Page 2 - TECHNICAL SPECIFICATIONS; PARAMETER
DS_DNM04SIP10_07162008D 2 TECHNICAL SPECIFICATIONS (T A = 25°C, airflow rate = 300 LFM, V in = 2.8Vdc and 5.5Vdc, nominal Vout unless otherwise noted.) PARAMETER NOTES and CONDITIONS DNM04S0A0R10 Min. Typ. Max. Units ABSOLUTE MAXIMUM RATINGS Input Voltage (Continuous) 0 5.8 Vdc Tracking Voltage Vin,...
Page 3 - ELECTRICAL CHARACTERISTICS CURVES; OUTPUR CURRENT
DS_DNM04SIP10_07162008D 3 ELECTRICAL CHARACTERISTICS CURVES Figure 1: Converter efficiency vs. output current (3.3V out) Figure 2: Converter efficiency vs. output current (2.5V out) Figure 3: Converter efficiency vs. output current (1.8V out) Figure 4: Converter efficiency vs. output current (1.5V o...
Page 5 - out
DS_DNM04SIP10_07162008D 5 ELECTRICAL CHARACTERISTICS CURVES Figure 13: Turn on delay time at 5Vin, 3.3V/10A out Figure 14: Turn on delay time at 5Vin, 1.8V/10A out Figure 15: Turn on delay time at remote turn on 5Vin, 3.3V/16A out Figure 16: Turn on delay time at remote turn on 3.3Vin, 2.5V/16A out ...
Page 6 - Typical transient response to step load change at
DS_DNM04SIP10_07162008D 6 ELECTRICAL CHARACTERISTICS CURVES Figure 19: Typical transient response to step load change at 2.5A/ μ S from 100% to 50% of Io, max at 5Vin, 3.3Vout (Cout = 1uF ceramic, 10 μ F tantalum) Figure 20: Typical transient response to step load change at 2.5A/ μ S from 50% to 100...
Page 8 - Note: All measurements are taken at the module; Ii; DESIGN CONSIDERATIONS; Input Source Impedance; tantalum; capacitors in parallel with 94 μF (2 x 47
DS_DNM04SIP10_07162008D 8 TEST CONFIGURATIONS V I (+) V I (-) BATTERY 2 100uF Tantalum L TO OSCILLOSCOPE Note: Input reflected-ripple current is measured with a simulated source inductance. Current is measured at the input of the module. Figure 29: Input reflected-ripple test setup Vo GND COPPER STR...
Page 9 - Safety Considerations; FEATURES DESCRIPTIONS; Positive remote On/Off implementation; Negative remote On/Off implementation; The units
DS_DNM04SIP10_07162008D 9 DESIGN CONSIDERATIONS (CON.) The power module should be connected to a low ac-impedance input source. Highly inductive source impedances can affect the stability of the module. An input capacitance must be placed close to the modules input pins to filter ripple current and ...
Page 10 - Over-Temperature Protection; Table 1; Table 2; Open
DS_DNM04SIP10_07162008D 10 FEATURES DESCRIPTIONS (CON.) Over-Temperature Protection The over-temperature protection consists of circuitry that provides protection from thermal damage. If the temperature exceeds the over-temperature threshold the module will shut down. The module will try to restart ...
Page 11 - Circuit configuration for output voltage margining
DS_DNM04SIP10_07162008D 11 The output voltage tracking feature (Figure 40 to Figure 42) is achieved according to the different external connections. If the tracking feature is not used, the TRACK pin of the module can be left unconnected or tied to Vin. For proper voltage tracking, input voltage of ...
Page 12 - to the TRACK pin of PS2. Please note
DS_DNM04SIP10_07162008D 12 FEATURE DESCRIPTIONS (CON.) Sequential Start-up Sequential start-up (Figure 40) is implemented by placing an On/Off control circuit between Vo PS1 and the On/Off pin of PS2. R1 R2 Vo PS1 PS1 Vin On/Off On/Off PS2 Vo PS2 Vin C1 Q1 R3 Simultaneous Simultaneous tracking (Figu...
Page 13 - THERMAL CONSIDERATIONS; Thermal Testing Setup; Wind tunnel test setup
DS_DNM04SIP10_07162008D 13 THERMAL CONSIDERATIONS Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of h...
Page 14 - THERMAL CURVES; Temperature measurement location
DS_DNM04SIP10_07162008D 14 THERMAL CURVES Figure 44: Temperature measurement location * The allowed maximum hot spot temperature is defined at 125 ℃ DNM04S0A0R10(Standard) Output Current vs. Ambient Temperature and Air Velocity @ Vin = 5V, Vo = 3.3V (Either Orientation) 0 2 4 6 8 10 12 60 65 70 75 8...
Page 15 - SIP PACKAGE
DS_DNM04SIP10_07162008D 15 MECHANICAL DRAWING SMD PACKAGE (OPTIONAL) SIP PACKAGE