Cypress CYDC064B08 - Manual

Cypress CYDC064B08

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Table of Contents:

  • Page 2 – Figure 1. Top Level Block Diagram
  • Page 3 – Pin Configurations
  • Page 5 – Functional Description; Table 1; Pin Definitions
  • Page 6 – Table 3; Output Drive Register; Table 4; Semaphore Operation; Table 5
  • Page 7 – Architecture
  • Page 9 – Electrical Characteristics for V; CC
  • Page 10 – Parameter
  • Page 13 – Write Cycle; GND
  • Page 14 – Switching Characteristics for V
  • Page 18 – Switching Waveforms
  • Page 23 – Interrupt Timing Diagrams; Right Side Clears INT
  • Page 24 – Ordering Information
  • Page 25 – Package Diagram
  • Page 26 – Document History Page; x 8 ConsuMoBL Dual-Port Static RAM
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1.8V 4k/8k/16k x 16 and 8k/16k x 8

ConsuMoBL Dual-Port Static RAM

CYDC256B16, CYDC128B16,
CYDC064B16, CYDC128B08,

CYDC064B08

Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document #: 001-01638 Rev. *E

Revised January 25, 2007

Features

• True dual-ported memory cells which allow simulta-

neous access of the same memory location

• 4/8/16k × 16 and 8/16k × 8 organization
• High-speed access: 40 ns
• Ultra Low operating power

— Active: I

CC

= 15 mA (typical) at 55 ns

— Active: I

CC

= 25 mA (typical) at 40 ns

— Standby: I

SB3

= 2

µ

A (typical)

• Port-independent 1.8V, 2.5V, and 3.0V I/Os

• Lead (Pb)-free 14 x 14 x 1.4 mm 100-pin TQFP Package
• Full asynchronous operation
• Pin select for Master or Slave
• Expandable data bus to 32 bits with Master/Slave chip

select when using more than one device

• On-chip arbitration logic
• On-chip semaphore logic
• Input Read Registers and Output Drive Registers
• INT flag for port-to-port communication
• Separate upper-byte and lower-byte control
• Commercial and industrial temperature ranges

Selection Guide for V

CC

= 1.8V

CYDC256B16, CYDC128B16,

CYDC064B16, CYDC128B08,

CYDC064B08

-40

CYDC256B16, CYDC128B16,

CYDC064B16, CYDC128B08,

CYDC064B08

-55

Unit

Port I/O Voltages (P1-P2)

1.8V-1.8V

1.8V-1.8V

Maximum Access Time

40

55

ns

Typical Operating Current

25

15

mA

Typical Standby Current for I

SB1

2

2

µ

A

Typical Standby Current for I

SB3

2

2

µ

A

Selection Guide for V

CC

= 2.5V

CYDC256B16, CYDC128B16,

CYDC064B16, CYDC128B08,

CYDC064B08

-40

CYDC256B16, CYDC128B16,

CYDC064B16, CYDC128B08,

CYDC064B08

-55

Unit

Port I/O Voltages (P1-P2)

2.5V-2.5V

2.5V-2.5V

Maximum Access Time

40

55

ns

Typical Operating Current

39

28

mA

Typical Standby Current for I

SB1

6

6

µ

A

Typical Standby Current for I

SB3

4

4

µ

A

Selection Guide for V

CC

= 3.0V

CYDC256B16, CYDC128B16,

CYDC064B16, CYDC128B08,

CYDC064B08

-40

CYDC256B16, CYDC128B16,

CYDC064B16, CYDC128B08,

CYDC064B08

-55

Unit

Port I/O Voltages (P1-P2)

3.0V-3.0V

3.0V-3.0V

Maximum Access Time

40

55

ns

Typical Operating Current

49

42

mA

Typical Standby Current for I

SB1

7

7

µ

A

Typical Standby Current for I

SB3

6

6

µ

A

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Summary

Page 2 - Figure 1. Top Level Block Diagram

CYDC256B16, CYDC128B16,CYDC064B16, CYDC128B08, CYDC064B08 Document #: 001-01638 Rev. *E Page 2 of 26 Notes: 1. A 0 –A 11 for 4k devices; A 0 –A 12 for 8k devices; A 0 –A 13 for 16k devices. 2. BUSY is an output in master mode and an input in slave mode. IO Control Address Decode Mailboxes INT L INT ...

Page 3 - Pin Configurations

CYDC256B16, CYDC128B16,CYDC064B16, CYDC128B08, CYDC064B08 Document #: 001-01638 Rev. *E Page 3 of 26 Pin Configurations [3, 4, 5, 6, 7] Notes: 3. A12L and A12R are NC pins for CYDC064B16.4. IRR functionality is not supported for the CYDC256B16 device. 5. This pin is A13L for CYDC256B16 device.6. Thi...

Page 5 - Functional Description; Table 1; Pin Definitions

CYDC256B16, CYDC128B16,CYDC064B16, CYDC128B08, CYDC064B08 Document #: 001-01638 Rev. *E Page 5 of 26 Functional Description The CYDC256B16, CYDC128B16, CYDC064B16, CYDC128B08, CYDC064B08 are low-power CMOS 4k, 8k,16k x 16, and 8/16k x 8 dual-port static RAMs. Arbitration schemes are included on the ...

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