NEC PD75P308 - Manual

NEC PD75P308

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Table of Contents:

  • Page 2 – PIN CONFIGURATION
  • Page 3 – BLOCK DIAGRAM
  • Page 4 – CONTENTS; DIFFERENCES BETWEEN
  • Page 7 – TYPE E–E
  • Page 8 – TYPE F–; TYPE G; TYPE F–B; TYPE M–A
  • Page 9 – data; P–ch; NOTES ON USING P00/INT4 AND RESET PINS
  • Page 10 – DIFFERENCES BETWEEN
  • Page 11 – input signal 180o out of phase in respect to signal to X1 pin.; OPERATION MODES FOR WRITING/VERIFYING PROGRAM MEMORY
  • Page 12 – PROGRAM MEMORY WRITE PROCEDURE; and V; Data
  • Page 13 – PROGRAM MEMORY READ PROCEDURE; Data output
  • Page 15 – ELECTRICAL SPECIFICATIONS; ABSOLUTE MAXIMUM RATINGS; The impedance of the power source (pull-up resistor) must be 50 K
  • Page 17 – reaches the minimum value of the oscillation voltage
  • Page 18 – DC CHARACTERISTICS (T; : Including when the subsystem clock is operated.
  • Page 19 – AC CHARACTERISTICS (T; Operation Other Than Serial Transfer; t vs V
  • Page 20 – SERIAL TRANSFER OPERATION; and C
  • Page 22 – AC TIMING TEST POINT (excluding X1 and XT1 inputs); Test points; CLOCK TIMING; X1 input; TI0 TIMING
  • Page 23 – SERIAL TRANSFER TIMING; SCK
  • Page 24 – INTERRUPT INPUT TIMING; COMMAND SIGNAL TRANSFER
  • Page 25 – operation when oscillation is started.; DATA RETENTION TIMING (releasing STOP mode by RESET)
  • Page 26 – AC PROGRAMMING CHARACTERISTICS (T
  • Page 27 – Data input; PROGRAM MEMORY WRITE TIMING
  • Page 28 – PACKAGE DRAWINGS; 0 P I N P L A S T I C Q F P ( 1 4; detail of lead end; I T E M
  • Page 29 – 0 PIN CERAMIC WQFN
  • Page 30 – RECOMMENDED SOLDERING CONDITIONS; It is recommended that; Table 6-1 Soldering Conditions; Notice
  • Page 31 – APPENDIX A. DEVELOPMENT TOOLS; PROM writing tools
  • Page 32 – APPENDIX B. RELATED DOCUMENTS
  • Page 33 – GENERAL NOTES ON CMOS DEVICES; plate and do not touch the pins of the device.; PROCESSING OF UNUSED PINS (CMOS DEVICES ONLY); Fix the input level of CMOS devices.; or GND through; STATUS BEFORE INITIALIZATION (ALL MOS DEVICES); the respective operations have been executed.
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NEC Corporation 1989

Document No.

IC-2472B

(O. D. No.

IC-7208C)

Date Published November 1993 P
Printed in Japan

DATA SHEET

MOS INTEGRATED CIRCUIT

µ

PD75P308

The mark

★

shows major revised points.

4-BIT SINGLE-CHIP MICROCOMPUTER

DESCRIPTION

The

µ

PD75P308 is a model of the

µ

PD75308 equipped with a one-time PROM or EPROM instead of an

internal mask ROM.

Two types are available as the

µ

PD75P308. The one-time PROM type is ideal for production of a small

quantity of many different types of application systems as data can only be written once to the one-time

PROM of this type. Programs can be written and rewritten to the built-in EPROM type making it ideal

for system evaluation.

Detailed functions are described in the followig user's manual. Be sure to read it for designing.

µ

PD75308 User's Manual: IEM-5016

The function common to the one-time PROM and EPROM types of product is referred to as PROM throughout this document.

The information in this document is subject to change without notice.

FEATURES

•

µ

PD75308 compatible

•

Memory capacity

• Program memory (PROM): 8064 x 8 bits

• Data memory (RAM): 512 x 4 bits

•

Can be connected to a pull-up resistor through software: Ports 0-3, 6, 7

•

Open-drain input/output: Ports 4 and 5

•

Single power source: 5V

±

5%

ORDERING INFORMATION

Part Number

Package

Internal ROM

µ

PD75P308GF-3B9

80-pin plastic QFP (14 x 20 mm)

One-time PROM

µ

PD75P308K

80-pin ceramic WQFN (LCC w/window)

EPROM

QUALITY GRADE

Part Number

Package

Quality Grade

µ

PD75P308GF-001-3B9

80-pin plastic QFP (14 x 20 mm)

Standard

µ

PD75P308K

80-pin Ceramic WQFN (LCC w/window)

Standard

★

Please refer to "Quality Grade on NEC Semiconductor Devices" (Document number IEI-1209) published by NEC
Corporation to know the specification of quality grade on the devices and its recommended applications.

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Summary

Page 2 - PIN CONFIGURATION

µ PD75P308 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 S12 S13 S14 S15 S16 S17 S18 S19 S20 S21 S22 S23 S24/BP0 S25/BP1 S26/BP2 S27/BP3 S28/BP4 S29/BP5 S30/BP6 S31/BP7 COM0 COM1 COM2 COM3 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 S11 S10 S9 S8 S7 S6 S5 S4 S3 S2 S1 S0 RESET ...

Page 3 - BLOCK DIAGRAM

µ PD75P308 3 BLOCK DIAGRAM P00-P03 P10-P13 P20-P23 P30-P33/MD0-MD3 P40-P43 P50-P53 P60-P63 P70-P73 4 4 4 4 4 4 4 4 PORT0 PORT1 PORT2 PORT3 PORT4 PORT5 PORT6 PORT7 S0-S23 S24/BP0-S31/BP7 COM0-COM3 V -V LCO LC2 BIAS LCDCL/P30 SYNC/P30 24 8 4 3 LCD CONTROLLER /DRIVER f LCD RESET SP(8) BANK GENERAL REG....

Page 4 - CONTENTS; DIFFERENCES BETWEEN

µ PD75P308 4 CONTENTS 1. PIN FUNCTIONS ................................................................................................................................. 5 1.1 PORT PINS ......................................................................................................................

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