Cypress CY7C1380FV25 - Manual

Cypress CY7C1380FV25

Cypress CY7C1380FV25 – Manual, read for free online in PDF format. We hope this helps you resolve any issues you may have. If you have further questions, please contact us through the contact form.

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Table of Contents:

  • Page 3 – Pin Configurations
  • Page 5 – TMS
  • Page 6 – Pin Definitions
  • Page 8 – Linear Burst Address Table
  • Page 9 – Truth Table
  • Page 11 – Disabling the JTAG Feature; TAP Controller State Diagram; Performing a TAP Reset; TAP Registers; Instruction Register
  • Page 12 – Identification Register; TAP Instruction Set; Identification
  • Page 13 – Reserved; TAP Timing
  • Page 14 – TDO; TAP DC Electrical Characteristics And Operating Conditions
  • Page 16 – 65-Ball BGA Boundary Scan Order; Ball ID; Internal
  • Page 17 – Electrical Characteristics
  • Page 19 – Switching Characteristics
  • Page 20 – Switching Waveforms; Read Cycle Timing
  • Page 21 – Write Cycle Timing
  • Page 22 – Read/Write Cycle Timing
  • Page 23 – ZZ Mode Timing
  • Page 24 – Ordering Information; for actual products offered.
  • Page 26 – Package Diagrams
  • Page 29 – Document History Page; SRAM
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18-Mbit (512K x 36/1M x 18) Pipelined SRAM

CY7C1380DV25, CY7C1380FV25
CY7C1382DV25, CY7C1382FV25

Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document #: 38-05546 Rev. *E

Revised Feburary 15, 2007

Features

• Supports bus operation up to 250 MHz
• Available speed grades are 250, 200, and 167 MHz
• Registered inputs and outputs for pipelined operation
• 2.5V core power supply
• Fast clock-to-output times, 2.6 ns (for 250-MHz device)
• Provides high-performance 3-1-1-1 access rate
• User selectable burst counter supporting Intel

®

Pentium

®

interleaved or linear burst sequences

• Separate processor and controller address strobes
• Synchronous self timed writes
• Asynchronous output enable
• Single Cycle Chip Deselect
• CY7C1380DV25/CY7C1382DV25 available in

JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non
Pb-free 165-ball FBGA package.
CY7C1380FV25/CY7C1382FV25 available in Pb-free and
non Pb-free 119-ball BGA package

• IEEE 1149.1 JTAG-Compatible Boundary Scan
• ZZ sleep mode option

Functional Description

[1]

The CY7C1380DV25/CY7C1382DV25/CY7C1380FV25/
CY7C1382FV25 SRAM integrates 512K x 36 and 1M x 18
SRAM cells with advanced synchronous peripheral circuitry
and a two-bit counter for internal burst operation. All
synchronous inputs are gated by registers controlled by a
positive edge triggered clock input (CLK). The synchronous
inputs include all addresses, all data inputs, address-pipelining
chip enable (CE

1

), depth expansion chip enables (CE

2

and

CE

3

[2]

), burst control inputs (ADSC, ADSP, and ADV), write

enables (BW

X

, and BWE), and global write (GW).

Asynchronous inputs include the output enable (OE) and the
ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when either address strobe processor (ADSP) or
address strobe controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the advance pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self timed write cycle.This part supports byte write
operations (see

Pin Definitions on page 6

and

Truth Table

[4,

5, 6, 7, 8]

on page 9

for further details). Write cycles can be one

to two or four bytes wide as controlled by the byte write control
inputs. GW when active LOW causes all bytes to be written.
The CY7C1380DV25/CY7C1382DV25/CY7C1380FV25/
CY7C1382FV25 operates from a +2.5V core power supply
while all outputs may operate with a +2.5 supply. All inputs and
outputs are JEDEC-standard and JESD8-5-compatible.

Selection Guide

250 MHz

200 MHz

167 MHz

Unit

Maximum Access Time

2.6

3.0

3.4

ns

Maximum Operating Current

350

300

275

mA

Maximum CMOS Standby Current

70

70

70

mA

Notes:

1. For best practices or recommendations, please refer to the Cypress application note AN1064,

SRAM System Design Guidelines

on

www.cypress.com

.

2. CE

3

, CE

2

are for TQFP and 165 FBGA packages only. 119 BGA is offered only in 1 chip enable

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Summary

Page 3 - Pin Configurations

CY7C1380DV25, CY7C1380FV25CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev. *E Page 3 of 29 Pin Configurations A A A A A 1 A 0 NC/ 72M NC/ 36M V SS V DD A A A A A A A A DQP B DQ B DQ B V DDQ V SSQ DQ B DQ B DQ B DQ B V SSQ V DDQ DQ B DQ B V SS NCV DD ZZDQ A DQ A V DDQ V SSQ DQ A DQ A DQ A DQ A V ...

Page 5 - TMS

CY7C1380DV25, CY7C1380FV25CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev. *E Page 5 of 29 Pin Configurations (continued) 165-Ball FBGA Pinout (3 Chip Enable) CY7C1380DV25 (512K x 36) 2 3 4 5 6 7 1 ABCD E F G H J K L M N P R TDO NC/288MNC/144M DQP C DQ C DQP D NC DQ D CE 1 BW B CE 3 BW C BWE A C...

Page 6 - Pin Definitions

CY7C1380DV25, CY7C1380FV25CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev. *E Page 6 of 29 Pin Definitions Name IO Description A 0 , A 1 , A Input- Synchronous Address inputs used to select one of the address locations . Sampled at the rising edge of the CLK if ADSP or ADSC is active LOW, and CE...

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