TDK GSM850 - Manual

TDK GSM850

TDK GSM850 – Manual, read for free online in PDF format. We hope this helps you resolve any issues you may have. If you have further questions, please contact us through the contact form.

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001-02 / 20080112 / e741_dpx161990dt.fm

• All specifications are subject to change without notice.

Multilayer Chip Diplexers
For GSM850/GSM900/DCS/PCS

DPX Series DPX161990DT-8003B1

SHAPES AND DIMENSIONS

CIRCUIT DIAGRAM

RECOMMENDED PC BOARD PATTERNS

This width is 50

.

Micro-strip line for 0.4mm thick glass-epoxy substrate.

ELECTRICAL CHARACTERISTICS

• Ta:+25°C

Item

Port

Frequency range

Minimum value

Typical value

Maximum value

Insertion loss

Lo-band

824 to 960MHz

(dB)

0.7

Hi-band

1710 to 1990MHz

(dB)

0.85

Return loss

ANT

824 to 960MHz

(dB)

10.0

ANT

1710 to 1990MHz

(dB)

10.0

Attenuation

Hi-band

824 to 960MHz

(dB)

17.0

Lo-band

1710 to 1990MHz

(dB)

15.0

Temperature range

Operating

(°C)

–40

+85

Storage

(°C)

–40

+85

Conformity to RoHS Directive

0.6

±

0.1

0.8

±

0.15

0.3

±

0.1

0.1

±

0.1 0.25

±

0.1

1.6

±

0.15

6

5

4

1

2

3

Dimensions in mm

0.55

±

0.1

1

GND

2

ANT

3

GND

4

HIGH

5

GND

6

LOW

Terminal functions

1

2

3

5

6

4

0.4

0.7

0.7

ø0.15 Through-hole

Dimensions in mm

0.7

0.15

Hi-port

Lo-port

Ant-port

Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and
specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

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