AMD 550X - Manuals

AMD CrossFire Chipset 5 Logos and Text Treatment Logos and text treatments lend brand value to your marketing and packaging. By including these graphic elements in your packaging, you create immediate awareness and connection with your audience. This guide outlines the proper usage of all AMD Chipse...

AMD CrossFire Chipset 6 Logos and Text Treatment AMD should be in full caps. All AMD Chipset and product feature names should be spelled out in lower case with the first letter capitalized. Do not spell the entire product or product feature name in capital letters only. For ‘CrossFire’, ‘C’ and ‘F’ ...

AMD CrossFire Chipset 7 Logos and Text Treatment Use of trademark “™” and “®” COPY In all copy, the applicable trademark notice must be used beside all product and product feature names used in: (i) all headlines; and (ii) the first use of the product or product feature name in the text. PACKAGING T...

AMD CrossFire Chipset 8 Logos and Text Treatment Using AMD CrossFire Chipset Logos Use AMD CrossFire Chipset logos when promoting motherboards or systems with these chipset. The logos must be used in the following applications: • On the heat sink for Northbridge. (Logo on the Southbridge is optional...

AMD CrossFire Chipset 9 Logos and Text Treatment This logo is used on the Northbridge and or Southbridge on the Motherboard heat sink These logos are used on the PC boot up Screen (BIOS Splash), for motherboard packaging (see packaging guidelines for more details), advertisement, collateral material...

AMD CrossFire Chipset 10 Logos and Text Treatment Requirements for BIOS Splash Screen Logo The BIOS Splash screen logo must be placed either in the center of the monitor or the upper top left-hand corner of the screen The logo must be no smaller than 2 inches in width (length to be proportional) The...

AMD CrossFire Chipset 11 Packaging Guidelines Section 2

AMD CrossFire Chipset 12 Packaging Guidelines These packaging standards have been developed to provide consistent brand recognition for the logo established for all AMD products, and to more clearly communicate the consumer benefits of AMD products. Please follow these guidelines for all motherboard...

AMD CrossFire Chipset 13 Packaging Guidelines Mandatory Box Layout Requirements: There is only one mandatory element for all partner packaging:The AMD CrossFire Chipset product logo MUST be on the front and back panels of the retail box.This elements must be reproduced without variation in the posit...

AMD CrossFire Chipset 14 Packaging Guidelines Other Mandatory Requirements: 1. The proportion of logo size to package area shown must be maintained (see below) 2. To ensure sufficient visibility, an unobstructed area should surround the Chipset badge logo. 3. The ™ should be placed after CrossFire. ...

AMD CrossFire Chipset 15 Packaging Guidelines Logo Sizing Requirements 1. Logo must be 0.375” away from box edge and other logos. 2. The logo must be at least 2” wide. 2” 0.375”

AMD CrossFire Chipset 16 Packaging Guidelines Incorrect Use of Chipset Package Art Template 1. The chipset badge logo is not placed on the front/top side of the packaging 2. The badge is two small, not meeting the 2” wide criteria 3. Partners may not add unauthorized numeric or alphabetical extensio...