Asus 701SD Eee PC Celeron- Manuals

Service overview 1 - 5 LCD Case The illustration below shows the LCD case. Here is the LCD front cover, back cover. Keyboard The illustration below shows the keyboard plate. It can be exchanged with keyboard plates with different language layouts, such as U.S., France and others. Top Case Module The...

Service overview 1 - 8 Service Overview Please pay special attention to the cautions below to prevent any damages to the Eee PC 4G (701) and also please be sure to select the appropriate tools described in this section to perform any services desired. Precautions Before you perform any service and o...

Service overview 1 - 9 5. Always wear a ground strap on your hand to protect the Eee PC 4G (701) from static discharge. Appropriate Tools The illustrations below show the appropriate tools that should be used for the Eee PC 4G (701)’s service and repair. Phillips-head Screwdriver Use a Phillips-head...

Service overview 1 - 10 Disassembly Cautions Before you perform any service and or repair on the Eee PC 4G (701), please read the notice below first. ASUS hereby provides a basic instruction for the disassembly of ASUS products, i.e. to remove components and materials that require selective treatmen...

Disassembly procedure 2 - 1 Disassembly Procedure Please follow the information provided in this section to perform the complete disassembly procedure of the Eee PC 4G (701). Be sure to use proper tools described before. SUS Eee PC 4G (701)consists of various modules. This chapter describes the proc...

Disassembly procedure 2 - 2 Battery Module The illustration below shows how to remove the battery module. Remove battery module 1 ． Slide the battery lock to open it 2 ． Slide the battery latch and hold the battery to remove it from system. Memory Module The illustration shows how to remove the memo...

Disassembly procedure 2 - 3 2. Softly open the two latches to pop the memory module up at 45 degree angles and then remove the memory at that angle. Keyboard Module The illustration of below shows how to remove the keyboard Removing Keyboard 1. Turn over the NB and push the 3 latches (F1; F6;Pause) ...

Disassembly procedure 2 - 4 2. Place the keyboard plate on the top case and disconnect the keyboard FPC to remove. Removing Keyboard Cable 1. Use a flexible connector tool to unlock the cable connector on both ends (no. 1). 2. Carefully pull out the keyboard cable (no. 2) with a pair of tweezers. 3....

Disassembly procedure 2 - 6 4. Remove 1 piece of tape on the touch pad FPC then open the latch to disconnect it from touch pad board. 5. Remove 2 screws (M2*3) securing touch pad bracket and then remove the bracket. 6. Remove the touch pad board from the top case.

Disassembly procedure 2 - 7 WLAN Module The illustrations below show how to remove the WLAN module from the Eee PC 4G (701). Remove WLAN module 1. Remove 3 pieces of tape fixing the cable and then disconnect the following 4 cables, namely speaker cable, CMR cable, Fan cable, LVDS cable. 2. Remove 1 ...

Disassembly procedure 2 - 8 3. Lift the mother board from bottom case by softly separating from the bottom side, two sides to the top. * pay attention not to remove the mother board for now, for that the WLAN antenna is still connected with the mother board. 4 . Turn the LCD with its back cover on t...

Disassembly procedure 2 - 9 6. Remove 2 screws (M2*4) on the WLAN module to pop up the module at 30 degree angles and then remove it at that angle. Motherboard The illustrations below show how to disassemble and remove the Motherboard. Removing Motherboard 1. Tear off 2 pieces of tape fixing the Mod...

Disassembly procedure 2 - 11 LCD Module The illustrations below show how to remove and disassemble the LCD module. The module contains LCD panel, Inverter board, LCD bezel, LCD back cover. Disassembling LCD Module 1. Remove 8 rubber pads and screws (M2*4) on LCD front bezel. 2. Pry the four inner si...

Disassembly procedure 2 - 13 6. Disconnect the coaxial cable from inverter board. 7. Tear off 1 piece of tape fixing camera cable and take the camera cable off cable guide. 8. Remove the camera board from LCD back cover and then take the whole module away.

