Samsung DDR3 - Manuals - manualsarea.com

Page 2 - DDR3 SDRAM Component Ordering Information; K 4 B X X X X X X X - X X X X

October 2009 General Information DDR3 SDRAM 1. DDR3 SDRAM Component Ordering Information 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 04 : x 4 08 : x 8 16 : x16 3 : 4 Banks 4 : 8 Banks 5 : 16 Banks 3. DRAM Type 4. Density 5. Bit Organization 6. # of Internal Banks M ABCDEFGH ZHJM C LY 9. Package Type 8. Re...

Page 3 - DDR3 SDRAM Component Product Guide

October 2009 General Information DDR3 SDRAM 2. DDR3 SDRAM Component Product Guide * Note : 1.35V product is 1.5V operatable. Density Banks Part Number Package & Power, Temp. (-C/-L) & Speed Org. VDD Voltage PKG Avail. Note 1Gb D-die 8Banks K4B1G0446D HC(L)F7/F8/H9 256M x 4 1.5V 78 + 4 ball F...

Page 4 - DDR3 SDRAM Module Ordering Information; M X X X B X X X X X X X - X X X

October 2009 General Information DDR3 SDRAM 3 : DIMM 4 : SODIMM Z FBGA(Lead-free)H FBGA(Lead-free & Halogen-free)J FBGA(Lead-free, DDP)M FBGA(Lead-free & Halogen-free, DDP) 32 : 32M 33 : 32M (for 128Mb/512Mb) 64 : 64M 65 : 64M (for 128Mb/512Mb) 28 : 128M 29 : 128M (for 128Mb/512Mb) 56 : 256M...

Page 5 - DDR3 SDRAM Module Product Guide

October 2009 General Information DDR3 SDRAM 4. DDR3 SDRAM Module Product Guide 4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product ) 240Pin DDR3 Unbuffered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal Banks Rank PKG Height Avail. Note 128Mx 64 1GB M378B2873DZ1 CF8/H9 A(1...

Page 11 - Made in Korea; RDIMM RCD Information; Voltage; Inphi

October 2009 General Information DDR3 SDRAM 4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0 Made in Korea M393B5170EH1-CH9 0920 5. RDIMM RCD Information 5.1 RCD Identification in JEDEC Description in Module Label5.2 Label Example 5.3 RCD Information - Example Voltage Vendor Revision Module P/N JEDEC Descr...

Page 12 - Bottom

October 2009 General Information DDR3 SDRAM 78 + 4Ball FBGA for 1Gb D-die (x4/x8) 96 + 4Ball FBGA for 1Gb D-die (x16) ABCDEF G H M N 9.00 ± 0.10 0. 80 x 12 = 9. 60 0.80 x 10 = 8.00 4.00 0.80 4. 80 82 - ∅ 0.45 Solder ball 0.2 A B M (Datum B) (Datum A) 10 8 7 6 5 4 3 2 1 11 9 1.60 MOLDING AREA #A1 IND...

Page 14 - BOTTOM VIEW; TOP VIEW

October 2009 General Information DDR3 SDRAM 78Ball FBGA for 2Gb B-die (x4/x8) 96Ball FBGA for 2Gb B-die (x16) ABCDEF G H M N 9.00 ± 0.10 0. 80 x 12 = 9. 60 3.20 0.80 4. 80 78 - ∅ 0.45 Solder ball 0.2 A B M (Datum B) (Datum A) 1.60 MOLDING AREA #A1 INDEX MARK B A BOTTOM VIEW 11 .5 0 ± 0. 10 J K L 0. ...

Page 17 - Detail B

October 2009 General Information DDR3 SDRAM x64/x72 240pin DDR3 SDRAM Unbuffered DIMM 133.35 ± 0.15 Max 4.0 54.675 Units : Millimeters 9.50 128.95 (2) (4X) 3.00 ± 0.1 30.00 ± 0.1 5 2. 30 17.30 A B 47.00 71.00 2.50 1.00 0.2 ± 0.15 2.50 ± 0.20 Detail B 5.00 Detail A 1.50±0.10 0.80 ± 0.05 3.80 2x 2.10 ...

Page 20 - Registered DIMM Heat Spreader Design

October 2009 General Information DDR3 SDRAM 133.15 ± 0.2 4.65 ± 0 .12 2 130.45 ± 0.15 127 ± 0.12 23.6 ± 0. 15 25.6 ± 0.1 5 7.45 119.29 80.78 Green Line : TIM Attatch Line 0. 4 1 +0 / -0.3 0.65 ± 0.2 R0.2 R0 .1 1 25.6 ± 0. 15 0.151.3 1.3 2 2 ± 0. 1 2. 6 ± 0. 2 1. FRONT PART Reg. pedestal line Outside...

Page 21 - DDR3 RDIMM ASS’Y View

October 2009 General Information DDR3 SDRAM 19 ± 0 .1 39.3 ± 0.2 D 19 E (Clip open size) K text mark ’B’ or ’K’ punch press_stamp B A 39.3 ± 0.2 29.77 R1. 5 0.1 ~ 0.3 Upper Bending Tilting Gap 0.5 3. CLIP PART C 1.05 132.95 ± 133.45 1.27 4. DDR3 RDIMM ASS’Y View Reference thickness total (Maximum) :...