Asus P8H61 USB3 R2.0- User Manual

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P8H61/USB3 R2.0

H61 with up to 170% faster USB 3.0

speeds and optimized network

bandwidth

• DIGI+ VRM - Digital Power Design for the CPU
• USB 3.0 Boost - Faster USB 3.0 Transmission with UASP mode
• Network iControl - Real-time Network Bandwidth Control
• AI Suite II - One-stop Access to Innovative ASUS Features
• Anti Surge - Full-time Power Guardian-Make System Free From Risk
•

Windows 8 Ready – Assured Compatibility

LGA1155 socket for Intel® 3rd/2nd Generation Core™ i7 /

Core™ i5 / Core™ i3 / Pentium® / Celeron® Processors

This motherboard supports the Intel® 3rd/2nd generation
Core™ i7/i5/i3/Pentium®/Celeron® processors in the LGA1155
package, with iGPU, memory, and PCI Express controllers
integrated to support onboard graphics out with dedicated
chipsets, 2-channel (2 DIMMs) DDR3 memory, and 16 PCI
Express 3.0/2.0 lanes. This provides great graphics performance. Intel® 3rd/2nd
generation Core™ i7/i5/i3/Pentium®/Celeron® processors are among the most
powerful and energy efficient CPUs in the world.

Intel® H61 Express Chipset

The Intel® H61 Express Chipset is a single-chipset design
to support the new 1155 socket Intel® 3rd/2nd Generation
Core™ i7 / Core™ i5 / Core™ i3 / Pentium® / Celeron®
processors. It provides improved performance by utilizing
serial point-to-point links, which allows increased bandwidth
and stability.

PCIe 3.0 Ready

PCI Express® 3.0 (PCIe 3.0) is the latest PCI Express
bus standard with improved encoding schemes that
provide twice the performance of current PCIe 2.0.
Total bandwidth for a x16 link reaches a maximum of
32GB/s, double the 16GB/s of PCIe 2.0 (in x16 mode). As such, PCIe 3.0
provides users unprecedented data speeds, combined with the convenience
and seamless transition offered by complete backward compatibility with PCIe
1.0 and PCIe 2.0 devices. PCIe 3.0 will become a must-have feature for users
who wish to improve and optimize graphic performance, as well as have the
latest technology available to them.

*PCIe 3.0 speed is supported by Intel® 3rd generation Core™ processors.

Dual-Channel DDR3 2200(O.C) / 2133(O.C) / 2000(O.C) / 1866

(O.C) / 1600 / 1066 / 1333 support

The motherboard supports DDR3 memory that features data transfer rates of
2200(O.C )/2133(O.C )/2000(O.C )/1866(O.C )/1600/1066/1333 suppor MHz to
meet the higher bandwidth requirements of the latest 3D graphics, multimedia,
and Internet applications. The dual-channel DDR3 architecture enlarges the
bandwidth of your system memory to boost system performance.

• DDR3 1600 MHz and higher memory frequency is supported by Intel® 3rd

generation processors.

• Due to the CPU behavior, DDR3 2133/1866 memory module will run at DDR3

2000/1800 MHz frequency

•

CPU, Chipset and Graphics Features

USB 3.0 Support

Experience ultra-fast data transfer at 4.8Gbps with USB 3.0 – the latest connectivity standard. Built to connect easily with next-generation
components and peripherals, USB 3.0 transfers data 10x faster and is also backward compatible with USB 2.0 components.

Intel® Smart Connect Technology, Intel® Rapid Start Technology

Intel® Smart Connect Technology:

Auto Application Refresh. Less Waiting Time. Your computer can receive web updates with fresh content for selected applications, even when the system is in
sleep mode. This means less time waiting for applications to update and sync with the cloud, leading to a more efficient computing experience.