IBM MiEM78P468L - Manual

IBM MiEM78P468L

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Table of Contents:

  • Page 2 – Copyright; All Rights Reserved; ELAN MICROELECTRONICS CORPORATION; Fax
  • Page 3 – Contents; Purpose
  • Page 4 – and
  • Page 5 – Trap; Revision Description; Deleted all the packages for the EM78P468L
  • Page 7 – -Bit Microcontroller; Product Specification; General
  • Page 8 – Assignment
  • Page 9 – Block
  • Page 10 – Description; Table 1 (a) Pin Description for Package of QFP64 and LQFP64; Symbol
  • Page 11 – Table 2 (b) Pin Description for Package of QFP44 and LQFP44
  • Page 12 – Function; Operational Registers; Program Counter Organization
  • Page 13 – On-Chip Program me mory; Fig 6-1 Program Counter Organization
  • Page 14 – PS0 T P Z DC C; Event; WDT wake up from sleep mode
  • Page 15 – determine which bank is activated among the four banks.; IOCPAGE; Not used
  • Page 16 – LCDTYPE; LCD Duty; duty
  • Page 17 – RA; LPWTEN
  • Page 18 – Main clock; * NOP instruction must be added after SLEP instruction.; LCD booster frequency select bit to adjust VLCD 2, 3 driving.; Booster Frequency
  • Page 19 – CPU Operation Mode; Gr een Mode; RESET; IRE HF LGP
  • Page 20 – ICIF LPWTF
  • Page 21 – Special Purpose Registers
  • Page 24 – ICIE LPWTE; IROCS
  • Page 25 – enabled. “Enable” is the initial state of wake-up function.; TS; PSRE
  • Page 26 – WDTE WDTP2 WDTP1 WDTP0; WDT Rate
  • Page 27 – LPWTS LPWTP2 LPWTP1 LPWTP0 HPWTS HPWTP2
  • Page 29 – TCC and WDT Prescaler; depicts the circuit diagram of TCC and WDT.
  • Page 30 – WDT Setting Flowchart
  • Page 31 – A reset can be activated by
  • Page 32 – Table 2 Summary of Registers Initialized Values; Address
  • Page 35 – are listed as follows:; Sleep Mode
  • Page 36 – Modes; F capacitor to Ground). User can select which; FSMD; Table 4 Summary of maximum operating speeds; Conditions; Xout
  • Page 37 – main clock selection bits for PLL mode (code option select); Oscillator Source
  • Page 38 – RC Oscillator Mode with Internal Capacitor; Rext; Table 6 RC Oscillator Frequencies; Pin; Power-on voltage detector provided; IC
  • Page 39 – Because the current leakage from the /RESET pin is; Protection; residue-voltage protection circuit; Fig. 6-11 Residue Voltage Protection Circuit 1
  • Page 41 – Interrupt Vector
  • Page 43 – CLK2 CLK1 CLK0 IDLE BF1 BF0 CPUS; LCD booster frequency select bits; The initial setting flowchart for LCD function; IC RESET occur
  • Page 44 – Boosting circuits connection for LCD voltage; External circuit for 1/3 Bias; VDD; External circuit for 1/2 Bias
  • Page 47 – Infrared Remote Control Application/PWM Waveform Generate; If Counter 2 clock source is F; Fs; IR O U T p in; Fm
  • Page 48 – when in low-pulse width time. So IROUT waveform is determined by; HF
  • Page 50 – IR/PWM Function Enable Flowchart; (a) IR application (b) PW M application; Start
  • Page 51 – Word 1
  • Page 52 – Protect; Instruction Set
  • Page 55 – Timing Diagram; AC Te st Input/Output Wav e form
  • Page 56 – Absolute; Rating
  • Page 57 – Electrical; DC Electrical Characteristics
  • Page 59 – AC Electrical Characteristics
  • Page 60 – Device Characteristic; be out of the specified warranted operating range.
  • Page 61 – Io
  • Page 64 – Setup time from Power ON Reset; set
  • Page 65 – re
  • Page 66 – conditions are as follows:
  • Page 67 – Typical ICC3 vs . Te me rature; rr; M aximum ICC3 vs . Te me rature; Cu
  • Page 68 – Typical; I CC2 v s. Temerature; Fig. 8-16 Typical Power Consumption on Green Mode Operation; M aximum ICC2 vs . Te me rature; Fig. 8-17 Maximum Power Consumption on Green Mode Operation
  • Page 69 – Typical ICC1 vs . Te me rature; Fig. 8-18 Typical Power Consumption on Idle Mode Operation; M aximum ICC1 vs . Te me rature; Fig. 8-19 Maximum Power Consumption on Idle Mode Operation
  • Page 70 – Typical ISB vs . Te me rature; Fig. 8-20 Typical Power Consumption on Sleep Mode Operation; M aximun ISB vs . Te me rature; Fig. 8-21 Maximum Power Consumption on Sleep Mode Operation
  • Page 71 – Fig. 8-22 Operating Voltage under Temperature Range of 0
  • Page 72 – Application; EM; Fig. 9-2 IROUT Direct Drive Infrared Emitting Diodes
  • Page 73 – APPENDIX; Name; μΩ
  • Page 74 – B Package Information
  • Page 77 – Program Pin Name; Wiring diagram is for ELAN DW TR
  • Page 81 – E Quality Assurance and Reliability; Test Category; E.1 Address Trap Detect
  • Page 82 – CONTENTS
Loading the manual

EM78P468N/L

8-Bit Microcontroller

Product

Specification

D

OC

.

V

ERSION

1.5

ELAN

MICROELECTRONICS

CORP.

February 2007

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Summary

Page 2 - Copyright; All Rights Reserved; ELAN MICROELECTRONICS CORPORATION; Fax

Trademark Acknowledgments: IBM is a registered trademark and PS/2 is a trademark of IBM. Windows is a trademark of Microsoft Corporation. ELAN and ELAN logo are trademarks of ELAN Microelectronics Corporation. Copyright © 2004~2007 by ELAN Microelectronics Corporation All Rights Reserved Printed in ...

Page 3 - Contents; Purpose

Contents Product Specification (V1.5) 02.15.2007 • iii Contents 1 General Description ······················································································ 1 2 Features ········································································································· 1 3 Pin ...

Page 4 - and

Contents iv • Product Specification (V1.5) 01.15.2007 6.2.14 IOC71/TCCCR (TCC Control Register) ............................................................ 19 6.2.15 IOC81/W DTCR (W DT Control Register) .......................................................... 20 6.2.16 IOC91/CNT12CR (Counters 1, ...

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