Cypress CY62157EV18 - Manual
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Table of Contents:
- Page 2 – W DE; Note; Top View
- Page 3 – Electrical Characteristics; Notes; Full Device AC operation assumes a 100; s wait time after V; spec. Other inputs can be left floating.
- Page 4 – DATA RETENTION MODE; CE; Full device operation requires linear V; ramp from V; to V
- Page 5 – Switching Characteristics; “AC Test Loads and Waveforms” on page 4
- Page 6 – Switching Waveforms; Read Cycle 1
- Page 7 – or CE; goes HIGH and CE; , the output remains in a high impedance state.
- Page 8 – HZWE
- Page 10 – Package Diagrams
- Page 11 – Document History; Change
Cypress Semiconductor Corporation
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Document #: 38-05490 Rev. *D
Revised March 30, 2007
CY62157EV18 MoBL
®
8-Mbit (512K x 16) Static RAM
Features
• Very high speed: 55 ns
• Wide voltage range: 1.65V–2.25V
• Pin Compatible with CY62157DV18 and CY62157DV20
• Ultra low standby power
— Typical Standby current: 2
µ
A
— Maximum Standby current: 8
µ
A
• Ultra low active power
— Typical active current: 1.8 mA @ f = 1 MHz
• Easy memory expansion with CE
1
, CE
2
and OE features
• Automatic power down when deselected
• CMOS for optimum speed and power
• Available in Pb-free 48-ball VFBGA package
Functional Description
The CY62157EV18 is a high performance CMOS static RAM
organized as 512K words by 16 bits. This device features
advanced circuit design to provide ultra low active current.
This is ideal for providing More Battery Life™ (MoBL
®
) in
portable applications such as cellular telephones. The device
also has an automatic power down feature that significantly
reduces power consumption when addresses are not toggling.
The device can also be put into standby mode when
deselected (CE
1
HIGH or CE
2
LOW or both BHE and BLE are
HIGH). The input and output pins (IO
0
through IO
15
) are
placed in a high impedance state when:
• Deselected (CE
1
HIGH or CE
2
LOW)
• Outputs are disabled (OE HIGH)
• Both Byte High Enable and Byte Low Enable are disabled
(BHE, BLE HIGH) or
• Write operation is active (CE
1
LOW, CE
2
HIGH and WE
LOW).
Write to the device by taking Chip Enables (CE
1
LOW and CE
2
HIGH) and Write Enable (WE) input LOW. If Byte Low Enable
(BLE) is LOW, then data from IO pins (IO
0
through IO
7
), is
written into the location specified on the address pins (A
0
through A
18
). If Byte High Enable (BHE) is LOW, then data
from IO pins (IO
8
through IO
15
) is written into the location
specified on the address pins (A
0
through A
18
).
Read from the device by taking Chip Enables (CE
1
LOW and
CE
2
HIGH) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins appear on IO
0
to IO
7
. If Byte High Enable (BHE) is LOW,
then data from memory appears on IO
8
to IO
15
. See the
for a complete description of read and write
modes.
Product Portfolio
Product
V
CC
Range (V)
Speed
(ns)
Power Dissipation
Operating I
CC
, (mA)
Standby, I
SB2
(
µ
A)
f = 1MHz
f = f
max
Min
Typ
[2]
Max
Typ
[2]
Max
Typ
Max
Typ
Max
CY62157EV18
1.65
1.8
2.25
55
1.8
3
18
25
2
8
Notes
1. For best practice recommendations, refer to the Cypress application note “
System Design Guidelines
” located at
http://www.cypress.com.
2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= V
CC(typ)
, T
A
= 25°C.
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Summary
CY62157EV18 MoBL ® Document #: 38-05490 Rev. *D Page 2 of 12 Logic Block Diagram Pin Configuration [3] 512K x 16 RAM Array IO 0 –IO 7 RO W DE CO DE R A 8 A 7 A 6 A 5 A 2 COLUMN DECODER A 11 A 12 A 13 A 14 A 15 SE NS E AMP S DATA IN DRIVERS OE A 4 A 3 IO 8 –IO 15 WE BLE BHE A 16 A 0 A 1 A 17 A 9 BHEB...
CY62157EV18 MoBL ® Document #: 38-05490 Rev. *D Page 3 of 12 Maximum Ratings Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested.Storage Temperature ................................ –65°C to + 150°CAmbient Temperature withPower Applied ..............
CY62157EV18 MoBL ® Document #: 38-05490 Rev. *D Page 4 of 12 Thermal Resistance [8] Parameter Description Test Conditions BGA Unit Θ JA Thermal Resistance (Junction to Ambient) Still air, soldered on a 3 × 4.5 inch, two-layer printed circuit board 72 ° C/W Θ JC Thermal Resistance (Junction to Case) ...