Assembly procedure 3 - 1 Assembly Procedure Please follow the information provided in this section to perform the complete assembly procedure of the Eee PC 4G (701). Be sure to use proper tools described before. fter you have completed the previous chapter of complete disassembly, please follow this...

Assembly procedure 3 - 3 3. Install the camera board on LCD back cover, pay attention to the aiming pole. 4. Connect the coaxial cable with inverter board. 5. Connect the inverter cable, LCD FPC cable with inverter board.

Assembly procedure 3 - 7 Wireless LAN Module The illustrations below show how to assemble and install the Wireless Lan Module of the Eee PC 4G (701). Installing Wireless LAN Module 1. Insert WLAN module into its slot at 30 degrees angles and press it down softly, then secure 2 screws (M2*4) on it. 2...

Assembly procedure 3 - 8 3.Install the mother board on bottom case, to install you should first install the top side,then softly pry the two sides to the ports ends fit the bottom case well, finally press the bottom side to lock the two latches. *make sure the antennas arrangeed through the hook at ...

Assembly procedure 3 - 10 Top case Module The illustrations below show how to assemble and install the top case module of the Eee PC 4G (701). 1. Install the touch pad board on top case. 2. Install the touch pad bracket and then secure 2 screws (M2*4) on it. T O P C A S E M O D U L E

Assembly procedure 3 - 12 6. Connect the touch pad FPC and then secure 9 screws (M2*4) on it. Assembling Keyboard The illustrations below show how to assemble and install the Keyboard of the Eee PC 4G (701). 1. Connect keyboard FPC with top case. K E Y B O A R D A S S E M B L Y K E Y B O A R D

Assembly procedure 3 - 13 2. Assemble the keyboard plate and press the 3 latches (F1; F6;Pause) in keyboard to lock it. Memory Module The illustrations below show how to install the external Memory Module of the Eee PC 4G (701). 1 . Insert Memory at the same 45 ° angles and press down until it click...

Assembly procedure 3 - 14 Battery Module The illustrations below show how to install battery module of the Eee PC 4G (701). Install battery module. 1. Slide the battery module into its compartment 2. Slide on the battery lock . B A T T E R Y M O D U L E

Upgrade & replacement 5 – 1 Upgrade & Replacement Follow the individual procedures in this chapter to perform the Eee PC 4G (701)’s upgrade and replacement of various major components. sus Eee PC 4G (701) is a 2 spindles product, which means there are less options for you to upgrade and repl...

Upgrade & replacement 4 - 2 Memory Upgrade Upgrading Memory Module Remove battery module 1 ． Slide the battery lock to open it 2 ． Slide the battery latch and hold the battery to remove it from system. Removing Memory module 1. Remove 2 screws (M2*4) on the Memory cover then remove it from the s...

Upgrade & replacement 4 - 3 2. Softly open the two latches to pop the Memory module up at 45 degree angles and then remove the Memory module at that angle. Installing Memory Module 1. Insert Memory at the same 45 ° angles and press down until it clicks into the latches. 2. Install the Memory cov...

Hardware Technical Specification 5-1 Hardware Specifications You can enjoy and utilize the Eee PC 4G (701) Notebook more effectively with a better comprehension of detailed hardware specifications of the notebook. his chapter lists the detailed specifications of the notebook’s main system and module...

Hardware Technical Specification 5-2 L IST OF F IGURES 1 MARKETING SPEC Eee PC 4G (701) Specification (One-Spindle Design) Product Family EEE PC 4G (701) CPU Type Intel Celeron-M-ULV Dothan Speed 900MHz(normal run 630MHz) Package FCBGA 479 Onboard L2 Cache Yes Size 512 KB On-die cache memory Memory ...

Hardware Technical Specification 5-7 2 CHIPSET LIST Chipset Summary Table Function EEE PC 4G (701) HW ACPI/PC99 CPU Intel Dothan Not required SRAM (L2 Cache) 512KB Not required North Bridge Intel 910GML/910GMLE YES South Bridge Intel ICH6-M YES MEMORY DDR II SDRAM Not required BIOS ROM SST/Winbond/M...

