Intel LGA 771 - Manual

LGA 771 Socket Mechanical Design Guide 7 Introduction 1 Introduction 1.1 Document Goals and Scope 1.1.1 LGA771 Socket Overview This document describes a surface mount, LGA (Land Grid Array) socket intended for the Dual-Core Intel ® Xeon ® Processor 5000 Sequence Family for Servers and Workstations. ...

Introduction 8 LGA 771 Socket Mechanical Design Guide 1.2 Terminology 1.3 Reference Documents Note: Contact your Intel representative for the latest revisions of these documents. § Term Description LGA771 Socket Processor in the 771-land package mates with the system board through a surface mount, 7...

LGA 771 Socket Mechanical Design Guide 9 Assembled Component and Package Description 2 Assembled Component and Package Description The LGA771 Socket dimensions and characteristics must be compatible with that of the processor package and related assembly components. Processors using Flip-Chip Land G...

LGA 771 Socket Mechanical Design Guide 11 Mechanical Requirements 3 Mechanical Requirements 3.1 Attachment The socket will be tested against the mechanical shock and vibration requirements listed in Section 5 under the expected use conditions with a heatsink and retention mechanism attached under th...

Mechanical Requirements 12 LGA 771 Socket Mechanical Design Guide operating temperature, while mounted on an FR4-type motherboard material. The creep properties of the material must be such that the mechanical integrity of the socket is maintained for the use condition outlined in Section 5 . The co...

LGA 771 Socket Mechanical Design Guide 13 Mechanical Requirements 3.2.1.4.2 Lot Traceability Each socket will be marked with a lot identification code to allow traceability of all components, date of manufacture (year and week), and assembly location. The mark must be placed on a surface that is vis...

Mechanical Requirements 14 LGA 771 Socket Mechanical Design Guide The stiffener plate is made of stainless steel SUS 301. The stiffener plate provides the interface to the load lever and the load plate and creates the primary stiffening element to react to the load generated by the load plate. 3.2.3...

LGA 771 Socket Mechanical Design Guide 15 Mechanical Requirements 3.5 Package/Socket Stackup Height Table 3-1 provides the stackup height of the processor package and LGA771 socket. Notes: 1. Preliminary Guidance. This data is provided for information only, and should be derived from: (a) the height...

LGA 771 Socket Mechanical Design Guide 19 Electrical Requirements 4 Electrical Requirements Table 4-1 provides the LGA771 Socket electrical requirements. Socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the PCB to which it is attache...

LGA 771 Socket Mechanical Design Guide 21 Environmental Requirements 5 Environmental Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points. The reliability targets in this section are based on the expected f...

LGA 771 Socket Mechanical Design Guide 23 Environmental Requirements 5.1 Solvent Resistance Requirement: No damage to ink markings if applicable. EIA 364-11A. 5.2 Durability Use per EIA-364, test procedure 09. Measure contact resistance when mated in 1st and 30th cycles. The package should be remove...

LGA 771 Socket Mechanical Design Guide 25 Mechanical Drawings A Mechanical Drawings The following table lists the mechanical drawings included in this section. These drawings refer to the LGA771 socket. Note: Intel reserves the right to make changes and modifications to the design as necessary. See ...