Page 2 - TECHNICAL SPECIFICATIONS; PARAMETER
DS_DNM04SMD10_07162008 2 TECHNICAL SPECIFICATIONS (T A = 25°C, airflow rate = 300 LFM, V in = 2.8Vdc and 5.5Vdc, nominal Vout unless otherwise noted.) PARAMETER NOTES and CONDITIONS DNM04S0A0S10PFD Min. Typ. Max. Units ABSOLUTE MAXIMUM RATINGS Input Voltage (Continuous) 0 5.8 Vdc Tracking Voltage Vi...
Page 3 - ELECTRICAL CHARACTERISTICS CURVES
DS_DNM04SMD10_07162008 3 ELECTRICAL CHARACTERISTICS CURVES Figure 1: Converter Efficiency vs. Output Current (3.3V out) Figure 2: Converter Efficiency vs. Output Current (2.5V out) Figure 3: Converter Efficiency vs. Output Current (1.8V out) Figure 4: Converter Efficiency vs. Output Current (1.5V ou...
Page 5 - out
DS_DNM04SMD10_07162008 5 ELECTRICAL CHARACTERISTICS CURVES Figure 13: Turn on delay time at 5Vin, 3.3V/10A out Figure 14: Turn on delay time at 5Vin, 1.8V/10A out Figure 15: Turn on delay time at remote turn on 5Vin, 3.3V/16A out Figure 16: Turn on delay time at remote turn on 3.3Vin, 2.5V/16A out F...
Page 7 - Typical Transient Response to Step Load Change at
DS_DNM04SMD10_07162008 7 ELECTRICAL CHARACTERISTICS CURVES Figure 25: Typical Transient Response to Step Load Change at 2.5A/ μ S from 100% to 50% of Io, max at 3.3Vin,1.8Vout (Cout=1uF ceramic, 10 μ F Tantalum) Figure 26: Typical Transient Response to Step Load Change at 2.5A/ μ S from 50% to 100% ...
Page 8 - Vo; F tantalum and 1; Note: All measurements are taken at the module; Ii; DESIGN CONSIDERATIONS; tantalum; capacitors in parallel with 94 μF (2 x 47
DS_DNM04SMD10_07162008 8 TEST CONFIGURATIONS V I (+) V I (-) BATTERY 2 100uF Tantalum L TO OSCILLOSCOPE Note: Input reflected-ripple current is measured with a simulated source inductance. Current is measured at the input of the module. Figure 29: Input reflected-ripple test setup Vo GND COPPER STRI...
Page 9 - Safety Considerations; FEATURES DESCRIPTIONS; Positive remote On/Off implementation; The units operate normally
DS_DNM04SMD10_07162008 9 DESIGN CONSIDERATIONS (CON.) The power module should be connected to a low ac-impedance input source. Highly inductive source impedances can affect the stability of the module. An input capacitance must be placed close to the modules input pins to filter ripple current and e...
Page 10 - Over-Temperature Protection; Table 1; Table 2
DS_DNM04SMD10_07162008 10 FEATURES DESCRIPTIONS (CON.) Over-Temperature Protection The over-temperature protection consists of circuitry that provides protection from thermal damage. If the temperature exceeds the over-temperature threshold the module will shut down. The module will try to restart a...
Page 11 - Circuit configuration for output voltage margining; Voltage Tracking; Sequential
DS_DNM04SMD10_07162008 11 FEATURE DESCRIPTIONS (CON.) The amount of power delivered by the module is the voltage at the output terminals multiplied by the output current. When using the trim feature, the output voltage of the module can be increased, which at the same output current would increase t...
Page 12 - Simultaneous; to the TRACK pin of PS2. Please note
DS_DNM04SMD10_07162008 12 FEATURE DESCRIPTIONS (CON. ) Sequential Start-up Sequential start-up (Figure 40) is implemented by placing an On/Off control circuit between Vo PS1 and the On/Off pin of PS2. Simultaneous Simultaneous tracking (Figure 41) is implemented by using the TRACK pin. The objective...
Page 13 - THERMAL CONSIDERATIONS; Thermal Testing Setup; Wind tunnel test setup
DS_DNM04SMD10_07162008 13 THERMAL CONSIDERATIONS Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of he...
Page 14 - THERMAL CURVES; Temperature measurement location
DS_DNM04SMD10_07162008 14 THERMAL CURVES Figure 44: Temperature measurement location * The allowed maximum hot spot temperature is defined at 125 ℃ DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity @ Vin = 5V, Vo = 3.3V (Either Orientation) 0 2 4 6 8 10 12 60 65 70 75 80...
Page 15 - PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL; Temp
DS_DNM04SMD10_07162008 15 PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL LEAD (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE Time ( sec. ) Pre-heat temp. 140~180 ° C 60~120 sec. Peak temp. 210~230 ° C 5sec. Ramp-up temp. 0.5~3.0 ° C /sec. Te mper atur e ( ° C ) 50 100 150 200 250 300 60 0 120 180 24...
Page 16 - SMD PACKAGE SIP PACKAGE (OPTIONAL)
DS_DNM04SMD10_07162008 16 MECHANICAL DRAWING SMD PACKAGE SIP PACKAGE (OPTIONAL)
Page 17 - PART NUMBERING SYSTEM; Model Name
DS_DNM04SMD10_07162008 17 PART NUMBERING SYSTEM DNM 04 S 0A0 S 10 P F D Product Series Input Voltage Numbers of Outputs Output Voltage Package Type Output Current On/Off logic Option Code DNL - 16A DNM - 10A DNS - 6A 04 - 2.8~5.5V 10 – 8.3~14V S - Single 0A0 - Programmable R - SIP S - SMD 16 -16A 10...