Cypress CY7C1440AV33 - Manual
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Table of Contents:
- Page 4 – Pin Configurations
- Page 5 – TMS
- Page 7 – Pin Definitions
- Page 8 – Functional Overview; Single Read Accesses
- Page 9 – DD; ZZ Mode Electrical Characteristics
- Page 11 – Disabling the JTAG Feature; TAP Controller State Diagram; GW
- Page 12 – Performing a TAP Reset; A RESET is performed by forcing TMS HIGH (V; TAP Registers; ) when the BYPASS instruction is executed.; TAP Instruction Set; and t; or to the selection of another boundary scan test operation.
- Page 13 – TAP Timing; Test Clock
- Page 14 – TAP AC Switching Characteristics; TDO
- Page 17 – 09-ball FBGA Boundary Scan Order; ball ID; Internal
- Page 18 – Electrical Characteristics
- Page 19 – Capacitance; Thermal Resistance; AC Test Loads and Waveforms
- Page 20 – Switching Characteristics
- Page 21 – Switching Waveforms; Read Cycle Timing
- Page 22 – Write Cycle Timing
- Page 23 – Read/Write Cycle Timing
- Page 24 – ZZ Mode Timing; CLK
- Page 25 – Ordering Information; Commercial
- Page 27 – Package Diagrams
- Page 30 – Document History Page; SRAM
- Page 31 – Changed t; from 5 ns to 10 ns in TAP
36-Mbit (1M x 36/2M x 18/512K x 72)
Pipelined Sync SRAM
CY7C1440AV33
CY7C1442AV33
CY7C1446AV33
Cypress Semiconductor Corporation
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Document #: 38-05383 Rev. *E
Revised June 23, 2006
Features
• Supports bus operation up to 250 MHz
• Available speed grades are 250, 200 and 167 MHz
• Registered inputs and outputs for pipelined operation
• 3.3V core power supply
• 2.5V/3.3V I/O power supply
• Fast clock-to-output times
— 2.6 ns (for 250-MHz device)
• Provide high-performance 3-1-1-1 access rate
•
User-selectable burst counter supporting Intel
®
Pentium
®
interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed writes
• Asynchronous output enable
• Single Cycle Chip Deselect
• CY7C1440AV33, CY7C1442AV33 available in lead-free
100-pin TQFP package, lead-free and non-lead-free
165-ball FBGA package. CY7C1446AV33 available in
lead-free and non-lead-free 209-ball FBGA package
• Also available in lead-free packages
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• “ZZ” Sleep Mode Option
Functional Description
[1]
The CY7C1440AV33/CY7C1442AV33/CY7C1446AV33 SRAM
integrates 1M x 36/2M x 18 and 512K x 72 SRAM cells with
advanced synchronous peripheral circuitry and a two-bit
counter for internal burst operation. All synchronous inputs are
gated by registers controlled by a positive-edge-triggered
Clock Input (CLK). The synchronous inputs include all
addresses, all data inputs, address-pipelining Chip Enable
(CE
1
), depth-expansion Chip Enables (CE
2
and
CE
3
), Burst
Control inputs (ADSC, ADSP, and ADV), Write Enables (BW
X
and BWE), and Global Write (GW). Asynchronous inputs
include the Output Enable (OE) and the ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle.This part supports Byte Write
operations (see Pin Descriptions and Truth Table for further
details). Write cycles can be one to two or four bytes wide as
controlled by the byte write control inputs. GW when active
LOW causes all bytes to be written.
The CY7C1440AV33/CY7C1442AV33/CY7C1446AV33
operates from a +3.3V core power supply while all outputs may
operate with either a +2.5 or +3.3V supply. All inputs and
outputs are JEDEC-standard JESD8-5-compatible.
Selection Guide
250 MHz
200 MHz
167 MHz
Unit
Maximum Access Time
2.6
3.2
3.4
ns
Maximum Operating Current
475
425
375
mA
Maximum CMOS Standby Current
120
120
120
mA
Note:
1. For best-practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
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Summary
CY7C1440AV33CY7C1442AV33CY7C1446AV33 Document #: 38-05383 Rev. *E Page 4 of 31 Pin Configurations DQP B DQ B DQ B V DDQ V SSQ DQ B DQ B DQ B DQ B V SSQ V DDQ DQ B DQ B V SS NCV DD ZZDQ A DQ A V DDQ V SSQ DQ A DQ A DQ A DQ A V SSQ V DDQ DQ A DQ A DQP A DQP C DQ C DQc V DDQ V SSQ DQ C DQ C DQ C DQ C V...
CY7C1440AV33CY7C1442AV33CY7C1446AV33 Document #: 38-05383 Rev. *E Page 5 of 31 Pin Configurations (continued) 165-ball FBGA (15 x 17 x 1.4 mm) Pinout CY7C1440AV33 (1M x 36) 2 3 4 5 6 7 1 A B CD E F G H J K L M N P R TDO NC/288M NC/144M DQP C DQ C DQP D NC DQ D CE 1 BW B CE 3 BW C BWE A CE2 DQ C DQ D...
CY7C1440AV33CY7C1442AV33CY7C1446AV33 Document #: 38-05383 Rev. *E Page 7 of 31 CE 2 Input- Synchronous Chip Enable 2 Input, active HIGH . Sampled on the rising edge of CLK. Used in conjunction with CE 1 and CE 3 to select/deselect the device. CE 2 is sampled only when a new external address is loade...