Hardware Technical Specification 5-8 2.1 CPU 2.2 CHIPSET 2.2.1 North Bridge Function: Full support 32bits AGTL+ host bus addressing Supports DDR2-400 device Integrates the graphic controller Support Intel Rapid Memory power management Enhanced Intel SpeedStep technology DMI x2/x4 Interface connect t...

Hardware Technical Specification 5-9 Vendor: Intel Parts Number: 910GML/910GMLE Package: 1257 -ball micro-FCBGA 2.2.2 South Bridge Function: DMI x2/x4 interface link with GMCH Integrated PC/AT compatible system (DMA Controller, INT, Timer/Counters) Integrated one channels IDE controller with Ultra D...

Hardware Technical Specification 5-10 2.3.2 EXPANSION MEMORY Number of sockets: Bus: Supply voltage: Functional features: Hardware features: One 200 pin SO-DIMM slot 64-bit data path 1.8V Supports up to 16 simultaneous open pages Supports DDR2 400 DDR devices Maximum of 2GB of system memory Parity s...

Hardware Technical Specification 5-11 2.6 KEYBOARD CONTROLLER Function features: Embedded controller-style host Support hardware speed-up of GateA20 and RC Local 18x8 keyboard switch matrix support Three industry standard serial keyboard interfaces All three ports are bi-directional Vendor: Parts Nu...

Hardware Technical Specification 5-13 3 KEY PARTS LIST Key Parts Summary: 3.1 Display WVGA Technology: Active color (TFT: Thin Film Transistor) Size: 7”W Resolution: WVGA (800 X 480) Dimension: 164mm(H) * 103mm(V) * 5.1mm(T) Pixel Pitch: 0.1905mm * 0.1905mm Display Colors: 16M Colors Vendor: AUO VGA...

Hardware Technical Specification 5-14 Vendor/Model Synaptics : SYNAPTICS/TM-01058-002 3.3 Keyboard Function Feature: Hardware Feature: Compatibility: Standard Notebook-Keyboard Simultaneously use of internal and external keyboard Easily to assemble or disassemble MS-Windows 2000/ XP Dimensions: Type...

Hardware Technical Specification 5-16 4 SYSTEM 4.1 System diagram 4.2 Main components block diagrams TBD

Hardware Technical Specification 5-17 4.3 System resource 4.3.1 IRQ Map IRQ# Description IRQ 0 System Timer IRQ 1 PS2 Keyboard IRQ 8 System CMOS/RTC IRQ 9 ACPI IRQ Holder IRQ12 PS2 TP IRQ13 Numeric data processor IRQ14 Master IDE Controller IRQ15 Primary IDE Controller IRQ16 PCIE Root Port IRQ16 USB...

Hardware Technical Specification 5-18 4.3.3 PCI INT Map N/A 4.3.4 PCI Bus Master Map N/A 4.3.5 IDSEL N/A

Hardware Technical Specification 5-19 5 I/O PORT PIN ASSIGNMENT No FUNCTION DESCRIPTION CRT Display (Analog) Flash module LCD KEYBOARD TOUCHPAD&LED 1 ST BATTERY .DC IN Adapter Input .AUDIO Headphone, Microphone-In .FAN .INVERTER .MDC .USB Universal Serial Bus LAN & Modem .Card Reader Univers...

Hardware Technical Specification 5-21 5.2 Flash module pin assignment Vendor Part No. Pin No. 52 Pin (DIP) Pin No. Pin No. Remark 1. IDE_DD0 2. IDE_DD15 3. IDE_DD1 4. GND 5. IDE_DD2 6. IDE_DD14 7. IDE_DD3 8. IDE_DD13 9. GND 10. IDE_DD12 11. IDE_DD4 12. IDE_DD11 13. IDE_DD5 14. IDE_DD10 15. GND 16. I...

