Page 2 - Supplied accessories; SELF-DIAGNOSIS FUNCTION
– 2 – GeneralPower requirements Where purchased Power requirements Continental Europe and UK 220 – 230 V AC, 50/60 Hz U.S.A and Canada 120 V AC, 60 Hz Power consumption 18 W Dimensions (approx.) (w/h/d) incl.projecting parts and controls 430 × 107.5 × 287 mm (17 × 4 1 / 4 × 11 3 / 8 in) Mass (approx...
Page 3 - Items of Error History Mode Items and Contents; Selecting the Test Mode; ππππππ
– 3 – Items of Error History Mode Items and Contents Selecting the Test Mode Display Details of History E00 No error E01 Disc error. PTOC cannot be read (DISC ejected) E02 Disc error. UTOC error (DISC not ejected) E03 Loading error E04 Address cannot be read (Servo has deviated) Table of Error Codes...
Page 4 - LEAKAGE TEST; A battery-operated AC milliammeter. The Data Precision 245; Using an AC voltmeter to check AC leakage.; MODEL IDENTIFICATION
– 4 – SECTION 1 SERVICING NOTES SAFETY CHECK-OUT After correcting the original service problem, perform the follow-ing safety check before releasing the set to the customer:Check the antenna terminals, metal trim, “metallized” knobs,screws, and all other exposed metal parts for AC leakage.Check leak...
Page 5 - CAUTION
– 5 – Flexible Circuit Board Repairing • Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering. Notes o...
Page 6 - JIG FOR CHECKING BD BOARD WAVEFORM
– 6 – JIG FOR CHECKING BD BOARD WAVEFORM The special jig (J-2501-149-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to beperformed are shown as follows. GND : GroundI+3V : For measuring IOP (Check the deterioration of the optical pick-up laser)I...
Page 8 - Checks Prior to Parts Replacement and Adjustments; Measure if unsatisfactory:; Forced Reset
– 8 – Checks Prior to Parts Replacement and Adjustments Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent.Details of the procedures are described in “5 Electrical Adjustments”. • 0.9 mW power Specified value : 0.84 to 0.92 mW • 7.0 mW po...
Page 9 - Retry Cause Display Mode; Fig. 1 Reading the Test Mode Display
– 9 – [ ] Retry Cause Display Mode • In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tube. During playback, the “track mode” for obtaining track information will be set.This is useful for locating the faulty part of the unit. • T...
Page 11 - LOCATION OF CONTROLS; • Front view
– 11 – SECTION 2 GENERAL LOCATION OF CONTROLS • Front view 1 STANDBY indicator 2 1 / u (Power) button 3 TIMER switch 4 MEGA CONTROL button 5 MEGA CONTROL indicator 6 MUSIC SYNC button 7 SCROLL/CLOCK SET button 8 DISPLAY/CHAR button 9 Remote sensor 0 Fluoresent indicator tube !¡ MENU/NO button !™ ≠ A...
Page 14 - SECTION 3; • This set can be disassembled in the order shown below.
– 14 – CASE (4095269) Note: Follow the disassembly procedure in the numerical order given. SECTION 3 DISASSEMBLY • This set can be disassembled in the order shown below. CASE (4095269)(Page 14) FRONT PANEL SECTION(Page 15) MAIN BOARD(Page 15) MECHANISM SECITON (MDM-5A)(Page 16) BASE UNIT (MBU-5A), B...
Page 18 - PRECAUTIONS FOR USE OF TEST MODE; -1. Recording laser emission mode and operating buttons; SETTING THE TEST MODE; Nn; Procedure 2: While pressing the; EXITING THE TEST MODE
– 18 – SECTION 4 TEST MODE 1. PRECAUTIONS FOR USE OF TEST MODE • As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it.Even if the [ EJECT] button is pressed while the disc ...
Page 19 - SELECTING THE TEST MODE
– 19 – 5. SELECTING THE TEST MODE There are 31 types of test modes as shown below. The groups can be switched by rotating the [ AMS ] knob. After selecting the group to be used, press the [YES] button. After setting a certain group, rotating the [ AMS ] knob switches betw...
