Page 3 - Contents
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 3 Intel ® 5100 MCH Chipset Contents 1.0 Introduction ...............................................................................................................
Page 4 - Figures; Intel
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 4 Order Number: 318676-003US Figures 1 Thermal Design Process ............................................................................................. 7 2 MCH...
Page 5 - Revision History; Revision Number Descriptions
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 5 Intel ® 5100 MCH Chipset Revision History Date Revision Description July 2008 003 Added the CompactPCI* reference solutionAdded Figure 26 , Figure 27 , and Fig...
Page 6 - Introduction; Design Flow; Figure 1
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 6 Order Number: 318676-003US 1.0 Introduction As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensu...
Page 7 - Definition of Terms; Thermal Design Process
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 7 Intel ® 5100 MCH Chipset 1.2 Definition of Terms Figure 1. Thermal Design Process Table 1. Definition of Terms Term Definition FC-BGA Flip Chip Ball Grid Array...
Page 8 - Related Documents
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 8 Order Number: 318676-003US 1.3 Related Documents Intel ® Electronic Design Kits (EDKs) provide online, real-time collateral updates. The following links take you...
Page 9 - Thermal Simulation; Intel provides thermal simulation models of the Intel; Packaging Technology
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 9 Intel ® 5100 MCH Chipset 1.4 Thermal Simulation Intel provides thermal simulation models of the Intel ® 5100 MCH Chipset and associated user’s guides to aid sy...
Page 11 - Package Mechanical Requirements; The Intel
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 11 Intel ® 5100 MCH Chipset 2.1 Package Mechanical Requirements The Intel ® 5100 MCH Chipset package has an integrated heat spreader (IHS) that is capable of sus...
Page 12 - Thermal Specifications; Case Temperature; Thermal Solution Requirements; Characterizing the Thermal Solution Requirement
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 12 Order Number: 318676-003US Note: These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface. Note: These spec...
Page 13 - Equation 1; Figure 5; Example 1. Calculating the Required Thermal Performance; T D P; Processor Thermal Characterization Parameter Relationships
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 13 Intel ® 5100 MCH Chipset The case-to-local ambient thermal characterization parameter ( Ψ CA ) is used as a measure of the thermal performance of the overall ...
Page 15 - Table 4; Thermal Metrology; Figure 6; MCH Case Measurement; Supporting Test Equipment; Table 5; Required Heatsink Thermal Performance (
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 15 Intel ® 5100 MCH Chipset Table 4 summarizes the thermal budget required to adequately cool the Intel ® 5100 MCH Chipset in one configuration using a TDP of 25...
Page 16 - Thermal Calibration and Controls; Thermocouple Attach Support Equipment
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 16 Order Number: 318676-003US 5.1.2 Thermal Calibration and Controls It is recommended that full and routine calibration of temperature measurement equipment be pe...
Page 17 - IHS Groove Dimensions
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 17 Intel ® 5100 MCH Chipset Figure 6. IHS Groove Dimensions
Page 18 - Thermocouple Conditioning and Preparation; Use a calibrated thermocouple as specified in; Thermocouple Attachment to IHS; cloth removing all residue prior to thermocouple attachment.; Orientation of Thermocouple Groove Relative to Package Pin
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 18 Order Number: 318676-003US 5.1.4 Thermocouple Conditioning and Preparation 1. Use a calibrated thermocouple as specified in Table 5 . 2. Measure the thermocoupl...
Page 19 - Figure 9; Securing Thermocouple Wires with Kapton Tape Prior to Attach
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 19 Intel ® 5100 MCH Chipset 2. Place the thermocouple wire inside the groove letting the exposed wire and bead extend about 3.2 mm (0.125") past the end of t...
Page 20 - Thermocouple Bead Placement
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 20 Order Number: 318676-003US Figure 10. Thermocouple Bead Placement Figure 11. Positioning Bead on Groove
Page 21 - Using 3D Micromanipulator to Secure Bead Location
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 21 Intel ® 5100 MCH Chipset Figure 12. Using 3D Micromanipulator to Secure Bead Location Figure 13. Measuring Resistance between Thermocouple and IHS
Page 22 - Curing Process; Applying Adhesive on Thermocouple Bead
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 22 Order Number: 318676-003US 5.1.6 Curing Process 1. Let the thermocouple attach sit in the open air for at least half an hour. Using any curing accelerator like ...