Hardware Technical Specification 5-22 5.3 LCD pin assignment Vendor Part No. Pin No. I-PEXV WTOB_CON_20P 20 Pin (SMD) No. Signal Description Type 1 +3V_LCD P 2 LCD_CSB_D O 3 LCD_VSYNC O 4 LCD_SCL I/O 5 LCD_SDA I/O 6 LVDD_EN I 7 GND P 8 LA_DATAN0 I/O 9 LA_DATAP0 I/O 10 LA_DATAN1 I/O 11 LA_DATAP1 I/O ...

Hardware Technical Specification 5-23 5.4 Internal keyboard pin assignment Vendor Part No. Pin No. InnovACE FPC_CON_28P 28 Pin (SMD) No Signal Description Type 1 KSO0 O 2 KSI0 I 3 KSO1 O 4 KSO2 O 5 KSI1 I 6 KSO3 O 7 KSI2 I 8 KSO4 O 9 KSI3 I 10 KSO5 O 11 KSI4 I 12 KSI5 I 13 KSO6 O 14 KSI6 I 15 KSI7 I...

Hardware Technical Specification 5-24 28 NC_KSO16 O *** 5.5 Internal Touch Pad & LED Pin assignment Vendor Part No. Pin No. ENTERY FPC_CON_12P 12 Pin (SMD) No Signal Description Type 1 GND Ground P 2 TP_L P 3 TP_L P 4 +5V_TP Power I 5 +5V_TP Power I 6 TP_DATA Data I/O 7 TP_DATA Data I/O 8 TP_CLK...

Hardware Technical Specification 5-25 5.6 1 ST Battery pin assignment No Signal Description Type 1 BAT_IN# Power P 2 BAT I 3 BAT I 4 BAT_ID O 5 GND Ground P 6 BAT_TS O 7 BAT_CONFIG O 8 NC NC 9 GND Ground P 5.7 DC in Jack pin assignment Vendor Part No. Pin No. SINGATRON DC_PWR_JACK_3P 3Pin (DIP) No S...

Hardware Technical Specification 5-26 5.8 Audio Jack 5.8.1 Internal Speaker Jack Vendor Part No. Pin No. ACES WtoB_CON_4P 4 Pin (SMD) No Signal Description Type 1 INTSPKR- Internal speaker signal right channel negative O 2 INTSPKR+ Internal speaker signal right channel positive O 3 INTSPKL- Internal...

Hardware Technical Specification 5-27 5.8.3 Microphone Jack Vendor Part No. Pin No. SUYIN PHONE_JACK_6P 6 Pin (DIP) No Signal Description Type 1 GND_AUDIO Ground P 2 MIC1_JACK_L External microphone input I/O 3 MIC1_JACK_R External microphone input I/O 4 GND_AUDIO Ground P 5 MIC_SW# Control internal ...

Hardware Technical Specification 5-28 4 None None NC 5 GND Ground P 6 +3VAUX_MDC 3.3V power turned off during S4 P 7 ACZ_SYNC_MDC Azalia sync signal I 8 GND Ground P 9 ACZ_SDIN1_MD C Azalia data input signal O 10 GND Ground P 11 ACZ_RST#_MDC _R Azalia reset signal I 12 ACZ_BCLK_MDC Azalia bit clock ...

Hardware Technical Specification 5-30 5.13 Card Reader pin assignment Vendor Part No. Pin No. PANASONIC SD_SOCKET_9P 9 Pin (SMD) Pin No Signal Remark 1. UB_SD_DATA3 2. UB_SD_CMD 3 GND 4 +3V_SD 5 UB_SD_CLK 6 GND 7 UB_SD_DATA0 8 UB_SD_DATA1 9 UB_SD_DATA2

Hardware Technical Specification 5-31 6 POWER MANAGEMENT 6.1 System power plane Power Group Power Control Pin Controlled Devices +12V VSUS_ON Other Control +5V SUSB_ON LCD, Flash, Flash & Wlan LED, Fan, Camera, Codec, Audio, SB +3V SUSB_ON NB IO, SB, LCD, Card reader, Codec, Audio +1.8V_DUAL SUS...

