KINGSTON 3200 - User Manual

DESCRIPTION

Document No. 4810470A 03/11/22 Page 1

SPECIFICATIONS

*See IDD Specifications (page 2)

Continued >>

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FEATURES

Kingston's KSM32RD4/64MFR is a 8G x 72-bit (64GB)
DDR4-3200 CL22 SDRAM (Synchronous DRAM) registered w/
parity, 2Rx4, ECC, memory module, based on thiry-six 4G x
4-bit FBGA components. The SPD is programmed to JEDEC
standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each
288-pin DIMM uses gold contact fingers. The electrical and
mechanical specifications are as follows:

• Power Supply: VDD = 1.2V

• VDDQ = 1.2V

• VPP = 2.5V

• VDDSPD = 2.41V to 2.75V

• Functionality and operations comply with the DDR4 SDRAM datasheet

• 16 internal banks

• Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for
the banks in the same or different bank group accesses are available

• Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600

• Bi-Directional Differential Data Strobe

• 8 bit pre-fetch

• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)

• Supports ECC error correction and detection

• On-Die Termination (ODT)

• Temperature sensor with integrated SPD

• This product is in compliance with the RoHS directive.

• Per DRAM Addressability is supported

• Internal Vref DQ level generation is available

• Write CRC is supported at all speed grades

• CA parity (Command/Address Parity) mode is supported

CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature

22cycles
45.75ns(min.)
350ns(min.)

32ns(min.)
*
94 V - 0
0

o

C to +85

o

C

-55

o

C to +100

o

C

Memory Module Speci

fi

cations

KSM32RD4/64MFR

64GB 2Rx4 8G x 72-Bit PC4-3200
CL22 Registered w/Parity 288-Pin DIMM

Module Assembly

DRAM:

MICRON (F-DIE)

RCD:

Rambus