Page 23 - Thermocouple Wire Management; Thermocouple Wire Management in Groove
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 23 Intel ® 5100 MCH Chipset 5.1.7 Thermocouple Wire Management Figure 15. Thermocouple Wire Management in Groove Figure 16. Removing Excess Adhesive from IHS
Page 24 - Power Simulation Software; Reference Thermal Solution; Filling Groove with Adhesive
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 24 Order Number: 318676-003US Note: Prior to installing the heatsink, be sure that the thermocouple wires remain below the IHS top surface by running a flat blade ...
Page 25 - AdvancedTCA* Reference Heatsink; Thermal Performance; Velocity
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 25 Intel ® 5100 MCH Chipset The Intel ® 5100 MCH Chipset has a lower TDP than the Intel ® 5000 Series Chipset and a similar package size. Due to this, any therma...
Page 26 - Board-level Components Keepout Dimensions
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 26 Order Number: 318676-003US When using heatsinks that extend beyond the MCH chipset reference heatsink envelope shown in Figure 19 , any motherboard components p...
Page 27 - provided in; Heatsink Orientation; must be aligned with the direction of the heatsink fins.; Extruded Heatsink Profiles; Appendix B; Mechanical Interface Material; phase change temperature.; Torsional Clip Heatsink Assembly
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 27 Intel ® 5100 MCH Chipset Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix A . Appendix B contains vend...
Page 28 - Effect of Pressure on TIM Performance; Table 6; Heatsink Clip; Appendix A; Clip Retention Anchors; Reliability Guidelines; Table 7; Honeywell* PCM45F TIM Performance as Function of Attach Pressure
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 28 Order Number: 318676-003US 6.1.8.1 Effect of Pressure on TIM Performance As mechanical pressure increases on the TIM, the thermal resistance of the TIM decrease...
Page 29 - CompactPCI* Reference Heatsink; meets the thermal specifications for Intel; Component Overview; not; Isometric View of the CompactPCI* Reference Heatsink
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 29 Intel ® 5100 MCH Chipset 6.2 CompactPCI* Reference Heatsink Intel has also developed a reference thermal solution compatible with the CompactPCI* form factor....
Page 30 - Thermal Solution Performance Characteristics; Table 8; CompactPCI* Reference Heatsink Thermal Performance; CompactPCI* Heats ink; Reliability Requirements
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 30 Order Number: 318676-003US 6.2.2 Thermal Solution Performance Characteristics Figure 22 shows the performance of the CompactPCI* reference heatsink. This figure...
Page 31 - Appendix A Mechanical Drawings; Table 9; Mechanical Drawing List
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 31 Intel ® 5100 MCH Chipset Appendix A Mechanical Drawings Table 9 lists the mechanical drawings included in this appendix. Table 9. Mechanical Drawing List Draw...
Page 32 - AdvancedTCA* Heatsink Assembly Drawing
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 32 Order Number: 318676-003US Figure 23. AdvancedTCA* Heatsink Assembly Drawing
Page 33 - AdvancedTCA* Heatsink Drawing
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 33 Intel ® 5100 MCH Chipset Figure 24. AdvancedTCA* Heatsink Drawing
Page 34 - AdvancedTCA* Component Keepout Zone
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 34 Order Number: 318676-003US Figure 25. AdvancedTCA* Component Keepout Zone
Page 35 - CompactPCI* Heatsink Assembly Drawing
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 35 Intel ® 5100 MCH Chipset Figure 26. CompactPCI* Heatsink Assembly Drawing
Page 36 - CompactPCI* Heatsink Drawing
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 36 Order Number: 318676-003US Figure 27. CompactPCI* Heatsink Drawing
Page 37 - CompactPCI* Component Keepout Zone
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 37 Intel ® 5100 MCH Chipset Figure 28. CompactPCI* Component Keepout Zone
Page 38 - Torsional Clip Heatsink Clip Drawing
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 38 Order Number: 318676-003US Figure 29. Torsional Clip Heatsink Clip Drawing
Page 39 - TIM2 Drawing
Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 39 Intel ® 5100 MCH Chipset Figure 30. TIM2 Drawing
Page 40 - Appendix B Thermal Solution Component Suppliers; MCH Torsional Clip Heatsink Thermal Solution
Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 40 Order Number: 318676-003US Appendix B Thermal Solution Component Suppliers Table 10. MCH Torsional Clip Heatsink Thermal Solution Part Intel Part Number Supplie...
