Micron 2933 - User Manual

Micron 2933

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Table of Contents:

  • Page 2 – Table 3: Part Numbers and Timing Parameters – 16GB Modules; Features
  • Page 3 – Automotive Applications.; Important Notes and Warnings
  • Page 4 – Table 4: Pin Assignments; Pin Assignments
  • Page 6 – Table 5: Pin Descriptions; Pin Descriptions
  • Page 9 – DQ Map
  • Page 11 – Figure 2: Functional Block Diagram; Functional Block Diagram
  • Page 12 – Module Manufacturing Location; Table 7: DRAM Module Manufacturing Locations; Manufacturing Site Location; General Description
  • Page 13 – Address Mirroring; Table 8: Address Mirroring; Edge Connector Pin; Address Mapping to DRAM
  • Page 14 – Registering Clock Driver Operation; Control Words; C bus interface resides on the same I; Parity Operations
  • Page 15 – Thermal Sensor Operations; SPD EEPROM Operation; Block; The EEPROM resides on a two-wire I; Temperature Sensor with SPD EEPROM Operation
  • Page 16 – Table 9: Absolute Maximum Ratings; Electrical Specifications
  • Page 17 – Table 11: Thermal Characteristics
  • Page 18 – Table 12: Module and Component Speed Grades; Module Speed Grade; Design Considerations; Simulations; Specifications; DRAM Operating Conditions
  • Page 19 – Specifications and Conditions (0°; Parameter
  • Page 25 – Table 19: Registering Clock Driver Electrical Characteristics; Registering Clock Driver Specifications
  • Page 26 – SPD Data; Table 21: Temperature Sensor and EEPROM Serial Interface Timing; Temperature Sensor with SPD EEPROM
  • Page 28 – Front view; The dimensional diagram is for reference only.; Module Dimensions
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DDR4 SDRAM RDIMM

MTA18ASF2G72PDZ – 16GB

Features

• DDR4 functionality and operations supported as

defined in the component data sheet

• 288-pin, registered dual in-line memory module

(RDIMM)

• Fast data transfer rates: PC4-3200, PC4-2933,

PC4-2666, or PC4-2400

• 16GB (2 Gig × 72)
• V

DD

= 1.20V (NOM)

• V

PP

= 2.5V (NOM)

• V

DDSPD

= 2.5V (NOM)

• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die V

REFDQ

generation and calibration

• Dual-rank
• On-board I

2

C temperature sensor with integrated

serial presence-detect (SPD) EEPROM

• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus

Figure 1: 288-Pin RDIMM (MO-309, R/C-E1, R/C-

E2)

Module height: 31.25mm (1.23in)

Options

Marking

• Operating temperature

– Commercial (0°C

T

OPER

95°C)

None

• Package

– 288-pin DIMM (halogen-free)

Z

• Frequency/CAS latency

– 0.625ns @ CL = 22 (DDR4-3200)

-3G2

– 0.682ns @ CL = 21 (DDR4-2933)

-2G9

– 0.75ns @ CL = 19 (DDR4-2666)

-2G6

– 0.83ns @ CL = 17 (DDR4-2400)

-2G3

Table 1: Key Timing Parameters

Speed

Grade

PC4-

Data Rate (MT/s)

CL =

t

RCD

ns

t

RP

ns

t

RC

ns

24

22

21

20\

19

18\

17

16\

15

14\

13

12\

11

10\

9

-3G2

3200

3200,

2933

3200,

2933

2933

2666\

2666

2400\

2400

2133\

2133

1866\

1866

1600\

1600

1333\

13.75

13.75

45.75

-2G9

2933

2933

2933

2666\

2666

2400\

2400

2133\

2133

1866\

1866

1600\

1600

1333\

14.32

(13.75)

1

14.32

(13.75)

1

46.32

(45.75)

1

16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM

Features

CCMTD-1725822587-9899
asf18c2gx72pdz.pdf - Rev. H 7/19 EN

1

Micron Technology, Inc. reserves the right to change products or specifications without notice.

© 2015 Micron Technology, Inc. All rights reserved.

Products and specifications discussed herein are subject to change by Micron without notice.

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Summary

Page 2 - Table 3: Part Numbers and Timing Parameters – 16GB Modules; Features

Table 1: Key Timing Parameters (Continued) Speed Grade PC4- Data Rate (MT/s) CL = t RCD ns t RP ns t RC ns 24 22 21 20\ 19 18\ 17 16\ 15 14\ 13 12\ 11 10\ 9 -2G6 2666 – – – 2666\ 2666 2400\ 2400 2133\ 2133 1866\ 1866 1600\ 1600 1333\ – 14.25 (13.75) 1 14.25 (13.75) 1 46.25 (45.75) 1 -2G3 2400 – – – ...

Page 3 - Automotive Applications.; Important Notes and Warnings

Important Notes and Warnings Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,including without limitation specifications and product descriptions. This document supersedes and replaces allinformation supplied prior to the public...

Page 4 - Table 4: Pin Assignments; Pin Assignments

Pin Assignments The pin assignment table below is a comprehensive list of all possible pin assignmentsfor DDR4 RDIMM modules. See the Functional Block Diagram for pins specific to thismodule. Table 4: Pin Assignments 288-Pin DDR4 RDIMM Front 288-Pin DDR4 RDIMM Back Pin Symbol Pin Symbol Pin Symbol P...