Texas Instruments HPL-D SLLU064A - Manual

Tables vi Figure 3-6. Layer 4–Vcc01 Plane ..................................................................................3-6 Figure 3-7. Layer 5–GND Plane ....................................................................................3-6 Figure 3-8. Layer 6–GND/Signal Plane ....................

1-1 Chapter 1 1 Overview This chapter provides a high-level description of the 4x4 crosspoint switch EVM mounted with either a SN65LVDS125A, 4x4 1.5-Gbps or a SN65LVDS250, 4x4 2.5-Gbps crosspoint switch. Topic Page 1.1 Sample Functional Configurations 1-2 1.2 Signal Paths 1-4

1 Overview 1-2 1.1 Sample Functional Configurations The 4x4 crosspoint switch is a fully non-blocking switch that provides flexibility in switch configuration for the desired application. A sample of various functions for which the EVMs can be configured is shown in Figure 1-1. S 1 0 S 1 1 S 2 0 S 2...

1 Overview 1-4 1.2 Signal Paths The signal paths on this EVM (see Figure 1-3) include: ❏ ❏ ❏ ❏ Sixteen edge-launch SMA connectors (J1–J16) for high-speed data transmission ❏ ❏ ❏ ❏ Eight jumpers (W1– W8) for active switch logic control ❏ ❏ ❏ ❏ Four jumpers (W9–W12) for enabling and disabling the outp...

2-1 Chapter 2 2 Setup and Required Equipment Both the SN65LVDS125A and the SN65LVDS250 LVDS driver output characteristics are compliant with the requirements of the TIA/EIA-644 standard. LVDS drivers nominally provide a 350-mV differential signal, with a 1.2-V offset from ground. These levels are at...

2 Setup and Required Equipment 2-3 Table 2-1 Crosspoint Function Table Output Channel 1 Output Channel 2 Output Channel 3 Output Channel 4 Control Pins Input Selected Control Pins Input Selected Control Pins Input Selected Control Pins Input Selected S10 S11 1Y/1Z S20 S21 2Y/2Z S30 S31 3Y/3Z S40 S41...

2 Setup and Required Equipment 2-4 2.2 Observing an Output In order to minimize the parasitic capacitance in high-speed measurements (probe capacitance), the 4x4 crosspoint switch EVM provides an offset power plane (layer 5). This power plane allows the user to offset the device so that the common-m...

EVM Construction 3-1 Chapter 3 3 EVM Construction This chapter presents the schematics, board layouts, fabrication information, and the bill of materials. Topic Page 3.1 Schematic 3-2 3.2 Board Layout Patterns 3-3 3.3 PCB Fabrication Requirements and Stack Up 3-8 3.4 Bill of Materials 3-9

3-2 3.1 Schematic Figure 3-1. 4x4 Crosspoint Switch EVM Schematic SN 65 L VD S1 25 A or SN 65 L VD S2 50 U1

3 EVM Construction 3-3 3.2 Board Layout Patterns Figure 3-2. 4x4 Crosspoint Switch EVM Board Layout 4X4 Crosspoint Switch EVM SN65LVDS125A SN65LVDS250 A/W # 6456526

3-8 3.3 PCB Fabrication Requirements and Stack Up Stackup Signal: Layer 1 Notes: 1. PW B TO BE FABRICATED TO MEET OR EXCEED IPC-6012, CLASS 3 STANDARDS AND WORKMANSHIP SHALL CONFORM TO IPC-A-600, CLASS 3 CURRENT REVISIONS 2. BOARD MATERIAL AND CONSTRUCTION TO BE UL APPROVED AND MARKED ON THE FINISHE...

3 EVM Construction 3-9 3.4 Bill of Materials Table 3-2. Bill of Materials for SN65LVDS125A / SN65LVDS250 EVM Item 6456526-1 Qty 6456526-2 Qty 6456526-3 Qty Description Pattern Reference Designator 1 9 9 9 0.001 µF 402 C2, C3, C4, C5, C6, C7, C8, C9, C10 2 2 2 2 0.01 µF 603 C13, C18 3 1 1 1 0.1 µF 60...