Hardware Technical Specification 5-32 clock (SUSCLK) in this suspend mode to support refresh of these memory subsystems. Only an enabled “resume event” can bring the platform out of the suspend to RAM (STR) state. 6.2.5 Suspend to disk mode (STD) A suspend state where the context of the entire syste...

Hardware Technical Specification 5-33 6.3.1 Lid switch Display mode State Lid close Lid open Full on LCD OFF No action Stand by LCD OFF No action LCD STR/STD LCD OFF No action Full on No action No action Stand by No action No action CRT STR/STD No action No action Full on LCD OFF/CRT ON No action St...

Hardware Technical Specification 5-35 6.4.3 Device PM control during STD mode Device Power Down Controlled by Description Core Logic Hardware Power off (except Resume Well) EC Chip Hardware Power off VGA Chip Hardware Power off Onboard FLASH Hardware Power off PCMCIA Controller Hardware Power off Mo...

Hardware Technical Specification 5-36 7 MODULE SPECIFICATION 7.1 Overall System The notebook system consists of the following PCB assembly and modules. 7.1.1 Board assembly Processor Upgradeable CPU (FCBGA 479) Main Board Main System board Inverter Board LCD Module Back-light TOUCH PAD&AUDIO DJ ...

Hardware Technical Specification 5-37 7.3 Main board 7.3.1 Main system module spec Feature: CPU Celeron M, NB 910GML, SB ICH6M, Clock generator, SO-DIMM PC/AT compatible system (RTC, DMA, INT, Timer, … etc) IDE controller with PIO Mode 4 & Ultra-33/66/100, PCMCIA /Cardbus controller & their ...

Hardware Technical Specification 5-39 Charge current (4S2P) 2.4A 2.46A 2.6A Charge current (4S1P) 1.3A 1.4A 1.5A Ripple & Noise 100mV Efficiency 94% 7.4 Inverter Board Inverter spec Input Voltage: 9~11V Output Current: 160mA(max) Start Voltage: 12V(min) Efficiency: 86%(max) Brightness control du...

Hardware Technical Specification 5-40 7.5.3 Protection OVP: 24V(max) SCP: Yes OCP: 19V/5A(max) 7.6 Main Battery spec Battery pack capacity: Vendor Cells Voltage Capacity Watts Li-Ion 新力盛 4 7.4V 2600mAh Battery warning and low percentage (Li-Ion): Battery low = 7% Battery low low= 0% Gauge controller...

Hardware Technical Specification 5-41 7.8 Modem spec Part Number: ASUS RD01-D480 Controller: Conexant software modem Interface: AC-link Support Caller ID Support Ring wake up function ITU-T V.90 Data Mode with auto-fall back to K56flex and V.34 V.80 Video ready Modem Data speed: 56Kbps FAX transfer ...

Hardware Technical Specification 5-42 8 MISCELLANEOUS 8.1 Indicators Power LED Feature: Type: Color: Show System power status LED Yellow Indication: On: System in ON Mode Flash: System in SUSPEND Mode Off: System in OFF Mode Location: MB/TP BRD Charging LED Feature: Type: Color: Show Battery status ...

Hardware Technical Specification 5-43 8.2 Power cord list TBD Where Description Vendor US UK Japan Europe Austria South Asia 8.3 Safety/ EMI Appliance : Agency Approval EMC CE Mark (Europe) BSMI (Taiwan) EMI FCC Class B Certified (USA & Canada), VCCI (Japan) MIC, IDA Safety UL, CSA or CUL, NEMKO...

Software Specification 6-1 Software Specifications Get to know more about the Eee PC 4G (701) Notebook with a detailed look at the software specifications. h e i n f o r m a t i o n c o n t a i n e d i n t h e c h a p t e r c a n b e q u i t e u s e f u l w h e n y o u a r e troubleshooting the syst...

