TDK GSM850 - Manual
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001-02 / 20080112 / e741_dpx161990dt.fm
• All specifications are subject to change without notice.
Multilayer Chip Diplexers
For GSM850/GSM900/DCS/PCS
DPX Series DPX161990DT-8003B1
SHAPES AND DIMENSIONS
CIRCUIT DIAGRAM
RECOMMENDED PC BOARD PATTERNS
This width is 50
Ω
.
Micro-strip line for 0.4mm thick glass-epoxy substrate.
ELECTRICAL CHARACTERISTICS
• Ta:+25°C
Item
Port
Frequency range
Minimum value
Typical value
Maximum value
Insertion loss
Lo-band
824 to 960MHz
(dB)
—
—
0.7
Hi-band
1710 to 1990MHz
(dB)
—
—
0.85
Return loss
ANT
824 to 960MHz
(dB)
10.0
—
—
ANT
1710 to 1990MHz
(dB)
10.0
—
—
Attenuation
Hi-band
824 to 960MHz
(dB)
17.0
—
—
Lo-band
1710 to 1990MHz
(dB)
15.0
—
—
Temperature range
Operating
(°C)
–40
—
+85
Storage
(°C)
–40
—
+85
Conformity to RoHS Directive
0.6
±
0.1
0.8
±
0.15
0.3
±
0.1
0.1
±
0.1 0.25
±
0.1
1.6
±
0.15
6
5
4
1
2
3
Dimensions in mm
0.55
±
0.1
1
GND
2
ANT
3
GND
4
HIGH
5
GND
6
LOW
Terminal functions
1
2
3
5
6
4
0.4
0.7
0.7
ø0.15 Through-hole
Dimensions in mm
0.7
0.15
Hi-port
Lo-port
Ant-port
•
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and
specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
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