AMD 64 X2 - Manual
AMD 64 X2 – Manual, read for free online in PDF format. We hope this helps you resolve any issues you may have. If you have further questions, please contact us through the contact form.
Advanced Micro Devices
AMD Turion™ 64 X2 Mobile
Technology Dual-Core Processor
Product Data Sheet
•
Compatible with Existing 32-Bit Code Base
–
Including support for SSE, SSE2, SSE3*, MMX™,
3DNow!™ technology, and legacy x86 instructions
*SSE3 supported by Rev. E and later processors
–
Runs existing operating systems and drivers
–
Local APIC on the chip
•
AMD64 Technology
–
AMD64 technology instruction set extensions
–
64-bit integer registers, 48-bit virtual addresses,
40-bit physical addresses
–
Eight additional 64-bit integer registers (16 total)
–
Eight additional 128-bit SSE registers (16 total)
•
Dual-Core Architecture
–
Discrete L1 and L2 cache structures for each core
•
Enhanced Virus Protection
–
No Execute (NX) bit in page-translation tables
specifies whether code can be executed from the
page
•
HyperTransport™ Technology to I/O Devices
–
One 16-bit link supporting speeds up to 800 MHz
(1600 MT/s) or 3.2 Gbytes/s in each direction
•
64-Kbyte 2-Way Associative ECC-Protected
L1 Data Cache
–
Two 64-bit operations per cycle, 3-cycle latency
•
64-Kbyte 2-Way Associative Parity-Protected
L1 Instruction Cache
–
With advanced branch prediction
•
16-Way Associative ECC-Protected
L2 Cache
–
Exclusive cache architecture—storage in addition
to L1 caches
–
Up to 1 Mbyte per L2 cache
–
1 Mbyte and 512-Kbyte options
•
Machine Check Architecture
–
Includes hardware scrubbing of major
ECC-protected arrays
Socket S1g1 Processor Specific
Features
•
Refer to the Socket S1g1 Processor Functional
Data Sheet, order# 31731, for functional and
mechanical details of socket S1g1 processors.
Refer to the AMD NPT Family 0Fh Processor
Electrical Data Sheet, order# 31119, for
electrical details of socket S1g1 processors.
•
Packaging
–
638-pin lidless micro PGA package
–
1.27-mm pin pitch
–
26 x 26 pin grid array
–
35 mm x 35 mm organic substrate
–
Compliant with RoHS (EU Directive 2002/95/EC)
with lead used only in small amounts in specifically
exempted applications
•
Integrated Memory Controller
–
Low-latency, high-bandwidth
–
128-bit DDR2 SDRAM controller operating at up
to 333 MHz
–
Supports up to two unbuffered SO-DIMMs
•
Electrical Interfaces
–
HyperTransport™ technology: LVDS-like
differential, unidirectional
–
DDR2 SDRAM: SSTL_1.8 per JEDEC
specification
–
Clock, reset, and test signals also use DDR2
SDRAM-like electrical specifications.
•
Power Management
–
Multiple low-power states including Deeper Sleep
(C1E with AltVID)
–
System Management Mode (SMM)
–
ACPI compliant, including support for processor
performance states
–
AMD PowerNow!™ technology is designed to
dynamically switch between multiple low-power
states based on application performance
requirements.
41407
Publication #
3.02
Revision:
September 2006
Issue Date:
"Loading the manual" means you need to wait until the file loads and becomes available for online reading. Some manuals are very large, and the time they take to appear depends on your internet speed.