KINGSTON 2400 - User Manual

KINGSTON 2400

The Kingston KSM24RD4/32MEI is a high-performance DDR4 memory module designed for modern computing systems, covering its technical specifications and operational requirements in this document. The manual highlights key aspects such as voltage ratings, temperature limits, and data transfer capabilities–including ECC support and bank grouping–to ensure compatibility with compatible hardware. Physical dimensions and pin tolerances are also provided to aid installation and verification of fit within motherboards. Electrical input/output profiles for specific configurations further clarify its operational constraints.

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Table of Contents:

  • Page 1 – Memory Module Technical Specifications
  • Page 2 – Input/Output Device Electrical Specifications
  • Page 3 – Physical Dimensions of Memory Module
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Page 1

DESCRIPTION

Document No. 4808541B 09/27/18 Page 1

SPECIFICATIONS

*See IDD Specifications (page 2)

Continued >>

kingston.com

FEATURES

Kingston's KSM24RD4/32MEI is a 4G x 72-bit (32GB)

DDR4-2400 CL17 SDRAM (Synchronous DRAM) registered w/

parity, 2Rx4, ECC, memory module, based on thirty-six 2G x

4-bit FBGA components. The SPD is programmed to JEDEC

standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each

288-pin DIMM uses gold contact fingers. The electrical and

mechanical specifications are as follows:

• Power Supply: VDD = 1.2V

• VDDQ = 1.2V

• VPP = 2.5V

• VDDSPD = 2.25V to 2.75V

• Functionality and operations comply with the DDR4 SDRAM datasheet

• 16 internal banks

• Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for

the banks in the same or different bank group accesses are available

• Data transfer rates: PC4-2400, PC4-2133, PC4-1866, PC4-1600

• Bi-Directional Differential Data Strobe

• 8 bit pre-fetch

• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)

• Supports ECC error correction and detection

• On-Die Termination (ODT)

• Temperature sensor with integrated SPD

• This product is in compliance with the RoHS directive.

• Per DRAM Addressability is supported

• Internal Vref DQ level generation is available

• Write CRC is supported at all speed grades

• CA parity (Command/Address Parity) mode is supported

CL(IDD)

Row Cycle Time (tRCmin)

Refresh to Active/Refresh
Command Time (tRFCmin)

Row Active Time (tRASmin)

Maximum Operating Power

UL Rating

Operating Temperature

Storage Temperature

17 cycles

46.16ns(min.)

350ns(min.)

32ns(min.)

*

94 V - 0

0

o

C to +85

o

C

-55

o

C to +100

o

C

Memory Module Specifi cations

KSM24RD4/32MEI

32GB 2Rx4 4G x 72-Bit PC4-2400
CL17 Registered w/Parity 288-Pin DIMM

Module Assembly

DRAM:

MICRON (E-DIE)

RCD:

IDT

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About this manual

Brand
KINGSTON
Model
2400
Document type
User Manual
Category
RAM & Storage
Language(s)
English
Pages
3
File size
54.5 KB
Format
PDF

Summary

Page 1 - Memory Module Technical Specifications

Technical specifications for the 32GB DDR4-2400 SDRAM memory module, including CL latency, operating voltage, temperature ranges, ECC support, bank grouping, data transfer rates, and component manufacturers.

Page 2 - Input/Output Device Electrical Specifications

Electrical specifications detailing current values in milliamperes for various symbols under the 2400 column.

Page 3 - Physical Dimensions of Memory Module

Physical dimensions and precise millimeter measurements, including tolerances for pins, edges, and chamfers on top and side views of the memory module.

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