Intel 5000 - Manuals

6 Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide Revision Table §§ Revision Number Description Date -001 Initial release of the document. May 2006

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 7 Introduction 1 Introduction As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical metho...

Introduction 8 Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 1.2 Definition of Terms BGA Ball grid array. A package type, defined by a resin-fiber substrate, onto which a die is mounted, bonded and encapsulated in molding compound. The primary electrical inte...

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 9 Introduction T case_min Minimum IHS temperature allowed. This temperature is measured at the geometric center of the top of IHS. TDP Thermal design power. Thermal solutions should be designed to dissipate this t...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 11 Packaging Technology 2 Packaging Technology Intel 5000 Series chipset consist of three individual components: the Memory Controller Hub (MCH), the Intel ® 6700PXH 64-bit PCI Hub (PXH) and the Intel ® 631xESB/632xESB I/O Con...

Packaging Technology 12 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Notes: 1. All dimensions are in millimeters. 2. All dimensions and tolerances conform to ANSI Y14.5M-1994. 2.1 Package Mechanical Requirements The Intel 5000 Series chipset MCH package has an integrated...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 13 Thermal Specifications 3 Thermal Specifications 3.1 Thermal Design Power (TDP) Analysis indicates that real applications are unlikely to cause the MCH component to consume maximum power dissipation for sustained time period...

Thermal Specifications 14 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Note: These specifications are based on preliminary silicon characterization, however, they may be updated as further data becomes available. § Table 3-3. Intel® 5000X Chipset MCH Thermal Specificatio...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 15 Thermal Simulation 4 Thermal Simulation Intel provides thermal simulation models of the Intel 5000 Series chipset MCH and associated user’s guides to aid system designers in simulating, analyzing, and optimizing their therm...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 17 Thermal Metrology 5 Thermal Metrology The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure t...

Thermal Metrology 18 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Note: 1. Three axes set consists of (1ea. U-31CF), (1ea. UX-6-6), (1ea. USM6) and (1ea. UPN-1). More information available at: http://www.narishige.co.jp/you_ltd/english/products/set/you-set.htm#3. 5.1.2 T...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 19 Thermal Metrology 5.1.4 Thermocouple Conditioning and Preparation 1. Use a calibrated thermocouple as specified in Table 5-1 . 2. Measure the thermocouple resistance by holding both wires on one probe and the tip of thermoc...

Thermal Metrology 20 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 5.1.5 Thermocouple Attachment to the IHS Caution: To avoid the impact on the thermocouple during the SMT process, reflow must be performed before attaching the thermocouple to the grooved MCH IHS. 1. Clean...

Thermal Metrology 22 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Figure 5-6. Position Bead on the Groove Step Figure 5-7. Using 3D Micromanipulator to Secure Bead Location Figure 5-8. Measuring Resistance between Thermocouple and IHS

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 23 Thermal Metrology 5.1.6 Curing Process 1. Let the thermocouple attach sit in the open air for at least half an hour. Using any curing accelerator like Loctite 7452 Accelerator* for this step is not recommended. Rapid contra...

Thermal Metrology 24 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 5.1.7 Thermocouple Wire Management Figure 5-10. Thermocouple Wire Management Groove Figure 5-11. Removing Excess Adhesive from the IHS Figure 5-12. Filling the Groove with Adhesive

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 25 Thermal Metrology Note: Prior to installing the heatsink, be sure that the thermocouple wires remain below the IHS top surface by running a flat blade on top of the IHS for example. 5.1.8 Power Simulation Software The power...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 27 Reference Thermal Solution 6 Reference Thermal Solution Intel has developed two different reference thermal solutions to meet the cooling needs of the Intel 5000 Series chipset MCH under operating environments and specifica...

Reference Thermal Solution 28 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 6.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 29 Reference Thermal Solution 6.5 Tall Torsional Clip Heatsink Thermal Solution Assembly The reference thermal solution for the chipset MCH is a passive extruded heatsink with thermal interface. It is attached using a clip wit...

Reference Thermal Solution 30 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Note: All dimensions are in inches. 6.5.1 Heatsink Orientation Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink ...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 31 Reference Thermal Solution 6.5.2 Extruded Heatsink Profiles The reference thermal solution uses an extruded heatsink for cooling the chipset MCH. Figure 6-6 shows the heatsink profile. Appendix A, “Thermal Solution Componen...

Reference Thermal Solution 32 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 6.5.6 Clip Retention Anchors For Intel 5000 Series chipset-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention o...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 35 Reference Thermal Solution 2 7 Reference Thermal Solution 2 Intel has developed two different reference thermal solutions to meet the cooling needs of the Intel 5000 Series chipset MCH under operating environments and speci...

Reference Thermal Solution 2 36 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 7.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically plac...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 37 Reference Thermal Solution 2 7.5 Short Torsional Clip Heatsink Thermal Solution Assembly The reference thermal solution for the chipset MCH is a passive extruded heatsink with thermal interface. It is attached using a clip ...

Reference Thermal Solution 2 38 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Note: NOTE: All dimensions are in inches. 7.5.1 Heatsink Orientation Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the h...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 39 Reference Thermal Solution 2 7.5.2 Extruded Heatsink Profiles The reference thermal solution uses an extruded heatsink for cooling the chipset MCH. Figure 7-6 shows the heatsink profile. Appendix A, “Thermal Solution Compon...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 41 Thermal Solution Component Suppliers A Thermal Solution Component Suppliers A.1 Tall Torsional Clip Heatsink Thermal Solution Note: The enabled components may not be currently available from all suppliers. Contact the suppl...

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 43 Mechanical Drawings B Mechanical Drawings Table B-1 lists the mechanical drawings included in this appendix. Table B-1. Mechanical Drawing List Drawing Name Figure Number Tall Torsional Clip Heatsink Assembly Drawing Figure...

Mechanical Drawings 44 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Figure B-1. Tall Torsional Clip Heatsink Assembly Drawing

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 47 Mechanical Drawings Figure B-4. Tall Torsional Clip Heatsink Clip Drawing

Mechanical Drawings 48 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Figure B-5. Short Torsional Clip Heatsink Assembly Drawing

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 51 Mechanical Drawings Figure B-8. Short Torsional Clip Heatsink Clip Drawing