AMD 1207 - Manuals

List of Tables 7 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006 List of Tables Table 1. Mechanical and Thermal Specifications for Socket F (1207) Processors. . . . . . . . . . . .13 Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB...

Revision History 9 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006 Revision History Date Revision Description July 2006 3.00 Initial Public release.

Chapter 1 Introduction 11 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006 Chapter 1 Introduction This document specifies performance requirements for the design of thermal and mechanical solutions for socket F (1207) processors, utilizing AMD 64-bit technology. Detail...

Chapter 2 Processor Thermal Solutions 13 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006 Chapter 2 Processor Thermal Solutions This chapter describes the thermal solutions for systems based on socket F (1207) processors. 2.1 Processor Specifications The objective of t...

14 Processor Thermal Solutions Chapter 2 32800 Rev. 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors 2.2 Socket Description Figure 1 shows a three-dimensional view of the 1207-pin socket used with socket F (1207) processors. This socket is based on LGA (land-grid array) technolog...

Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 15 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006 Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-Box (PIB) Thermal Solution This chapter describes the m...

16 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev. 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket may be available for the thermal solution than i...

18 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev. 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on Socket F (1207) Processors 3.3.1 Backplate Assembly...

Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 19 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006 Note: Do not cut entirely through the center rib. Doing so will compromise the stiffness of the backplate. The plate uses ...

Chapter 4 Thermal Design of Custom 1U-2P Systems 21 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 3.00 August 2006 Chapter 4 Thermal Design of Custom 1U-2P Systems This chapter describes the motherboard component-height restrictions, thermal-solution design requirements, sample...

22 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev. 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket may be available for the thermal solution than is shown in Figure 4 on page 21. This space per...

24 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev. 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems The following sections describe the mechanical requirements of the components shown in Figure 5. 4....

Chapter 4 Thermal Design of Custom 1U-2P Systems 25 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 3.00 August 2006 Lifting the heat sink away from the processor can result in damage to the processor contact pads, the socket contacts, or the socket solder-ball joints. Maintainin...

26 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev. 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Other fan and heat sink combinations may yield adequate thermal performance. The system designer must ensure that the thermal solution provides required cooling for the...

Chapter 4 Thermal Design of Custom 1U-2P Systems 27 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 3.00 August 2006 4.3.5 Thermal Interface Material The heat sink contacts the top surface of the processor package and utilizes the thermal interface material between the processor ...

Chapter 5 Thermal Design of Custom 2U-4P Systems 29 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 Chapter 5 Thermal Design of Custom 2U-4P Systems This chapter describes the motherboard component-height restrictions, thermal-solution design requirements, sample heat...

30 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket may be available for the thermal solution than is shown in Figure 8 on page 29. This space per...

Chapter 5 Thermal Design of Custom 2U-4P Systems 33 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 5.3.2 Spring Clip The spring clip is designed to apply 75 lbs of force to the center of the heat sink. This force is necessary to help prevent the heat sink from liftin...

34 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors the center to 2.5 mm at the edges. The heat sink also has three heat pipes soldered to the base and connected to the top of the fin stack to improve fin efficiency. Thi...

Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors 37 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006 Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendi...

38 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev. 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 12. Socket F (1207) PIB Board Component Height Restrictions 73. 81 19. 91 D C B A A B C D 1 2 3 4 5 6 7 8...

40 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev. 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 14. Socket F (1207) PIB Socket Outline and Socket Window 0.000 0.00 0.724 18.39 2.189 55.61 00 0.0 00. 0 ...

Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors 41 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006 Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone x2 41. 05 47 9.1 0.000 0.00 1.44 1 2 x 36.59 1....

Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor 53 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006 Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C contains detailed re...

Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Processors 61 Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Processors Appendix D describes the ...

62 Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Processors Appendix D 32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System Thermal simulation of the 2U-4P system shown in Figure 30...