StarTech.com C3000 - Manual

StarTech.com C3000

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Table of Contents:

  • Page 3 – Abstract; components, see the HP website at; Overview of HP BladeSystem c3000 Enclosure; the c7000 enclosure is available on the HP technology website at
  • Page 4 – Active Cool fan kits for a maximum of six fans
  • Page 5 – OA support; Managing the c3000 enclosure; remote administration, local diagnostics, and troubleshooting.; Onboard Administrator; Detecting component insertion and removal
  • Page 9 – “Managing the HP BladeSystem c-Class” at; Integrated Lights-Out 2 for c-Class server blades; back and forth to allow access to the power supplies.
  • Page 10 – corrective action appear.; HP BladeSystem c-Class” at; Onboard Administrator cabling
  • Page 11 – Enclosure link cabling; NOTE
  • Page 12 – Enclosure-based DVD ROM; Install additional software; Enclosure KVM Module; PrintScrn
  • Page 13 – Interconnect options and infrastructure
  • Page 14 – Figure 9 illustrates
  • Page 15 – communicate with another interconnect module.; Interconnect modules
  • Page 16 – Server blades
  • Page 17 – Mezzanine cards
  • Page 19 – An example of a 2x port is a SAS interconnect module.
  • Page 22 – HP Thermal Logic technologies
  • Page 23 – Active Cool fans
  • Page 24 – HP PARSEC architecture; parallel
  • Page 25 – Redundant and scalable
  • Page 26 – Thermal Logic for the server blade
  • Page 27 – the proper HP BladeSystem environment.; Power supplies and enclosure power subsystem
  • Page 28 – CAUTION; . The HP BladeSystem
  • Page 30 – Dynamic Power Saver mode
  • Page 31 – HP Power Regulator for ProLiant
  • Page 32 – Summary
  • Page 35 – IMPORTANT
  • Page 37 – be installed in device bay 4.
  • Page 38 – For more information; For additional information, refer to the resources listed below.; Call to action; Send comments about this paper to
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HP BladeSystem c3000 Enclosure

technology brief, 2nd edition

Abstract.............................................................................................................................................. 3

Overview of HP BladeSystem c3000 Enclosure ....................................................................................... 3

Managing the c3000 enclosure ............................................................................................................ 5

Onboard Administrator..................................................................................................................... 5

Detecting component insertion and removal..................................................................................... 5

Identifying components ................................................................................................................. 6

Managing power and cooling ....................................................................................................... 6

Controlling components................................................................................................................. 6

User interfaces for Onboard Administrator ...................................................................................... 8

Security ....................................................................................................................................... 8

Role-based user accounts............................................................................................................... 8

Integrated Lights-Out 2 for c-Class server blades .................................................................................. 9

Insight Display ................................................................................................................................. 9

Onboard Administrator cabling ....................................................................................................... 10

Enclosure link cabling ..................................................................................................................... 11

Enclosure-based DVD ROM................................................................................................................. 12

Enclosure KVM Module ...................................................................................................................... 12

Interconnect options and infrastructure.................................................................................................. 13

Interconnect modules ...................................................................................................................... 15

Server blades ................................................................................................................................ 16

Storage and other option blades...................................................................................................... 16

Mezzanine cards ........................................................................................................................... 17

Virtual Connect .............................................................................................................................. 18

Fabric connectivity and port mapping............................................................................................... 18

c3000 bay-to- bay crosslinks ........................................................................................................... 21

Device bay crosslinks .................................................................................................................. 21

Interconnect bay crosslinks .......................................................................................................... 22

HP Thermal Logic technologies ............................................................................................................ 22

Active Cool fans ............................................................................................................................ 23

HP PARSEC architecture.................................................................................................................. 24

Parallel...................................................................................................................................... 24

Redundant and scalable .............................................................................................................. 25

Thermal Logic for the server blade.................................................................................................... 26

Power supplies and enclosure power subsystem................................................................................. 27

Pooled power configuration and power redundancy options ........................................................... 29

Dynamic Power Saver mode ........................................................................................................ 30

HP Power Regulator for ProLiant ................................................................................................... 31

Power Capping for each server blade........................................................................................... 31

Power meter .............................................................................................................................. 31

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Summary

Page 3 - Abstract; components, see the HP website at; Overview of HP BladeSystem c3000 Enclosure; the c7000 enclosure is available on the HP technology website at

Abstract The HP BladeSystem c3000 Enclosure is the next generation in an evolution of the entire rack- mounted infrastructure. The c3000 enclosure is designed for remote sites, small and medium-sized businesses, and data centers with special power and cooling constraints. This technology brief provi...

Page 4 - Active Cool fan kits for a maximum of six fans

Figure 2. HP BladeSystem c3000 Enclosure – rear view The HP BladeSystem c3000 Enclosure has redundant signal paths between servers and interconnect modules. 1 The NonStop signal midplane in the c3000 enclosure has no active components. The enclosure is available with a single-phase power subsystem t...

Page 5 - OA support; Managing the c3000 enclosure; remote administration, local diagnostics, and troubleshooting.; Onboard Administrator; Detecting component insertion and removal

Table 1. Components supported by HP BladeSystem c-Class enclosures Enclosure c3000 c7000 Model Rack (6U) or Tower Rack (10U) Blade orientation Horizontal (rack) Vertical (tower) Vertical Blades supported 8 HH , 4 FH, 6HH/1FH 16 HH, 8 FH Interconnect bays 4 8 Power supplies 6 at up to 1200 watts each...

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