Cypress CY62126EV30 - Manual

Cypress CY62126EV30

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Table of Contents:

  • Page 2 – MoBL; Pin Configurations; CC
  • Page 3 – Maximum Ratings; Electrical Characteristics
  • Page 4 – Thermal Resistance; DATA RETENTION MODE; CE
  • Page 5 – Switching Characteristics
  • Page 6 – Switching Waveforms; PREVIOUS DATA VALID; ADDRESS
  • Page 9 – Truth Table
  • Page 10 – Package Diagrams
  • Page 12 – Document History Page; Date
  • Page 13 – Worldwide Sales and Design Support
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MoBL

®

,CY62126EV30

1-Mbit (64K x 16) Static RAM

Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document #: 38-05486 Rev. *E

Revised January 5, 2009

Features

High speed: 45 ns

Temperature ranges

Industrial: –40°C to +85°C

Automotive: –40°C to +125°C

Wide voltage range: 2.2V to 3.6V

Pin compatible with CY62126DV30

Ultra low standby power

Typical standby current: 1

μ

A

Maximum standby current: 4

μ

A

Ultra low active power

Typical active current: 1.3 mA at f = 1 MHz

Easy memory expansion with CE and OE features

Automatic power down when deselected

CMOS for optimum speed and power

Offered in Pb-free 48-ball VFBGA and 44-pin TSOP II

packages

Functional Description

The CY62126EV30 is a high performance CMOS static RAM

organized as 64K words by 16 bits

[1]

. This device features

advanced circuit design to provide ultra low active current. This

is ideal for providing More Battery Life

(MoBL

®

) in portable

applications such as cellular telephones. The device also has an

automatic power down feature that significantly reduces power

consumption when addresses are not toggling. Placing the

device in standby mode reduces power consumption by more

than 99 percent when deselected (CE HIGH). The input and

output pins (IO

0

through IO

15

) are placed in a high impedance

state when:

Deselected (CE HIGH)

Outputs are disabled (OE HIGH)

Both Byte High Enable and Byte Low Enable are disabled

(BHE, BLE HIGH)

Write operation is active (CE LOW and WE LOW)

To write to the device, take Chip Enable (CE) and Write Enable

(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data

from IO pins (IO

0

through IO

7

) is written into the location

specified on the address pins (A

0

through A

15

). If Byte High

Enable (BHE) is LOW, then data from IO pins (IO

8

through IO

15

)

is written into the location specified on the address pins (A

0

through A

15

).

To read from the device, take Chip Enable (CE) and Output

Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If

Byte Low Enable (BLE) is LOW, then data from the memory

location specified by the address pins appear on IO

0

to IO

7

. If

Byte High Enable (BHE) is LOW, then data from memory

appears on IO

8

to IO

15

. See the

“Truth Table”

on page 9 for a

complete description of read and write modes.

Note

1. For best practice recommendations, refer to the Cypress application note

AN1064, SRAM System Guidelines.

Logic Block Diagram

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Summary

Page 2 - MoBL; Pin Configurations; CC

MoBL ® , CY62126EV30 Document #: 38-05486 Rev. *E Page 2 of 13 Pin Configurations Figure 1. 44-Ball VFBGA (Top View) Figure 2. 44-Pin TSOP II (Top View) [2] Table 1. Product Portfolio Notes 2. NC pins are not connected on the die.3. Typical values are included for reference only and are not guarante...

Page 3 - Maximum Ratings; Electrical Characteristics

MoBL ® , CY62126EV30 Document #: 38-05486 Rev. *E Page 3 of 13 Maximum Ratings Exceeding maximum ratings may shorten the battery life of the device. These user guidelines are not tested.Storage Temperature ................................. –65°C to +150°CAmbient Temperature with Power Applied .........

Page 4 - Thermal Resistance; DATA RETENTION MODE; CE

MoBL ® , CY62126EV30 Document #: 38-05486 Rev. *E Page 4 of 13 Thermal Resistance Tested initially and after any design or process changes that may affect these parameters. Parameter Description Test Conditions VFBGA Package TSOP II Package Unit Θ JA Thermal Resistance (Junction to Ambient) Still Ai...

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