Page 21 - Each time the
– 21 – 6. FUNCTIONS OF OTHER BUTTONS 7. TEST MODE DISPLAYS Each time the [DISPLAY/CHAR] button is pressed, the display changes in the following order. 1. Mode displayDisplays “TEMP ADJUST”, “CPLAYMODE”, etc. 2. Error rate displayDisplays the error rate in the following way. C = ππππ AD = ππππ C = In...
Page 22 - MEANINGS OF OTHER DISPLAYS
– 22 – ·P REC –SYNC A.SPACE OVER B A- TRACK DISC DATE CLOCK When Off Contents Display When Lit During continuous playback (CLV: ON) Tracking servo OFF Recording mode ON CLV low speed mode ABCD adjustment completed Tracking offset cancel ON Tracking auto gain OK Focus auto gain OK Pit High reflection...
Page 23 - PARTS REPLACEMENT AND ADJUSTMENT; • Check and adjust the MDM and MBU as follows.
– 23 – SECTION 5 ELECTRICAL ADJUSTMENTS 1. PARTS REPLACEMENT AND ADJUSTMENT • Check and adjust the MDM and MBU as follows. The procedure changes according to the part replaced • Abbreviation OP : Optical pick-up OWH : Overwrite head • Temperature compensation offset check• Laser power check• Travers...
Page 24 - Optical pick-up flexible board
– 24 – 2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSINON To check the emission of the laser diode during adjustments, neverview directly from the top as this may lose your eye-sight. 3. PRECAUTIONS FOR USE OF OPTICAL PICK-UP (KMS-260A) As the laser diode in the optical pick-up is easily damaged by s...
Page 25 - CHECK PRIOR TO REPAIRS; -1. Temperature Compensation Offset Check; [ A M S ]
– 25 – 6. CHECK PRIOR TO REPAIRS These checks are performed before replacing parts according to“approximate specifications” to determine the faulty locations. Fordetails, refer to “Checks Prior to Parts Replacement and Adjust-ments” (See page 8). 6-1. Temperature Compensation Offset Check When perfo...
Page 26 - MO Error Rate Check
– 26 – 9. Press the [YES] button display “EFB = MO-P”. Then, the optical pick-up moves to the pit area automaticallyand servo is imposed. 10. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not rotate the [ AMS ] knob. (Traverse Waveform) 1...
Page 28 - TRAVERSE ADJUSTMENT
– 28 – 7. Then, rotate the [ AMS ] knob and display “LDPWR CHECK” (C02). 8. Press the [YES] button once and display “LD 0.9 mW $ ”. Check that the reading of the laser power meter become 0.85to 0.91 mW. 9. Press the [YES] button once more and display “LD 7.0 mW $ ”. Check that the read...
Page 29 - FOCUS BIAS ADJUSTMENT
– 29 – ± ≠ ± ≠ 8. Rotate the [ AMS ] knob so that the waveform of the oscilloscope becomes the specified value.(When the [ AMS ] knob is rotated, the of “EFB- ” changes and the waveform changes.) In this adjustment, waveform varies at intervals of approx. 2%. Adjust the w...
Page 30 - 5-1. CD Auto Gain Control Output Level Adjustment
– 30 – 13. ERROR RATE CHECK 13-1. CD Error Rate Check Checking Procedure :1. Load a check disc (MD) TDYS-1.2. Rotate the [ AMS ] knob and display “CPLAY MODE” (C30). 3. Press the [YES] button twice and display “CPLAY MID”. 4. The display changes to “C = AD = ”. 5. Check that the C1 err...
Page 31 - ADJUSTING POINTS AND CONNECTING POINTS
– 31 – 16. ADJUSTING POINTS AND CONNECTING POINTS [BD BOARD] (SIDE A) CN110 NOTE D101 I+3VIOP TERFVC GND IC171 IC121 IC101 IC192 CN101 Note: It is useful to use the jig. for checking the waveform. (Refer toServicing Notes on page 6.) [BD BOARD] (SIDE B)
Page 32 - IC PIN FUNCTION DESCRIPTION; SECTION 6; Pin Name
– 32 – 6-1. IC PIN FUNCTION DESCRIPTION SECTION 6 DIAGRAMS • BD BOARD IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP) Pin No. Pin Name I/O Function 1 I I I-V converted RF signal I input from the optical pick-up block detector 2 J I I-V converted RF signal J input from the optical pick-up block de...
