Intel 273838-001 - Manuals

6 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Introduction Introduction 1 1.1 Document Objective This document is intended to aid system designers to properly implement a thermal management design to ensure reliable and efficient operation of the Intel ® 855GME a...

Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications 7 Introduction 1.3 Reference Documents Table 1. Related reference documents Document/Reference Title Source/Document Number Intel ® Pentium® M Processor For Embedded Applications Thermal Design Guide http://developer.in...

8 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Mechanical Reference Mechanical Reference 2 The Intel ® 855GME and Intel 852GME chipset MCHs are constructed with a Flip Chip Ball Grid Array (FCBGA) package with a size of 37.5 mm x 37.5 mm. It includes 732 solder ba...

Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications 9 Mechanical Reference Figure 2. 855GME and 852GME Chipset MCH Package Dimensions (mm) - Side View 1.27 0.7 1.0 0.61 0.73 Side View 1.27 0.7 1.0 0.61 0.73 Side View

10 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Computational Fluid Dynamics (CFD) Modeling Computational Fluid Dynamics (CFD) Modeling 3 3.1 855GM MCH Thermal Model A Computational Fluid Dynamics (CFD) thermal model of the 855GM chipset MCH has been developed to ...

Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications 11 Computational Fluid Dynamics (CFD) Modeling 3.2 Thermal Design Power (TDP) Values Use the following thermal design power (TDP) values when modeling based on the configuration that is being simulated. When designing f...

12 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Computational Fluid Dynamics (CFD) Modeling presented the copper content is assumed to be 10 percent of the overall volume of the motherboard. 4. Board-to-board spacing of 0.8”, consistent with the CompactPCI* specif...

Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications 13 Computational Fluid Dynamics (CFD) Modeling 3.6 Modeling Results – 852GME All boundary conditions evaluated will necessitate a heatsink for the 852GME chipset MCH. See Figure 6 for a graph of junction temperature (Tj...

14 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Reference Thermal Solution for 1U Applications Reference Thermal Solution for 1U Applications 4 4.1 Applications The thermal solution referenced in this chapter is valid for both the 855GME and 852GME when the system...

16 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Reference Thermal Solution for 1U Applications 4.3 Heatsink Assembly The 1U heatsink assembly includes the heatsink (with thermal interface material (TIM) and mechanical interface gasket), the clip, and clip lever as...

Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications 17 Reference Thermal Solution for 1U Applications 4.4 Mechanical Retention The heatsink is affixed to the die with a mechanical advantage clip. The clip consists of a clip frame that interfaces to the motherboard throug...

18 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Reference Thermal Solution for 1U Applications 4.5 Thermal Interface Material (TIM) and Thermal Bond Line A thermal interface material (TIM) is used to provide improved conductivity between the die and heatsink. The ...

20 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Reference Thermal Solution for CompactPCI* and Blade Applications Reference Thermal Solution for CompactPCI* and Blade Applications 5 5.1 Applications The thermal solution referenced in this chapter is valid for both...

22 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Reference Thermal Solution for CompactPCI* and Blade Applications 5.4 CompactPCI* Heatsink Assembly The CompactPCI heatsink assembly includes the heatsink an adhesive tape thermal interface material, and a protective...

Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications 25 Temperature Measurement Metrology Temperature Measurement Metrology 6 6.1 Case Temperature Measurements Intel has established guidelines for the proper techniques to be used when measuring chipset MCH case temperatur...

Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications 27 Thermal Management Features and Tools Thermal Management Features and Tools 7 7.1 Internal Temperature Sensor The Intel  855GME and 852GME chipset MCH will include an on die temperature sensor that can be used to pr...

28 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Thermal Management Features and Tools 7.3 TDP chipset MCH Stress Application Intel provides a TDP stress software tool that can be used to validate chipset MCH thermal solutions. The software tool will generate high ...

Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications 29 Thermal Management Features and Tools 7.5 Thermal Throttling Both the Intel  855GME and Intel  852GME chipset MCHs are available with throttling functionality to protect the chipset MCH from power virus conditions ...

Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications 31 Thermal Management Features and Tools 7.5.2 Temperature Triggered Throttling Temperature triggered throttling will limit the maximum achievable bandwidth as a safeguard against a thermal virus only when the junction ...

Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications 33 Thermal/Mechanical Applications Thermal/Mechanical Applications 8 8.1 Thermal Interface Materials Use of a Thermal Interface Material (TIM) between the chipset MCH package and the thermal enhancement is highly recomm...

34 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Thermal/Mechanical Applications 8.2 Mechanical Loading The pressure applied to the surface of the 855GME or 852GME MCH package should not exceed 100 psi. If the pressure on the surface of the chipset MCH package is e...

Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications 35 Summary Summary 9 The Intel ® 855GME and Intel ® 852GME Chipset Memory Controller Hub (MCH) Thermal Design Guide For Embedded Applications was developed to aid in creating adequate thermal designs that will insure re...

36 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Vendor Information Vendor Information A Table 6. 1U Reference Design Heatsink Assembly Suppliers (as referenced in Section 4) Part Intel Part Number Supplier Supplier Part Number Extruded Heatsink Pin Fin Heatsink A5...

38 Intel ® 855GME and Intel ® 852GME Thermal Design Guide for Embedded Applications Mechanical Drawings Mechanical Drawings B Table 8. Mechanical Drawing List Drawing Description Page Number Board Keep-out Restriction for 1U Reference Design 39 CompactPCI* Heatsink Assembly Drawing 40