Page 2 - Printed-Circuit Board Assembly; C protocol. It then sends the I; Software; Features; Dynamic voltage scaling DCDC1; Electrical Performance Specification; Table 1. EVM Ordering Options; Table 2. Default LDO Output Voltages TPS65023B
Electrical Performance Specification www.ti.com 1.1.2 Printed-Circuit Board Assembly The TPS65023B/TPS650231EVM-664 PCB contains the TPS65023B/TPS650231 IC and its requiredexternal components. This board contains several jumpers and connectors that allow the user tocustomize the board for specific o...
Page 3 - Input/Output Connector Description; J1 – VIN; This is the return connection for VIN.; J7 – Fault Outputs; Four fault outputs are available on this connector:
www.ti.com Input/Output Connector Description 3 Input/Output Connector Description This section describes the jumpers and connectors on the EVM, as well as how to properly connect, setup, and use the TPS65023B/TPS650231EVM-664. J1 – VIN Input voltage from external power supply, recommended maximum 5...
Page 4 - Table 2; Setup
Input/Output Connector Description www.ti.com J17 – VDCDC3 Output from switching regulator DCDC3; maximum output current 1 A. J18– GND Return for VDCDC3. J19 – J19 is the interface connector for the I2C interface. Connect a 10-pin ribbon cable between J13and the USB-to-GPIO interface. JP1 – DEF1 Set...
Page 5 - Modifications; Setting the Output Voltage; Equation 1; Scaling the Output Voltage of DCDC2 From LDO2; From
) R R ( ) VLDO REF _ V ( )) R R ( REF _ V DCDC _ Vout 3 1 2 2 1 1 2 ´ - + + ´ = www.ti.com Input/Output Connector Description 4. Connect the ribbon cable between the EVM and the USB-TO-GPIO (HPA172) adapter.5. Connect the USB cable between the computer and the HPA172EVM.6. Turn on all supplies.7. Ru...
Page 6 - Board Layout; Layout; Board layout is critical for all switch mode power supplies.; Figure 1. Assembly Layer
) R R ( max) , VLDO REF _ V ( )) R R ( REF _ V min , DCDC _ Vout 3 1 2 2 1 1 2 ´ - + + ´ = ) R R ( min) , VLDO REF _ V ( )) R R ( REF _ V max , DCDC _ Vout 3 1 2 2 1 1 2 ´ - + + ´ = Board Layout www.ti.com (2) (3) The most straight forward way is to choose a value for R6 according to the recommendat...
Page 7 - Figure 2. Top Layer Routing
www.ti.com Board Layout Figure 2. Top Layer Routing 7 SLVU394 – October 2010 TPS65023B/TPS650231EVM Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Page 10 - Figure 5. Bottom Layer Routing
Board Layout www.ti.com Figure 5. Bottom Layer Routing 10 TPS65023B/TPS650231EVM SLVU394 – October 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Page 11 - Schematic and Bill of Materials; Schematic
www.ti.com Schematic and Bill of Materials 5 Schematic and Bill of Materials This section provides the TPS65023B/TPS650231EVM-664 schematic and bill of materials. 5.1 Schematic Figure 6. TPS65023B/TPS650231EVM-664 Schematic 11 SLVU394 – October 2010 TPS65023B/TPS650231EVM Submit Documentation Feedba...
Page 12 - Bill of Materials; SLVSAE3
Schematic and Bill of Materials www.ti.com 5.2 Bill of Materials Table 4. TPS65023B/TPS650231EVM-664 Bill of Materials Count RefDes Value Description Size Part Number -001 -002 9 9 C1, C2, C4, C9, 10 µF Capacitor, Ceramic, 6.3V, X5R, 10% 0805 Std C10, C11,C14–C16 4 4 C3, C6, C7, C17 1.0 µF Capacitor...
Page 14 - IMPORTANT NOTICE
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the l...