Intel 945GC - Manuals

Introduction Thermal and Mechanical Design Guidelines 7 1 Introduction As the complexity of computer systems increases, so do power dissipation requirements. The additional power of next generation systems must be properly dissipated. Heat can be dissipated using improved system cooling, selective u...

Introduction 8 Thermal and Mechanical Design Guidelines 1.1 Terminology Term Description BGA Ball Grid Array. A package type defined by a resin-fiber substrate where a die is mounted and bonded. The primary electrical interface is an array of solder balls attached to the substrate opposite the die a...

Introduction Thermal and Mechanical Design Guidelines 9 1.2 Reference Documents Document Comments Intel ® 945G/945GZ/945P/945PL Express Chipset Family Datasheet http://developer.intel.com/design/chipsets/datashts/307502.htm Intel ® I/O Controller Hub 7 (ICH7) Datasheet http://developer.intel.com//de...

Product Specifications Thermal and Mechanical Design Guidelines 11 2 Product Specifications This chapter provides the package description and loading specifications. The chapter also provides component thermal specifications and thermal design power descriptions for the (G)MCH. 2.1 Package Descripti...

Product Specifications 12 Thermal and Mechanical Design Guidelines Figure 1. (G)MCH Non-Grid Array 2.2 Package Loading Specifications Table 1 provides static load specifications for the chipset package. This mechanical maximum load limit should not be exceeded during heatsink assembly, shipping cond...

Product Specifications Thermal and Mechanical Design Guidelines 13 2.3 Thermal Specifications To ensure proper operation and reliability of the (G)MCH, the temperature must be at or below the maximum value specified in Table 2. System and component level thermal enhancements are required to dissipat...

Product Specifications 14 Thermal and Mechanical Design Guidelines 2.4.1 Methodology 2.4.1.1 Pre-Silicon To determine TDP for pre-silicon products in development, it is necessary to make estimates based on analytical models. These models rely on extensive knowledge of the past chipset power dissipat...

Thermal Metrology Thermal and Mechanical Design Guidelines 15 3 Thermal Metrology The system designer must measure temperatures to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring (G)MCH component case temperatures. 3.1 C...

Thermal Metrology 16 Thermal and Mechanical Design Guidelines Figure 2. 0° Angle Attach Methodology (top view, not to scale) Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale) 3.2 Airflow Characterization Figure 4 describes the recommended lo...

Reference Thermal Solution Thermal and Mechanical Design Guidelines 19 4 Reference Thermal Solution The reference component thermal solution for the (G)MCH for ATX platforms uses two ramp retainers, a wire preload clip, and four custom MB anchors. The Intel Balanced Technology Extended (BTX) referen...

Reference Thermal Solution Thermal and Mechanical Design Guidelines 21 Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a Balanced Technology Extended (BTX) Platform Top View Balanced Technology Extended (BTX) Thermal Module Assembly Ov er Processor (G)MCH Airflow Di...

Reference Thermal Solution 24 Thermal and Mechanical Design Guidelines 4.4 Environmental Reliability Requirements The environmental reliability requirements for the reference thermal solution are shown in Table 4. These should be considered as general guidelines. Validation test plans should be defi...

Enabled Suppliers Thermal and Mechanical Design Guidelines 25 Appendix A Enabled Suppliers Current suppliers for the Intel ® 945G/945GZ/945GC/945P/945PL Express chipset (G)MCH reference thermal solution are listed in Table 5 and Table 6. Table 5. (G)MCH ATX Intel Reference Heatsink Enabled Suppliers...

Mechanical Drawings Thermal and Mechanical Design Guidelines 27 Appendix B Mechanical Drawings The following table lists the mechanical drawings available in this document. Drawing Name Page Number (G)MCH Package Drawing 28 (G)MCH Component Keep-Out Restrictions for ATX Platforms 29 (G)MCH Component...

Mechanical Drawings Ther mal and Mechanical Design Guidelines 29 Figure 10. (G)MCH Component Keep-Out R e st rict ions f o r A T X Plat fo rms 8X P L AT ED T H R U H O L E 8X 1. 4 2[ .0 56] T R A C E K E E P O U T 0.97 .038 [] 4 .1 575[] 74 2 .91 34 [] 47 1. 8 5 [] 60 .92 2. 3 98 [] 4X 8 .7 6 .3 4 5...