Page 40 - BLOCK DIAGRAM – SERVO Section –
MDS-JB920 – 41 – – 42 – 6-2. BLOCK DIAGRAM – SERVO Section – F C B D A E I J J I B A CD E F DETECTOR 1 2 J I 4 5 6 7 A B CD 8 9 E F LD PD LASER DIODE ILCC PD OPTICAL PICK-UP (KMS-260A/J1N) AUTOMATIC POWER CONTROL Q162, 163 LASER ON SWITCH Q101 OVER WRITE HEAD DRIVE IC181, Q181, 182 HF MODULE SWITCH ...
Page 41 - BLOCK DIAGRAM – MAIN Section –
MDS-JB920 – 43 – – 44 – 6-3. BLOCK DIAGRAM – MAIN Section – 05 X200 45MHz LED DRIVE Q756 ROTARY ENCODER FL DRIVE Q781, 782 D756 STANDBY D758 MEGA CONTROL LED DRIVE Q758 72 74 A/D CONVERTER IC100 BUFFER IC101 11 15 16 10 ADDT ADDT DADT,BCK,LRCK INLP VREF VREFL R-CH R-CH R-CH BCK1 MCKI LRCK1 DPD 12 AO...
Page 42 - • Circuit Boards Location; Note on Printed Wiring Boards:; NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
– 45 – – 46 – • Circuit Boards Location AC board SW board BAT board MAIN board VOL board DISP board BD board PSW board HP board Note on Schematic Diagram:• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolyticsand tantalums. • All resistors ...
Page 43 - PRINTED WIRING BOARDS – BD Section –; See page 45 for Circuit Boards Location.; • Semiconductor
– 47 – – 48 – 6-5. PRINTED WIRING BOARDS – BD Section – • See page 45 for Circuit Boards Location. • Semiconductor Location Ref. No. Location D 1 0 1 A - 1 D 1 8 1 D - 3 D 1 8 3 D - 3 I C 1 0 3 B - 1 I C 1 7 1 D - 1 Q 1 0 2 B - 1 Q 1 0 3 B - 1 Q 1 0 4 B - 1 • Semiconductor Location Ref. No. Location...
Page 48 - See page 72 and 73 for IC Block Diagrams.
MDS-JB920 – 57 – – 58 – Note:• Voltages and waveforms are dc with respect to ground in playback mode.no mark : PB ∗ : Impossible to measure The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified. Les composants identifiés par u...
Page 50 - PRINTED WIRING BOARD – MAIN Board (side A) –
MDS-JB920 – 61 – – 62 – 6-11. PRINTED WIRING BOARD – MAIN Board (side A) – • See page 45 for Circuit Boards Location.
Page 51 - • Semiconductor Location
MDS-JB920 – 63 – – 64 – Ref. No. Location • Semiconductor Location D 1 0 0 J - 4 D 1 0 1 J - 4 D 1 0 2 I - 3 D 1 0 3 I - 3 D 4 0 0 F - 6 D 7 0 0 E - 9 D 7 0 1 E - 9 D 7 0 3 E - 5 D 7 0 4 E - 5 D 7 0 5 A - 3 D 7 0 6 B - 4 D 7 0 7 C - 3 D 7 0 8 C - 3 D 7 0 9 B - 4 D 7 1 0 B - 4 D 7 1 1 B - 4 D 7 1 2 B...
Page 52 - PRINTED WIRING BOARDS – PANEL Section –
MDS-JB920 – 65 – – 66 – 6-13. PRINTED WIRING BOARDS – PANEL Section – • See page 45 for Circuit Boards Location. US, CND US, CND (Page 63) (Page 64) (Page 63) (Page 64) (Page 66) (Page 65)
Page 53 - SCHEMATIC DIAGRAM – PANEL Section –; See page 54 for Waveforms.
