thermocouples should be placed approximately 3 mm away from the heatsink as shown in Figure 12. Note: Testing an ...

Thermal Metrology Thermal and Mechanical Design Guidelines 33 3.3.1 Sample Preparation In order to accurately measure the processor power consumption, it is required to attach sense resistor and replace one of the motherboard resistors. Schematic diagram in Figure 13 illustrates the precision resist...

Thermal Metrology 34 Thermal and Mechanical Design Guidelines Figure 13. Precision Resistor Connected in-series with Processor Circuitry for Power Measurement Figure 14. Installation of Isotek Resistor on Intel ® Desktop Board D201GLY2 to Setup Connection for Power Measurement Isotek Resistor Measur...

Thermal Metrology Thermal and Mechanical Design Guidelines 35 Figure 15. Probing Resistance of the Soldered Walsin Resistor (R =19.6 K Ω ) on Intel ® Desktop Board D201GLY2 to Ensure Proper Attachment Figure 16. Precision Resistor Soldered on on Intel ® Desktop Board D201GLY2, and Connected to netDA...

System Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 37 4 System Thermal/Mechanical Design Information 4.1 Overview of the Reference Design This chapter will document the requirements for designing a passive heatsink that meets the maximum usage power consumption tha...

System Thermal/Mechanical Design Information 38 Thermal and Mechanical Design Guidelines 4.2 Environmental Reliability Testing 4.2.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given thermal solution in the assembled s...

System Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 39 Figure 18. Shock Acceleration Curve 0 10 20 30 40 50 60 0 2 4 6 8 10 12 Time (m illise conds ) A c c e l e r a t i o n (g) 4.2.1.2.1 Recommended Test Sequence Each test sequence should start with components (i.e...

System Thermal/Mechanical Design Information 40 Thermal and Mechanical Design Guidelines 4.2.2 Power Cycling Thermal performance degradation due to TIM degradation is evaluated using power cycling testing. The test is defined by 7500 cycles for the heatsink temperature from room temperature (~23 ºC)...

System Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 41 4.4 Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: • UL Recognition-approved for flammability at the system level. All me...

Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 43 Appendix A Heatsink Clip Load Metrology A.1 Overview The primary objective of the preload measurement is to ensure the preload designed into the retention mechanism is able to meet minimum of 8.7lbf at end-of-line and does not ...

Heatsink Clip Load Metrology 44 Thermal and Mechanical Design Guidelines Table 5. Typical Test Equipment 7. Item 18. Description 9. Part Number (Model) 20. Load cell 21. Notes: 1, 5 22. Honeywell*-Sensotec* Model 13 subminiature load cells, compression only 23. Select a load range depending on load ...

Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 45 A.3 Test Procedure Examples The following procedure is for a generic z-clip solution using the clip force time0 measurement machine at room temperature: 1. Install anchors onto top plate. Anchor can be secured using epoxy or gl...

Intel® Enabled Boxed Processor Thermal Solution Information Thermal and Mechanical Design Guidelines 47 Appendix B Intel ® Enabled Boxed Processor Thermal Solution Information This appendix includes supplier information for Intel enabled vendors. Table 6 lists suppliers that produce Intel ® Boxed Pr...

Mechanical Drawings Thermal and Mechanical Design Guidelines 49 Appendix C Mechanical Drawings The following table lists the mechanical drawings included in this appendix. These drawings refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right t...

Mechanical Drawings 50 Thermal and Mechanical Design Guidelines Figure 21. Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components