Cypress CY62128B - Manual
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Table of Contents:
- Page 2 – MoBL; Pin Configurations; Pin Definitions; CC; Top View; SOIC
- Page 3 – Maximum Ratings; Electrical Characteristics
- Page 4 – Thermal Resistance; Data Retention Waveform
- Page 5 – Switching Characteristics; Parameter; Switching Waveforms; PREVIOUS DATA VALID; ADDRESS
- Page 6 – or CE
- Page 8 – Truth Table; Ordering Information
- Page 9 – Package Diagrams
- Page 10 – 2-Lead Reverse Thin Small Outline Package ZR32
- Page 11 – Document History Page; Issue
1-Mbit (128K x 8) Static RAM
CY62128B
MoBL
®
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
,
CA 95134
•
408-943-2600
Document #: 38-05300 Rev. *C
Revised March 7, 2005
Features
• Temperature Ranges
— Commercial: 0°C to 70°C
— Industrial: –40°C to 85°C
— Automotive: –40°C to 125°C
• 4.5V–5.5V operation
• CMOS for optimum speed/power
• Low active power
(70 ns, LL version, Commercial, Industrial)
— 82.5 mW (max.) (15 mA)
• Low standby power
(70 ns, LL version, Commercial, Industrial)
— 110
µ
W (max.) (15
µ
A)
• Automatic power-down when deselected
• TTL-compatible inputs and outputs
• Easy memory expansion with CE
1
, CE
2
, and OE options
Functional Description
[1]
The CY62128B is a high-performance CMOS static RAM
organized as 131,072 words by 8 bits. Easy memory
expansion is provided by an active LOW Chip Enable (CE
1
),
an active HIGH Chip Enable (CE
2
), an active LOW Output
Enable (OE), and three-state drivers. This device has an
automatic power-down feature that reduces power
consumption by more than 75% when deselected.
Writing to the device is accomplished by taking Chip Enable
One (CE
1
) and Write Enable (WE) inputs LOW and Chip
Enable Two (CE
2
) input HIGH. Data on the eight I/O pins (I/O
0
through I/O
7
) is then written into the location specified on the
address pins (A
0
through A
16
).
Reading from the device is accomplished by taking Chip
Enable One (CE
1
) and Output Enable (OE) LOW while forcing
Write Enable (WE) and Chip Enable Two (CE
2
) HIGH. Under
these conditions, the contents of the memory location
specified by the address pins will appear on the I/O pins.
The eight input/output pins (I/O
0
through I/O
7
) are placed in a
high-impedance state when the device is deselected (CE
1
HIGH or CE
2
LOW), the outputs are disabled (OE HIGH), or
during a write operation (CE
1
LOW, CE
2
HIGH, and WE LOW).
The CY62128B is available in a standard 450-mil-wide SOIC,
32-pin TSOP type I and STSOP packages.
Note:
1.
For best-practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
14
15
Logic Block Diagram
A1
A2
A3
A4
A5
A6
A7
A8
COLUMN
DECODER
RO
W
D
E
CO
D
E
R
SE
NS
E AMP
S
INPUT BUFFER
POWER
DOWN
WE
OE
I/O 0
CE2
I/O 1
I/O 2
I/O 3
512x 256x 8
ARRAY
I/O 7
I/O 6
I/O 5
I/O 4
A0
A
11
A
13
A
12
A
A
10
CE1
A
A
16
A
9
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Summary
CY62128B MoBL ® Document #: 38-05300 Rev. *C Page 2 of 11 Pin Configurations Product Portfolio Product V CC Range (V) Speed (ns) Power Dissipation Operating, I CC (mA) Standby, I SB2 ( µ A) Min. Typ. [2] Max. Typ. [2] Max. Typ. [2] Max. CY62128BLL Industrial 4.5 5.0 5.5 55 7.5 20 2.5 15 Industrial 7...
CY62128B MoBL ® Document #: 38-05300 Rev. *C Page 3 of 11 Maximum Ratings (Above which the useful life may be impaired. For user guide-lines, not tested.) Storage Temperature ................................. –65 ° C to +150 ° C Ambient Temperature withPower Applied ....................................
CY62128B MoBL ® Document #: 38-05300 Rev. *C Page 4 of 11 Thermal Resistance [6] Parameter Description Test Conditions 32 SOIC 32 TSOP 32 STSOP 32 RTSOP Unit Θ JA Thermal Resistance(Junction to Ambient) Test conditions follow standard test methods and procedures for measuring thermal impedance, per ...