MDS-JB920 – 67 – – 68 – 6-14. SCHEMATIC DIAGRAM – PANEL Section – • See page 54 for Waveforms. Note:• Voltages and waveforms are dc with respect to ground in playback mode.no mark : Stop (Page 60) (Page 56) (Page 60) (Page 55)
Page 56 - – MAIN Board –
– 72 – – MAIN Board – IC100 CXD8607N 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 INRP INRM REFI AVDD AVSS APD NU NU TEST1 LRCK1 BCK1 ADDT V35A VSS1 (LF) MCKI DPD VSS2(LF) INIT MODE SHIFT LATCH 256CK V35D VSS2 512CK BCK2 DADT LRCK2 56 55 54 53 52 51 50 49 48 47 46 45 44...
Page 59 - AEP
– 75 – SECTION 7 EXPLODED VIEWS Les composants identifiés par unemarque ! sont critiquens pour la sécurité.Ne les remplacer que par une pièceportant le numéro spécifié. T h e c o m p o n e n t s i d e n t i fi e d b ymark ! or dotted line with mark ! are critical for safety. Replace only with part n...
Page 63 - AC BAT BD
– 79 – SECTION 8 ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the parts list may be different from the parts speci-fied in the diagrams or the components usedon the set. • -XX and -X mean standardized parts, so they may have some difference from the originalone. • RESISTORS ...
Page 64 - BD
– 80 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark BD C168 1-163-038-00 CERAMIC CHIP 0.1uF 25V C169 1-125-822-21 TANTALUM 10uF 20% 10V C171 1-163-038-00 CERAMIC CHIP 0.1uF 25V C181 1-104-913-11 TANTAL. CHIP 100uF 20% 16V C183 1-163-038-00 CERAMIC CHIP 0.1uF 25V C184 1-1...
Page 65 - BD DISP HP
– 81 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark BD DISP HP R173 1-216-121-00 RES,CHIP 1M 5% 1/10W R175 1-216-065-00 RES,CHIP 4.7K 5% 1/10W R177 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R179 1-216-085-00 METAL CHIP 33K 5% 1/10W R180 1-216-073-00 METAL CHIP 10K 5% 1/10W R...
Page 66 - HP MAIN
– 82 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark HP MAIN C796 1-162-294-31 CERAMIC 0.001uF 10% 50V C797 1-164-159-11 CERAMIC 0.1uF 50V C798 1-164-159-11 CERAMIC 0.1uF 50V < CONNECTOR > * CN790 1-564-708-11 PIN, CONNECTOR (SMALL TYPE) 6P < IC > IC790 8-759-...
Page 67 - MAIN
– 83 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark MAIN C244 1-126-023-11 ELECT 100uF 20% 25V C245 1-126-023-11 ELECT 100uF 20% 25V C246 1-126-023-11 ELECT 100uF 20% 25V C247 1-136-154-00 FILM 0.012uF 5% 50V C248 1-136-154-00 FILM 0.012uF 5% 50V C249 1-136-154-00 FILM 0...
Page 70 - MAIN PSW SW
– 86 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R714 1-247-891-00 CARBON 330K 5% 1/4W R715 1-249-433-11 CARBON 22K 5% 1/4W R800 1-249-429-11 CARBON 10K 5% 1/4W R801 1-249-429-11 CARBON 10K 5% 1/4W R802 1-249-429-11 CARBON 10K 5% 1/4W R803 1-249-429-11 CARBON 10K 5% 1...
Page 71 - SW VOL
– 87 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark S603 1-771-264-11 SWITCH, PUSH (CHUCKING IN) S604 1-771-264-11 SWITCH, PUSH (PB POSITION) ************************************************************** * 1-669-997-11 VOL BOARD ********** < CAPACITOR > C765 1-162...
Page 72 - Sony Corporation; Home A&V Products Company
– 88 – MDS-JB920 Sony Corporation Home A&V Products Company 9-922-869-11 98E0572-1 Printed in Japan © 1998. 5 Published by Quality Assurance Dept. (Shibaura)