Software Specification 6-2 1. General Description The specification is a guideline for BIOS development on 701 platforms. Anyone who needed the system BIOS information can check this document for reference. The general device specification, hardware block diagram, SMBUS, GPIO definition and so on ar...

Software Specification 6-3 2. CPU, Chipsets & Main Devices Item Vendor Specification Part’s Name Revision CPU INTEL Dothan single core North Bridge INTEL 910GML South Bridge INTEL ICH6M VGA In ternal HD Controller Internal Audio Codec REALTEK ALC66 2 USB INTEL Lan Athros L2 Flash memory DDR2 Clo...

Software Specification 6-4 Main component block diagram:

Software Specification 6-5 3. Device resources 3.1 Subsystem and Sub vendor ID of PCI Devices Device Bus/Dev/ Func Function Vendor ID Device ID Sub-Vendor ID Sub-System ID INTEL 0,0,0 Host Bridge 0x8086 0x2590 0x1043 0x1882 0.2.0 VGA 0x8086 0x2592 0x1043 0x1882 0.31.2 IDE controller 0x8086 0x2653 0x...

Software Specification 6-6 4. Specified Function Tables The Specified Functions are controlled via General Purpose Pins of Chipsets, following tables are the definition of The Functions which controlled via the GPIO pins of South-Bridge (ICH6M). Table 4-1. SB ICH6M GPIO Definition GPIO# Definition I...

Software Specification 6-7 5. Setup Menu 701 system BIOS allows users to change some system hardware/function settings during POST (power on self test) stage, users may hit F2 key to enter SETUP mode in POST, the setup feature is categorized into 4 menus described as below. 5.1 Main Menu Main menu d...

Software Specification 6-8 5.2 Advanced Menu In advanced menu the users may configure IDE configuration, onboard devices and OS to install type settings may be changed as well. Detailed settings are described below. 1. IDE configuration: See 5.2.1 2. Onboard Devices Configuration: See 5.2.2 3. OS to...

Software Specification 6-9 5.2.1 IDE Configuration 1. IDE Master: See details. 2. IDE Slave: See details.

Software Specification 6-11 5.3 Security Menu 701 BIOS supports three kinds of password for security protection: 1. Supervisor Password: Users may set, change or erase system password, the password data is saved in non-volatile device (CMOS), system password check is done during POST(Power On Self T...

Software Specification 6-12 5.4 Boot Menu In this menu users can decide the boot sequence, as long as the device with highest boot priority exists, system BIOS will boot from it, device boot priority is adjusted by pressing “+”,”-“ or space key on the selected (highlighted) item. 3 bootable devices ...

Software Specification 6-13 5. 4 . 1 Boot Device Priority In this menu specifies the boot sequence from the available devices. User can change boot devices priority.

Software Specification 6-14 5. 4 . 2 Boot Settings Configuration 1. Quick Boot: [Enabled] decrease time when boot. 2 . Quiet Boot: [Disable]: Display normal POST messages. [Enable]: Displays OEM Logo instead of POST messages.

Software Specification 6-15 5.5 Exit Menu In Exit BIOS setup, users may make final decision if they want to save the change just made or load BIOS default setting. 1 Exit & Save Changes: Exit system setup after saving the changes. 2 Exit & Discard Changes: Exit system setup without saving an...

Software Specification 6-16 6. Device resources 701 uses ICH6M chipset as its power management core logic, the chipset supports most features the ACPI 2.0 interface specifies, for ACPI 2.0 compliant OS. The BIOS has below features implemented: (1). System sleep states : The system supports: (a). S0 ...

Software Specification 6-17 7 Embedded Controller (EC) 7.1 Hot Key Table 8.1.0 Fn Hot-Key definition Fn key Description Available Fn+F1 Suspend switch ACPI+A SUS010 Fn+F2 Wireless lan On/Off ACPI+ A SUS010 Fn+F 3 Brightness Down ACPI+ A SUS010 Fn+F 4 Brightness Up ACPI+ A SUS010 Fn+F 5 Display Devic...