HP HP BladeSystem Enclosure technologies - Manual

HP HP BladeSystem Enclosure technologies

HP HP BladeSystem Enclosure technologies – Manual, read for free online in PDF format. We hope this helps you resolve any issues you may have. If you have further questions, please contact us through the contact form.

1 Page 1
2 Page 2
3 Page 3
4 Page 4
5 Page 5
6 Page 6
7 Page 7
8 Page 8
9 Page 9
10 Page 10
11 Page 11
12 Page 12
13 Page 13
14 Page 14
15 Page 15
16 Page 16
17 Page 17
18 Page 18
19 Page 19
20 Page 20
21 Page 21
22 Page 22
23 Page 23
24 Page 24
25 Page 25
26 Page 26
27 Page 27
28 Page 28
Page: / 28

Table of Contents:

  • Page 2 – subsystem. It can be populated with the following components:
  • Page 4 – HP Thermal Logic technologies
  • Page 5 – Active Cool fans; servers to properly cool the server blades within the enclosure.
  • Page 6 – HP PARSEC architecture
  • Page 7 – Thermal Logic for the server blade and enclosure; within the enclosure.
  • Page 8 – operate the HP BladeSystem environment.; Power supplies and enclosure power subsystem; the management board and fans.
  • Page 9 – NOTE; available at this URL:
  • Page 11 – Power Regulator
  • Page 12 – Interconnect options and infrastructure
  • Page 13 – Fabric connectivity and port mapping; InfiniBand, and Virtual Connect modules.
  • Page 14 – An example of a 2x port is a SAS interconnect module.
  • Page 16 – Administrator and HP Insight Manager software.; Virtual Connect; mezzanine card in Mezzanine slot 2 or 3 in the server blade.
  • Page 19 – Insight Display
  • Page 20 – Enclosure link cabling
  • Page 21 – IMPORTANT; Recommendations; Use the HP BladeSystem Power Sizer.; Summary
  • Page 22 – Appendix A. Acronyms in text; The following acronyms are used in the text of this document.
  • Page 23 – Six-fan configuration enables population of all fan bays.
  • Page 28 – For more information; For additional information, refer to the resources listed below.; Call to action; Send comments about this paper to
Loading the manual

HP BladeSystem c3000 Enclosure technologies

technology brief

Abstract.............................................................................................................................................. 2

Overview of HP BladeSystem c3000 Enclosure ....................................................................................... 2

HP Thermal Logic technologies .............................................................................................................. 4

Active Cool fans .............................................................................................................................. 5

HP PARSEC architecture.................................................................................................................... 6

Thermal Logic for the server blade and enclosure ................................................................................. 7

Power supplies and enclosure power subsystem................................................................................... 8

HP BladeSystem Power Sizer ......................................................................................................... 9

Pooled power ............................................................................................................................ 10

Dynamic Power Saver mode ........................................................................................................ 11

Power Regulator ......................................................................................................................... 11

Power Capping for each server blade........................................................................................... 11

Interconnect options and infrastructure.................................................................................................. 12

Fabric connectivity and port mapping............................................................................................... 13

Virtual Connect .............................................................................................................................. 16

Enclosure-based DVD ROM................................................................................................................. 17

Onboard Administrator ...................................................................................................................... 17

Insight Display ............................................................................................................................... 19

Web GUI ...................................................................................................................................... 20

Command-line interface .................................................................................................................. 20

Onboard Administrator cabling ....................................................................................................... 20

Enclosure link cabling ..................................................................................................................... 20

Recommendations .............................................................................................................................. 21

Summary .......................................................................................................................................... 21

Appendix A. Acronyms in text ............................................................................................................. 22

Appendix B. Fan, power supply, and device bay population guidelines ................................................... 23

For more information.......................................................................................................................... 28

Call to action .................................................................................................................................... 28

"Loading the manual" means you need to wait until the file loads and becomes available for online reading. Some manuals are very large, and the time they take to appear depends on your internet speed.

Summary

Page 2 - subsystem. It can be populated with the following components:

Abstract The HP BladeSystem c3000 Enclosure is the next generation in an evolution of the entire rack- mounted infrastructure. The c3000 Enclosure is designed for remote sites, small and medium-sized businesses, and data centers with special power and cooling constraints. This technology brief provi...

Page 4 - HP Thermal Logic technologies

Figure 2. HP BladeSystem c3000 Enclosure – rear view HP Thermal Logic technologies with a variety of HP Thermal Logic onnect er view : t Scalable Enclosure Cooling (PARSEC) design undancy modes alancing HP BladeSystem c-Class products have been designed technologies ― a set of technologies integrate...

Page 5 - Active Cool fans; servers to properly cool the server blades within the enclosure.

Active Cool fans Quite often, dense, full-featured, small form-factor servers use very small fans designed to provide localized cooling in the specific areas needed by the server blade. Because such fans generate fairly low airflow (in cubic feet per minute, or CFM) at medium backpressure, a single ...

Other HP Models

All HP Other