KINGSTON 3200 - User Manual
The Kingston KSM32RD4/64MFR is a high-performance DDR4 memory module designed for computing systems requiring reliable storage solutions. This document covers its key specifications–such as capacity (64GB), speed (DDR4-3200), and technical attributes like ECC support, bank grouping, and compliance with environmental standards like RoHS. It also addresses operational requirements, including voltage, temperature tolerances, and component-level details like DRAM and RCD manufacturer information. The accompanying pages provide supplementary data: electrical specifications for power or signal interfaces (e.g., current ratings) and precise physical dimensions for installation compatibility. Together, these elements define the module’s technical foundation for integration into compatible systems.
Table of Contents:
- Page 1 – Memory Module Specifications and Features
- Page 2 – Input/Output Device Electrical Specifications
- Page 3 – Physical Dimensions of Memory Module
DESCRIPTION
Document No. 4810470A 03/11/22 Page 1
SPECIFICATIONS
*See IDD Specifications (page 2)
Continued >>
kingston.com
FEATURES
Kingston's KSM32RD4/64MFR is a 8G x 72-bit (64GB)
DDR4-3200 CL22 SDRAM (Synchronous DRAM) registered w/
parity, 2Rx4, ECC, memory module, based on thiry-six 4G x
4-bit FBGA components. The SPD is programmed to JEDEC
standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each
288-pin DIMM uses gold contact fingers. The electrical and
mechanical specifications are as follows:
• Power Supply: VDD = 1.2V
• VDDQ = 1.2V
• VPP = 2.5V
• VDDSPD = 2.41V to 2.75V
• Functionality and operations comply with the DDR4 SDRAM datasheet
• 16 internal banks
• Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for
the banks in the same or different bank group accesses are available
• Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Supports ECC error correction and detection
• On-Die Termination (ODT)
• Temperature sensor with integrated SPD
• This product is in compliance with the RoHS directive.
• Per DRAM Addressability is supported
• Internal Vref DQ level generation is available
• Write CRC is supported at all speed grades
• CA parity (Command/Address Parity) mode is supported
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
22cycles
45.75ns(min.)
350ns(min.)
32ns(min.)
*
94 V - 0
0
o
C to +85
o
C
-55
o
C to +100
o
C
Memory Module Speci
fi
cations
KSM32RD4/64MFR
64GB 2Rx4 8G x 72-Bit PC4-3200
CL22 Registered w/Parity 288-Pin DIMM
Module Assembly
DRAM:
MICRON (F-DIE)
RCD:
Rambus
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About this manual
- Brand
- KINGSTON
- Model
- 3200
- Document type
- User Manual
- Category
- RAM & Storage
- Language(s)
- English
- Pages
- 3
- File size
- 233.7 KB
- Format
Summary
Technical specifications for the 64GB DDR4-3200 SDRAM module, including CL latency, operating voltage, temperature ranges, ECC support, bank grouping, RoHS compliance, and component manufacturers.
Electrical current values in milliamps for various symbols related to power or signal requirements for the Kingston product.
Physical dimensions and measurements in millimeters, including annotated technical drawings for the memory module.
