AMD 8151 - Manual

AMD 8151

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Table of Contents:

  • Page 2 – AGP Tunnel Data Sheet
  • Page 3 – Table of Contents
  • Page 4 – List of Figures
  • Page 5 – List of Tables
  • Page 7 – Tunnel Link Signals; The following are signals associated with the HyperTransport
  • Page 8 – AGP Signals
  • Page 10 – Test and Miscellaneous Signals; volt power plane for the HyperTransport; technology pins. VDD12A provides power to; Power Plane Sequencing
  • Page 11 – Functional Operation; link interface. The other side; HyperTransport; AGP3.0 Graphics Tunnel Design Guide for addi-; Reset And Initialization; cold reset; Clocking
  • Page 12 – Tunnel Links; The IC requires three HyperTransport
  • Page 13 – Various Behaviors; Table 2: Translation from AGP requests to link requests.
  • Page 14 – Registers; busses; Register Naming and Description Conventions; AGP Device
  • Page 15 – AGP Device Configuration Registers
  • Page 18 – AGP Miscellaneous Control Register
  • Page 19 – AGP PHY Control Register; NCTL; NDATA: AGP falling edge drive strength control.; Read only. This provides the calculated value of the
  • Page 20 – AGP PHY Skew Control Register; PCTL; PDATA: AGP rising edge drive strength control.; Read only. This provides the calculated value of the ris-; Bits
  • Page 22 – AGP Command Register; Specifies the period between calibration cycles as follows:
  • Page 25 – Link Configuration And Control Register; side A and 8 bits wide for side B.
  • Page 26 – EXTCTL: extended control time during initialization.; receivers are disabled and the pins may float.
  • Page 28 – Link PHY Compensation Control Registers
  • Page 29 – Clock Control Register
  • Page 31 – AGP Bridge Bus Numbers And Secondary Latency Register; AGP prefetchable memory window =; Secondary latency timer. These bits control no hardware.
  • Page 32 – 6:16 Read only. These bits are fixed in their default state.
  • Page 34 – Electrical Data; deg C
  • Page 35 – DC Characteristics; See the HyperTransport; Table 9: DC characteristics for signals on the VDD33 power plane.
  • Page 37 – AC Characteristics; The following table shows AC specification data for clocks.; Table 13: AC data for common clock operation of AGP signals.
  • Page 38 – SymbolParameter Description; Table 14: AC data for clock-forwarded operation of AGP signals.
  • Page 39 – Ball Designations
  • Page 41 – Table 16: Power and ground BGA positions.
  • Page 42 – Package Specification
  • Page 43 – Test; The IC includes the following test modes.; High Impedance Mode; Operational; NAND Tree Mode
  • Page 45 – Appendix; • Removed Preliminary.; CMPOVR
Loading the manual

24888 Rev 3.03 - July 12, 2004

AMD-8151

TM

AGP Tunnel Data Sheet

1

Cover page

AMD-8151

TM

HyperTransport

TM

AGP3.0 Graphics Tunnel

Data Sheet

1

Overview

The

AMD-8151

TM

HyperTransport

TM

AGP3.0 Graphics Tunnel

(referred to as

the IC

in this document) is a

HyperTransport™ technology (referred to as

link

in this document) tunnel developed by AMD that provides an

AGP 3.0 compliant (8x transfer rate) bridge.

1.1

Device Features

HyperTransport technology tunnel with side A
and side B.

Side A is 16 bits (input and output); side B is
8 bits.

Either side may connect to the host or to a
downstream HyperTransport technology
compliant device.

Each side supports HyperTransport technol-
ogy-defined reduced bit widths: 8-bit, 4-bit,
and 2-bit.

Side A supports transfer rates of 1600, 1200,
800, and 400 mega-transfers per second.
Side B supports transfer rates of 800 and
400 mega-transfers per second.

Maximum bandwidth is 6.4 gigabytes per
second across side A (half upstream and half
downstream) and 1.6 gigabytes per second
across side B.

Independent transfer rate and bit width
selection for each side.

Link disconnect protocol supported.

AGP 8x bridge.

Compliance with AGP 3.0 specification sig-
naling, supporting 4x and 8x transfer rates.

Compliance with AGP 2.0 specification 1.5-
volt signaling, supporting 1x, 2x, and 4x
data-transfer modes.

Supports up to 32 outstanding requests.

31 x 31 millimeter, 564-ball BGA package.

1.5 volt AGP signaling; some 3.3 volt IO; 1.2
volt link signaling; 1.8 volt core.

Figure 1: System block diagram.

AMD-8151

TM

Device

Host

HyperTransport

TM

Link

16 bits upstream,

16 bits downstream

HyperTransport

Link

8 bits upstream,

8 bits downstream

Downstream

Device

tunnel

Side A

Side B

AGP

Bridge

AGP Graphics

Controller

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Summary

Page 2 - AGP Tunnel Data Sheet

24888 Rev 3.03 - July 12, 2004 AMD-8151 TM AGP Tunnel Data Sheet 2 Trademarks AMD, the AMD Arrow logo, and combinations thereof, and AMD-8151 are trademarks of Advanced Micro Devices, Inc. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Other product names used in...

Page 3 - Table of Contents

3 24888 Rev 3.03 - July 12, 2004 AMD-8151 TM AGP Tunnel Data Sheet Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Device Features . . . . . . . . . . . . . . . . . . . . ...

Page 4 - List of Figures

24888 Rev 3.03 - July 12, 2004 AMD-8151 TM AGP Tunnel Data Sheet 4 List of Figures Figure 1: System block diagram. .................................................................................................................. 1 Figure 2: Configuration space. ........................................

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