Intel 5100 - Manuals

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 6 Order Number: 318676-003US 1.0 Introduction As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensu...

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 7 Intel ® 5100 MCH Chipset 1.2 Definition of Terms Figure 1. Thermal Design Process Table 1. Definition of Terms Term Definition FC-BGA Flip Chip Ball Grid Array...

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 8 Order Number: 318676-003US 1.3 Related Documents Intel ® Electronic Design Kits (EDKs) provide online, real-time collateral updates. The following links take you...

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 9 Intel ® 5100 MCH Chipset 1.4 Thermal Simulation Intel provides thermal simulation models of the Intel ® 5100 MCH Chipset and associated user’s guides to aid sy...

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 11 Intel ® 5100 MCH Chipset 2.1 Package Mechanical Requirements The Intel ® 5100 MCH Chipset package has an integrated heat spreader (IHS) that is capable of sus...

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 12 Order Number: 318676-003US Note: These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface. Note: These spec...

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 13 Intel ® 5100 MCH Chipset The case-to-local ambient thermal characterization parameter ( Ψ CA ) is used as a measure of the thermal performance of the overall ...

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 15 Intel ® 5100 MCH Chipset Table 4 summarizes the thermal budget required to adequately cool the Intel ® 5100 MCH Chipset in one configuration using a TDP of 25...

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 16 Order Number: 318676-003US 5.1.2 Thermal Calibration and Controls It is recommended that full and routine calibration of temperature measurement equipment be pe...

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 17 Intel ® 5100 MCH Chipset Figure 6. IHS Groove Dimensions

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 18 Order Number: 318676-003US 5.1.4 Thermocouple Conditioning and Preparation 1. Use a calibrated thermocouple as specified in Table 5 . 2. Measure the thermocoupl...

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 19 Intel ® 5100 MCH Chipset 2. Place the thermocouple wire inside the groove letting the exposed wire and bead extend about 3.2 mm (0.125") past the end of t...

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 20 Order Number: 318676-003US Figure 10. Thermocouple Bead Placement Figure 11. Positioning Bead on Groove

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 21 Intel ® 5100 MCH Chipset Figure 12. Using 3D Micromanipulator to Secure Bead Location Figure 13. Measuring Resistance between Thermocouple and IHS

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 22 Order Number: 318676-003US 5.1.6 Curing Process 1. Let the thermocouple attach sit in the open air for at least half an hour. Using any curing accelerator like ...

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 23 Intel ® 5100 MCH Chipset 5.1.7 Thermocouple Wire Management Figure 15. Thermocouple Wire Management in Groove Figure 16. Removing Excess Adhesive from IHS

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 24 Order Number: 318676-003US Note: Prior to installing the heatsink, be sure that the thermocouple wires remain below the IHS top surface by running a flat blade ...

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 25 Intel ® 5100 MCH Chipset The Intel ® 5100 MCH Chipset has a lower TDP than the Intel ® 5000 Series Chipset and a similar package size. Due to this, any therma...

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 26 Order Number: 318676-003US When using heatsinks that extend beyond the MCH chipset reference heatsink envelope shown in Figure 19 , any motherboard components p...

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 27 Intel ® 5100 MCH Chipset Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix A . Appendix B contains vend...

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 28 Order Number: 318676-003US 6.1.8.1 Effect of Pressure on TIM Performance As mechanical pressure increases on the TIM, the thermal resistance of the TIM decrease...

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 29 Intel ® 5100 MCH Chipset 6.2 CompactPCI* Reference Heatsink Intel has also developed a reference thermal solution compatible with the CompactPCI* form factor....

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 30 Order Number: 318676-003US 6.2.2 Thermal Solution Performance Characteristics Figure 22 shows the performance of the CompactPCI* reference heatsink. This figure...

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 31 Intel ® 5100 MCH Chipset Appendix A Mechanical Drawings Table 9 lists the mechanical drawings included in this appendix. Table 9. Mechanical Drawing List Draw...

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 32 Order Number: 318676-003US Figure 23. AdvancedTCA* Heatsink Assembly Drawing

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 33 Intel ® 5100 MCH Chipset Figure 24. AdvancedTCA* Heatsink Drawing

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 34 Order Number: 318676-003US Figure 25. AdvancedTCA* Component Keepout Zone

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 35 Intel ® 5100 MCH Chipset Figure 26. CompactPCI* Heatsink Assembly Drawing

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 36 Order Number: 318676-003US Figure 27. CompactPCI* Heatsink Drawing

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 37 Intel ® 5100 MCH Chipset Figure 28. CompactPCI* Component Keepout Zone

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 38 Order Number: 318676-003US Figure 29. Torsional Clip Heatsink Clip Drawing

Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 39 Intel ® 5100 MCH Chipset Figure 30. TIM2 Drawing

Intel ® 5100 MCH Chipset Intel ® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 40 Order Number: 318676-003US Appendix B Thermal Solution Component Suppliers Table 10. MCH Torsional Clip Heatsink Thermal Solution Part Intel Part Number Supplie...